• Title/Summary/Keyword: Bonded interface

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Brazing characteristics of $ZrO_2$ and Ti-6Al-4V brazed joints with increasing temperature (브레이징 온도 변화에 따른 $ZrO_2$와 Ti-6Al-4V의 접합 특성)

  • Kee, Se-Ho;Park, Sang-Yoon;Heo, Young-Ku;Jung, Jae-Pil;Kim, Won-Joong
    • The Journal of Korean Academy of Prosthodontics
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    • v.50 no.3
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    • pp.169-175
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    • 2012
  • Purpose: In this study, brazing characteristics of $ZrO_2$ and Ti-6Al-4V brazed joints with increasing temperature were investigated. Materials and methods: The sample size of the $ZrO_2$ was $3mm{\times}3mm{\times}3mm$ (thickness), and Ti-6Al-4V was $10mm(diameter){\times}5mm(thickness)$. The filler metal consisted of Ag-Cu-Sn-Ti was prepared in powder form. The brazing sample was heated in a vacuum furnace under $5{\times}10^{-6}$ torr atmosphere, while the brazing temperature was changed from 700 to $800^{\circ}C$ for 30 min. Results: The experimental results shows that brazed joint of $ZrO_2$ and Ti-6Al-4V occurred at $700-800^{\circ}C$. Brazed joint consisted of Ag-rich matrix and Cu-rich phase. A Cu-Ti intermetallic compounds and a Ti-Sn-Cu-Ag alloy were produced along the Ti-6Al-4V bonded interface. Thickness of the reacted layer along the Ti-6Al-4V bonded interface was increased with brazing temperature. Defect ratios of $ZrO_2$ and Ti-6Al-4V bonded interfaces decreased with brazing temperature. Conclusion: Thickness and defect ratio of brazed joints were decreased with increasing temperature. Zirconia was not wetting with filler metal, because the reaction between $ZrO_2$ and Ti did not occur enough.

Effects of Post-annealing and Temperature/Humidity Conditions on the Interfacial Adhesion Energies of ALD RuAlO Diffusion Barrier Layer for Cu Interconnects (후속열처리 및 고온고습 조건에 따른 Cu 배선 확산 방지층 적용을 위한 ALD RuAlO 박막의 계면접착에너지에 관한 연구)

  • Lee, Hyeonchul;Jeong, Minsu;Bae, Byung-Hyun;Cheon, Taehun;Kim, Soo-Hyun;Park, Young-Bae
    • Journal of the Microelectronics and Packaging Society
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    • v.23 no.2
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    • pp.49-55
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    • 2016
  • The effects of post-annealing and temperature/humidity conditions on the interfacial adhesion energies of atomic layer deposited RuAlO diffusion barrier layer for Cu interconnects were systematically investigated. The initial interfacial adhesion energy measured by four-point bending test was $7.60J/m^2$. The interfacial adhesion energy decreased to $5.65J/m^2$ after 500 hrs at $85^{\circ}C$/85% T/H condition, while it increased to $24.05J/m^2$ after annealing at $200^{\circ}C$ for 500 hrs. The X-ray photoemission spectroscopy (XPS) analysis showed that delaminated interface was RuAlO/$SiO_2$ for as-bonded and T/H conditions, while it was Cu/RuAlO for post-annealing condition. XPS O1s peak separation results revealed that the effective generation of strong Al-O-Si bonds between $AlO_x$ and $SiO_2$ interface at optimum post-annealing conditions is responsible for enhanced interfacial adhesion energies between RuAlO/$SiO_2$ interface, which would lead to good electrical and mechanical reliabilities of atomic layer deposited RuAlO diffusion barrier for advanced Cu interconnects.

Bond Strength of Wafer Stack Including Inorganic and Organic Thin Films (무기 및 유기 박막을 포함하는 웨이퍼 적층 구조의 본딩 결합력)

  • Kwon, Yongchai;Seok, Jongwon
    • Korean Chemical Engineering Research
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    • v.46 no.3
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    • pp.619-625
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    • 2008
  • The effects of thermal cycling on residual stresses in both inorganic passivation/insulating layer that is deposited by plasma enhanced chemical vapor deposition (PECVD) and organic thin film that is used as a bonding adhesive are evaluated by 4 point bending method and wafer curvature method. $SiO_2/SiN_x$ and BCB (Benzocyclobutene) are used as inorganic and organic layers, respectively. A model about the effect of thermal cycling on residual stress and bond strength (Strain energy release rate), $G_c$, at the interface between inorganic thin film and organic adhesive is developed. In thermal cycling experiments conducted between $25^{\circ}C$ and either $350^{\circ}C$ or $400^{\circ}C$, $G_c$ at the interface between BCB and PECVD $ SiN_x $ decreases after the first cycle. This trend in $G_c$ agreed well with the prediction based on our model that the increase in residual tensile stress within the $SiN_x$ layer after thermal cycling leads to the decrease in $G_c$. This result is compared with that obtained for the interface between BCB and PECVD $SiO_2$, where the relaxation in residual compressive stress within the $SiO_2$ induces an increase in $G_c$. These opposite trends in $G_cs$ of the structures including either PECVD $ SiN_x $ or PECVD $SiO_2$ are caused by reactions in the hydrogen-bonded chemical structure of the PECVD layers, followed by desorption of water.

Delamination Limit of Aluminum Foil-Laminated Sheet During Stretch Forming (등이축인장 모드 변형시 알루미늄 포일 접착강판의 박리한계 예측)

  • Lee, Chan-Joo;Son, Young-Ki;Lee, Jung-Min;Lee, Seon-Bong;Byun, Sang-Deog;Kim, Byung-Min
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.36 no.4
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    • pp.413-420
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    • 2012
  • An aluminum foil-laminated sheet is a laminated steel sheet on which aluminum foil is adhesively bonded. It is usually used on the outer panel of home appliances to provide an aluminum feeling and appearance on the surface of the product. The delamination of aluminum foil is one of the main problems during the stretch forming process. The purpose of this study is was to determine the delamination limit of an aluminum foil-laminated sheet in the stretch forming process. The delamination was dependent on the bonding strength between aluminum foil and steel sheet. The fracture behavior of the interface between the aluminum foil and the steel sheet was described by a cohesive zone model. A finite element was conducted with the cohesive zone model to analyze the relationship between the delamination limit and the bonding strength of the interface. The interface bonding strength was evaluated by lap shear and T-peel test. The delamination limit of the aluminum foil-laminated sheet was determined by using the bonding strength of the steel sheet. The delamination limit was also verified by the Erichsen test.

Fracture Behaviour Analysis of the Crack at the Specimen with the Type of Mode I Composed of the Bonded Carbon Fiber Reinforced Plastic (접합된 CFRP로 구성된 Mode I형 시험편 크랙의 파괴 거동 해석)

  • Lee, Jung-Ho;Cho, Jae-Ung;Cheon, Seong-Sik;Kook, Jeong Han
    • Composites Research
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    • v.28 no.6
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    • pp.356-360
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    • 2015
  • In this paper, the carbon fiber reinforced plastic is processed as the double cantilever beam in order to estimate the fracture behavior of composite and is carried out with the static analysis as the mode I. The specimen sizes are 25 mm, 30 mm, 35 mm and 40 mm. And the material property is used with carbon. As the analysis result of mode I, the adhesive part is detached latest by the small force at the specimen thickness of 25 mm. The largest force is happened at the specimen thickness of 40 mm. The defection of the adhesive interface is shown slowest at the displacement of 9.75 mm at the specimen thickness of 25 mm. And the defection is shown quickest at the displacement of 7.82 mm at the specimen thickness of 40 mm. This defection is due to the fracture of specimen. The result of this study on the defection of the adhesive interface and the reaction force due to this defection is thought to be contributed to the safe structural design of the carbon fiber reinforced plastic.

The Characteristics of the Wafer Bonding between InP Wafers and $\textrm{Si}_3\textrm{N}_4$/InP (Direct Wafer Bonding법에 의한 InP 기판과 $\textrm{Si}_3\textrm{N}_4$/InP의 접합특성)

  • Kim, Seon-Un;Sin, Dong-Seok;Lee, Jeong-Yong;Choe, In-Hun
    • Korean Journal of Materials Research
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    • v.8 no.10
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    • pp.890-897
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    • 1998
  • The direct wafer bonding between n-InP(001) wafer and the ${Si}_3N_4$(200 nm) film grown on the InP wafer by PECVD method was investigated. The surface states of InP wafer and ${Si}_3N_4$/InP which strongly depend upon the direct wafer bonding strength between them when they are brought into contact, were characterized by the contact angle measurement technique and atomic force microscopy. When InP wafer was etched by $50{\%}$ HF, contact angle was $5^{\circ}$ and RMS roughness was $1.54{\AA}$. When ${Si}_3N_4$ was etched by ammonia solution, RMS roughness was $3.11{\AA}$. The considerable amount of initial bonding strength between InP wafer and ${Si}_3N_4$/InP was observed when the two wafer was contacted after the etching process by $50{\%}$ HF and ammonia solution respectively. The bonded specimen was heat treated in $H^2$ or $N^2$, ambient at the temperature of $580^{\circ}C$-$680^{\circ}C$ for lhr. The bonding state was confirmed by SAT(Scannig Acoustic Tomography). The bonding strength was measured by shear force measurement of ${Si}_3N_4$/InP to InP wafer increased up to the same level of PECVD interface. The direct wafer bonding interface and ${Si}_3N_4$/InP PECVD interface were chracterized by TEM and AES.

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The Effect of Resin Base Surface Treatment on Shear Bond Strength in Indirect Bracket Bonding Technique (브라켓 간접부착술식시 레진베이스의 표면처리가 전단결합강도에 미치는 영향)

  • Yim, Byeong-Cheol;Hwang, Hyeon-Shik
    • The korean journal of orthodontics
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    • v.28 no.5 s.70
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    • pp.681-688
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    • 1998
  • The purpose of this study was to evaluate the effects of the surface treatments of resin bases in indirect bracket bonding technique by study of shear bond strengths and failure patterns. Ninety metal brackets were bonded to the stone models of specimens involving bovine lower incisor with light-cured adhesive(Light-Bond). After removal of brackets with the resin base from the stone models, the surfaces of resin bases in thirty brackets were treated with Plastic Conditioner and the surfaces of resin bases in another thirty brackets were treated with sandblaster and the remaining thirty brackets were served as controls. All brackets were transferred to the specimens and bonded using sealant. The shear bond strength was tested on universal testing machine, and failure pattern was assessed with the adhesive remnant index(ARI). The results were as follows: 1. Surface treatments of resin bases with Plastic Conditioner or sandblasting showed statistically higher shear bond strengths than no treatment group. 2. No significant difference in shear bond strength was found between Plastic Conditioner treatment and sandblasting treatment groups. 3. No significant difference in ARI scores was found among the three groups. 4. As the result of correlation analysis between shear bond strengths and hnl scores, failure at adhesive/bracket base interface tends to increase when the shear bond strength was high, but it was not significant statistically. The above results suggest that improvement of bond strength can be obtained by surface treatment of resin base in the indirect bonding technique.

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POLYMERIZATION SHRINKAGE, HYGROSCOPIC EXPANSION AND MICROLEAKAGE OF RESIN-BASED TEMPORARY FILLING MATERIALS (레진계 임시수복재의 중합수축, 수화팽창과 미세누출)

  • Cho, Nak-Yeon;Lee, In-Bog
    • Restorative Dentistry and Endodontics
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    • v.33 no.2
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    • pp.115-124
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    • 2008
  • The purpose of this study was to measure the polymerization shrinkage and hygroscopic expansion of resin-based temporary filling materials and to evaluate microleakage at the interface between the materials and cavity wall. Five resin-based temporary filing materials were investigated: Fermit (Vivadent), Quicks (Dentkist), Provifil (Promedica), Spacer (Vericom), Clip (Voco). Caviton (GC) was also included for comparison. Polymerization shrinkage of five resin-based temporary filling materials was measured using the bonded disc method. For the measurement of hygroscopic expansion, the discs of six cured temporary filling materials were immersed in saline and a LVDT displacement sensor was used to measure the expansion for 7 days. For estimating of microleakage, Class I cavities were prepared on 120 extracted human molars and randomly assigned to 6 groups of 20 each. The cavities in each group were filled with six temporary filling materials. All specimens were submitted to 1000 thermocycles, with temperature varying from $5^{\circ}C/55^{\circ}C$. Microleakage was determined using a dye penetration test. The results were as follows: 1. Fermit had significantly less polymerization shrinkage than the other resin-based temporary fill ing materials. Fermit (0.22%) < Spacer (0.38%) < Quicks (0.64%), Provifil (0.67%), Clip (0.67%) 2. Resin-based temporary filling materials showed 0.43-1.1% expansion in 7 days. 3. Fermit showed the greatest leakage, while Quicks exhibited the least leakage. 4. There are no correlation between polymerization shrinkage or hygroscopic expansion and microleakage of resin-based temporary filling materials.

CUSPAL DEFLECTION IN CLASS V CAVITIES RESTORED WITH COMPOSITE RESINS (5급 와동의 복합레진 수복 시 발생되는 교두굴곡에 관한 연구)

  • Park, Jun-Gyu;Lim, Bum-Soon;Lee, In-Bog
    • Restorative Dentistry and Endodontics
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    • v.33 no.2
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    • pp.83-89
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    • 2008
  • The purpose of this study was to evaluate the effect of the polymerization shrinkage and modulus of elasticity of composites on the cusp deflection of class V restoration in premolars. The sixteen extracted upper premolars were divided into 2 groups with similar size. The amounts of cuspal deflection were measured in Class V cavities restored with a flowable composite (Filtek flow) or a universal hybrid composite (Z-250). The bonded interfaces of the sectioned specimens were observed using a scanning electron microscopy (SEM). The polymerization shrinkage and modulus of elasticity of the composites were measured to find out the effect of physical properties of composite resins on the cuspal deflection. The results were as follows. 1. The amounts of cuspal deflection restored with Filtek flow or Z-250 were $2.18\;{\pm}\;0.92{\mu}m$ and $2.95\;{\pm}\;1.13\;{\mu}m$, respectively. Filtek flow showed less cuspal deflection but there was no statistically significant difference (p > 0.05). 2. The two specimens in each group showed gap at the inner portion of the cavity. 3. The polymerization shrinkages of Filtek flow and Z-250 were 4.41% and 2.23% respectively, and the flexural modulus of elasticity of cured Filtek flow (7.77 GPa) was much lower than that of Z-250 (17.43 GPa). 4. The cuspal deflection depends not only on the polymerization shrinkage but also on the modulus of elasticity of composites.

THE ADHESIVE PATTERNS OF COMPOMER TO SALIVA-CONTAMINATED DENTIN (타액에 오염된 상아질에 대한 콤포머의 접합양상)

  • Cho, Young-Gon;Kim, Byung-Tae;Lee, Suk-Jong
    • Restorative Dentistry and Endodontics
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    • v.25 no.4
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    • pp.575-586
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    • 2000
  • In this study, adaptation of compomer to saliva contaminated dentin was evaluated with scanning electron microscope(SEM) and confocal laser scanning microscope(CLSM). For the SEM study, the occulusal surfaces of thirty two molar teeth were grounded to exposure dentin surfaces. The specimen were randomly assigned to control and three experimental groups with four samples in each group. In control group, Dyract and F-2000 compomer were bonded on the specimens according to the manufactures direction. Experimental groups were subdivided into three groups. They were contaminated with saliva on dentin surfaces ; Experimental group 1 : Saliva was dried with compressed air. Experimental group 2 : Saliva was rinsed with air-water spray and dried. Experimental group 3 : After polymerization of an adhesive, they were contaminated with saliva, and then saliva was rinsed with air-water spray and dried. Dyract and F-2000 compomer were bonded on saliva-treated dentin surfaces. The interfaces between dentin and compomer were observed with SEM. For the CLSM study, Class V cavities were prepared in buccal and ligual surfacess of thirty two molars. The specimens were divided into control and experimental groups. Class V cavities in experimental group were contaminated with saliva and those surfaces in each experimental groups received the same treatments as for the SEM study. Cavities were applied Prime & Bond 2.1 and F-2000 compomer primer/adhesive that were mixed with fluorescein, and then were filled with Dyract and F-2000 compomer. Specimens were embedded in transparent acrylic resin and sectioned buccolingual1y with diamond wheel saw, and then mounted on cover slide for CLSM study. The interface between cavity and compomer was observed by fluoresence imaging with a CLSM. The results were as follows : 1. In SEM exammination of Dyract group, control group, experimental group 2, 3 showed close adaptation to dentin and hybrid layer of $3{\sim}4{\mu}m$ diameter. Interfacial gap between compomer and dentin in experimental group 1 was wider than in control group. 2. In SEM examination of F-2000 group, adaptation to dentin of control group was closer than Dytact control group, but hybrid-like layer was not observed. Interfacial gap between compomer and dentin in experimental group 1 was wider than in Dyract experimental group 1. 3. In dissolution specimens of Dyract and F-2000 group, resin tags penetrated through dentinal tubules in control group and experimental group 1 and 3, but the penetration of resin tag was irregular and partial in experimental group 1. 4. In CLSM exammination of Dyract and F-2000 group, adhesive patterns of control and experimental groups showed same as in SEM. This result suggests the treatment methods, rinsing & drying, repeating all adhesive procedures, will produce good effect on adaptation of compomer to dentin if the dentin surface or polymerized adhesive is contaminated by saliva.

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