• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2003년도 하계종합학술대회 논문집 II
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• pp.743-746
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• 2003

We have successfully used hydrophobic direct-wafer bonding, along with H-induced layer splitting of Ge, to transfer 700nm think, single-crystal Ge films to Si substrates. Optical and electrical properties have been also observed on these samples. Triple-junction solar cell structures gown on these Ge/Si heterostructure templates show comparable photoluminescence intensity and minority carrier lifetime to a control structure grown on bulk Ge. When heavily doped p$^{+}$Ge/p$^{+}$Si wafer bonded heterostructures were bonded, ohmic interfacial properties with less than 0.3Ω$\textrm{cm}^2$ specific resistance were observed indicating low loss thermal emission and tunneling processes over and through the potential barrier. Current-voltage (I-V) characteristics in p$^{+}$Ge/pSi structures show rectifying properties for room temperature bonded structures. After annealing at 40$0^{\circ}C$, the potential barrier was reduced and the barrier height no longer blocks current flow under bias. From these observations, interfacial atomic bonding structures of hydrophobically wafer bonded Ge/Si heterostructures are suggested.ested.

• 한국재료학회지
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• 제32권2호
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• pp.72-79
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• 2022

A cold roll-bonding process using AA1050, AA5052 and AA6061 alloy sheets is performed without lubrication. The roll-bonded specimen is a multi-layer complex aluminum alloy sheet in which the AA1050, AA5052 and AA6061 sheets are alternately stacked. The microstructural evolution with the increase of annealing temperature for the roll-bonded aluminum sheet is investigated in detail. The roll-bonded aluminum sheet shows a typical deformation structure in which the grains are elongated in the rolling direction over all regions. However, microstructural evolution of the annealed specimen is different depending on the type of material, resulting in a heterogeneous microstructure in the thickness direction of the layered aluminum sheet. Complete recrystallization occurs at 250 ℃ in the AA5052 region, which is lower by 100K than that of the AA1050 region. Variation of the misorientation angle distribution and texture development with increase of annealing temperature also differ depending on the type of material. Differences of microstructural evolution between aluminum alloys with increase of annealing temperature can be mainly explained in terms of amounts of impurities and initial grain size.

• 대한금속재료학회지
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• 제49권11호
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• pp.910-915
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• 2011

The microstructures and mechanical properties of roll-bonded STS439/Al1050/STS304 clad materials were investigated after an annealing process at various temperatures. Interfacial layer was developed at the STS439/Al1050 and Al1050/STS304 interfaces at $550^{\circ}C$. STS439/Al1050/STS304 clad metals fractured suddenly in a single step and the fracture decreased with increasing annealing temperatures at $450^{\circ}C$. After annealing at $550^{\circ}C$, samples fractured in three steps with each layer fracturing independently. Interfacial layers formed at $550^{\circ}C$ with a high Vickers microhardness were found to be brittle. During tensile testing, periodic parallel cracks were observed at the interfacial reaction layer. Observed micro-void between Al1050 and the interfacial layer was found to weaken the Al1050/reaction layer interface, leading to the total separation between Al1050 and the reaction layer.

• 한국공작기계학회:학술대회논문집
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• 한국공작기계학회 1998년도 춘계학술대회 논문집
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• pp.220-226
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• 1998

In this pater, a method of strength evaluation applying fracture mechanics in adhesively bonded joints of A1/A1 materials was investigated. Various adhesively bonded joints of double-cantilever beam with a interfacial crack in its adhesive layer were prepared for the fracture toughness test of comprehensive mixed mode conditions from nearly pure mode I to mode II. The experiment of fracture toughness was carried out under various mixed mode conditions with an interfacial crack and critical energy release rate, Gc by the experimental measurements of compliances was determined. From the results, fracture toughness on mixed mode with an interfacial crack is well characterized by strain energy release rate and a method of strength evaluation by the fracture toughness in adhesively bonded joints of A1/A1 materials was discussed.

• 한국주조공학회지
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• 제15권3호
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• pp.272-282
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• 1995

Iron-based metal matrix composites have been recently investigated for the use of inexpensive abrasion resistance material. This paper carried out to investigate the in-situ reaction effects on the microstructural characteristics and the formation mechanism of tungsten carbides in a white cast iron matrix. The specimens of Fe-3.2%C-2.8%Si alloy cast-bonded with tungsten wire were cast in the metal mold and isothermally heat treated at $950^{\circ}C$ up to 48 hours. The typical microstructure of heat treated specimens showed the reaction layer of WC at the interface of tungsten wire and the carbon depletion zone between the WC layer and the matrix. During the formation of WC layer, if the carbon supply is insufficient due to the decarburization of matrix or the isolation of matrix by cast-bonded W wires, the reaction layer develops coarse hexagonal crystalline WC. From the microstructural investigation, it was found that the volume of WC layer and the carbon depletion zone increased linearly with the isothermal heat treating time. This results supported that the formation rate of WC in the white cast iron matrix is controlled by the interfacial reaction with a constant reaction rate.

• Restorative Dentistry and Endodontics
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• 제28권6호
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• pp.491-497
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• 2003

The purpose of this study was to evaluate the correlation between hybrid layer thickness and bond strength using confocal laser scanning microscope and microtensile bond strength test of two adhesive systems. The dentin surface of human molars. sectioned to remove the enamel from the occlusal surface. Either Scotchbond Multi-Purpose(3M Dental Product, St. Paul, MN, U.S.A) or Clearfil SE Bond (Kuraray, Osaka, Japan) was bonded to the surface. and covered with resin-composite. The resin-bonded teeth were serially sliced perpendicular to the adhesive interface to measure the hybrid layer thickness by confocal laser scanning microscope. The specimen were trimmed to give a bonded cross-sectional surface area of $1\textrm{mm}^2$, then the micro-tensile bone test was performed at a cross head speed of 1.0 mm/min. All fractured surfaces were also observed by stereomicroscope. There was no significant differences in bond strengths the materials(p>0.05). However. the hybrid layers of three-step dentin adhesive system, SM, had significantly thicker than self-etching adhesive system. CS(p<0.05). Pearson's correlation coefficient showed no correlation between hybrid layer thickness and bond strengths(p>0.05). Bond strengths of dentin adhesive systems were not dependent on the thickness of hybrid layer.

• 대한치과기공학회지
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• 제32권4호
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• pp.297-305
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• 2010

Purpose: The purpose of this study was to observe the change of metal-mold reaction and surface roughness in titanium casting specimens for phosphate-silica alumina bonded investment with mold temperatures. Methods: The metal-phosphate silica alumina bonded mold interface reaction and surface roughness of titanium casting specimens according to mold temperatures were investigated. The Specimens were analysed by scanning electron microscopy and surface roughness tester. Results: The oxidation behavior indicated by the growth of oxide thickness. The titanium-oxide layer were consisted two layer of a porous external and a dense internal one. The reaction layer and surface roughness increased with increasing investment material temperature. Conclusion: In this work, The most suitable mold temperature in casting of pure titanium was $200^{\circ}C$.

• Structural Engineering and Mechanics
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• 제69권2호
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• pp.121-129
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• 2019

The present study investigates the propagation of shear waves in a composite structure comprised of imperfectly bonded piezoelectric layer with a micropolar half space. Piezoelectric layer is considered to be initially stressed. Micropolar theory of elasticity has been employed which is most suitable to explain the size effects on small length scale. The general dispersion equations for the existence of waves in the coupled structure are obtained analytically in the closed form. Some particular cases have been discussed and in one particular case the dispersion relation is in well agreement to the classical-Love wave equation. The effects of various parameters viz. initial stress, interfacial imperfection and micropolarity on the phase velocity are obtained for electrically open and mechanically free system. Numerical computations are carried out and results are depicted graphically to illustrate the utility of the problem. The phase velocity of the shear waves is found to be influenced by initial stress, interface imperfection and the presence of micropolarity in the elastic half space. The theoretical results obtained are useful for the design of high performance surface acoustic devices.

• Journal of the Korean Wood Science and Technology
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• 제45권6호
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• pp.787-796
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• 2017

A low dimensional stability and poor bending strength properties were main problems in particleboard manufacturing. The objective of this research was to evaluate the effect of mixed wood species and urea-formaldehyde (UF) or urea-melamine-formaldehyde (UMF) resins on the physical and mechanical properties of three-layer particleboards. The ratio of face/core/back layer was 1 : 2 : 1. The resin content of 12% for both UF resins and UMF resins (UF/MF = 70/30% w/w) was used. The results of this study showed that the utilization of S.mahagony shaving using both UF and UMF resins caused a decrease in the thickness swelling and water absorption of the boards. Thickness swellings of particleboard made of Sengon/Sengon/Sengon (SSS), Mahogany/Mahogany/Mahogany (MMM), Sengon/Mahogany/Sengon (SMS), and Mahogany/Sengon/Mahogany (MSM) were in the range of 23%, 12~16%, 14~16%, and 13~21%, respectively. The board bonded with UMF resin demonstrated better dimensional stability than that bonded with UF resin alone. Modulus of elasticity (MOE) and modulus of rupture (MOR) of particleboards made of S. mahagony shaving in the surface layer in both MMM and MSM boards were better than those of the SSS and SMS. MOE of MMM and MSM board was in the ranges of 24,000 to $26,000kg.cm^{-2}$ and 18,000 to $21,000kg.cm^{-2}$ respectively. Meanwhile, the MOR of board was in the ranges of 200 to $240kg.cm^{-2}$ and 190 to $228kg.cm^{-2}$, respectively.

• Structural Engineering and Mechanics
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• 제57권2호
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• pp.295-313
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• 2016

In this study, the three-dimensional finite element method is used to determine the stress intensity factor in Mode I and Mixed mode of a centered crack in an aluminum specimen repaired by a composite patch using contour integral. Various mesh densities were used to achieve convergence of the results. The effect of adhesive joint thickness, patch thickness, patch-specimen interface and layer sequence on the SIF was highlighted. The results obtained show that the patch-specimen contact surface is the best indicator of the deceleration of crack propagation, and hence of SIF reduction. Thus, the reduction in rigidity of the patch especially at adhesive layer-patch interface, allows the lowering of shear and normal stresses in the adhesive joint. The choice of the orientation of the adhesive layer-patch contact is important in the evolution of the shear and peel stresses. The patch will be more beneficial and effective while using the cross-layer on the contact surface.