• Advances in concrete construction
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• v.9 no.1
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• pp.43-54
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• 2020

This paper presents an innovative stress-function variational approach in formulating the interfacial shear and normal stresses in an externally bonded concrete joint using carbon fiber-reinforced plastic (CFRP) plies. The joint is subjected to surface traction loadings applied at both ends of the concrete substrate layer. By introducing two interfacial shear and normal stress functions on the CFRP-concrete interface, based on Euler-Bernoulli beam idea and static stress equations of equilibrium, the entire stress fields of the joint were determined. The complementary strain energy was minimized in order to solve the governing equation of the joint. This yields an ordinary differential equation from which the interfacial normal and shear stresses were proposed explicitly, satisfying all the multiple traction boundary conditions. Lamination theory for composite materials was also employed to obtain the interfacial stresses. The proposed approach was validated by the analytic models in the literature as well as through a comprehensive computational code generated by the authors. Furthermore, a numerical verification was carried out via the finite element software ABAQUS. In the end, a scaling analysis was conducted to analyze the interfacial stress field dependence of the joint upon effective issues using the devised code.

• Advances in materials Research
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• v.8 no.4
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• pp.295-311
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• 2019

In this study, a three-dimensional Finite Element Model has been developed to estimate the size of the weakened zone in a bi-material a ceramic bonded to metal. The calculations results were compared to those obtained using Scanning Electron Microscope (SEM). In the case of elastic-plastic behaviour of the structure, it has been shown that the simulation results are coherent with the experimental findings. This indicates that Finite Element modeling allows an accurate prediction and estimation of the weakening effect of residual stresses on the bonding interface of Alumina. The obtained results show us that the three-dimensional numerical simulation used by the Finite Element Method, allows a good prediction of the weakened zone extent of a ceramic, which is bonded with a metal.

• Structural Engineering and Mechanics
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• v.62 no.5
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• pp.595-606
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• 2017

During their life span, post-tensioned concrete structures may be exposed to thermal loads. Therefore, there has been a growing interest in research on the advanced analysis and design of post-tensioned concrete slabs subjected to thermal loads. This paper investigates the structural behaviour of post-tensioned one-way spanning concrete slabs. A nonlinear finite element model for the analysis of post- tensioned unbonded and bonded concrete slabs at elevated temperatures was developed. The interface between the tendon and surrounding concrete was also modelled, allowing the tendon to retain its profile shape during the deformation of the slab. The load-deflection behaviour, load-force behaviour in the tendon, and the failure modes are presented. The numerical analysis was conducted by the finite element ANSYS software and was carried out on two different one-way concrete slabs chosen from literature. A parametric study was conducted to investigate the effect of several selected parameters on the overall behavior of post-tensioned one-way concrete slab. These parameters include the effect of tendon bonding, the effect of thermal loading and the effect of tendon profile. Comparison between uniform thermal loading and nonuniform thermal loading showed that restrained post tensioned slab with bottom surface hotter has smaller failure load capacity.

• Journal of Welding and Joining
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• v.21 no.2
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• pp.82-88
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• 2003

The bonding phenomenon and mechanism in the transient liquid phase bonding(TLP Bonding) of directionally solidified Ni base superalloy, GTD-111 was investigated. At the bonding temperature of 1403K, liquid insert metal was eliminated by isothermal solidification which was controlled by the diffusion of B and Si into the base metal and solids in the bonded interlayer grew epitaxially from mating base metal inward the insert metal. The number of grain boundaries formed at the bonded interlayer was corresponded with those of base metal. The liquation of grain boundary and dendrite boundary occurred at 1433K. At the bonding temperature of 1453K which is higher than liquation temperature of grain boundary, liquids of the Insert metal were connected with liquated grain boundaries and compositions in each region mixed mutually. In Joints held for various time at 1453t phases formed at liquated grain boundary far from the interface were similar to those of bonded interlayer. With prolonged holding time, liquid phases decreased gradually and liquids of continuous band shape divided many island shape. But liquid phases did not disappeared after holding for 7.2ks at 1453k. Isothermal solidification process at the bonding temperature which is higher than the liquation temperature of the grain boundary was controlled by diffusion of Ti to be result in liquation than B or Si. in insert metal. (Received January 15, 2003)

• Proceedings of the KIEE Conference
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• 1995.11a
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• pp.348-351
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• 1995

A modified silicon direct bonding method has been developed alloying an intimate contact between grooved and smooth mirror-polished oxide-free silicon wafers. A regular set of grooves was formed during preparation of heavily doped $p^+$-type grid network by oxide-masking und boron diffusion. Void-free bonded interfaces with filing of the grooves were observed by x-ray diffraction topography, infrared, optical. and scanning electron microscope techniques. The presence of regularly formed grooves in bending plane results in the substantial decrease of dislocation over large areas near the interface. Moreover two strongly misoriented waters could be successfully bonded by new technique. Diodes with bonded a pn-junction yielded a value of the ideality factor n about 1.5 and the uniform distribution of series resistance over the whole area of horded pn-structure. The suitability of the modified technique was confirmed by I - V characteristics of power diodes and reversly switched-on dynistor(RSD) with a working area about $12cm^2$. Both devices demonstrated breakdown voltages close to the calculation values.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07a
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• pp.160-163
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• 2003

This paper describes on anodic bonding characteristics of MLCA(Multi Layer Ceramic Actuator) to Si-wafer using evaporated Pyrex #7740 glass thin-films for MEMS applications. Pyrex #7740 glass thin-films with same properties were deposited on MLCA under optimum RF magneto conditions(Ar 100 %, input power $1\;/cm^2$). After annealing in $450^{\circ}C$ for 1 hr, the anodic bonding of MLCA to Si-wafer was successfully performed at 600 V, $400^{\circ}C$ in - 760 mmHg. Then, the MLCA/Si bonded interface and fabricated Si diaphragm deflection characteristics were analyzed through the actuation test. It is possible to control with accurate deflection of Si diaphragm according to its geometries and its maximum non-linearity is 0.05-008 %FS. Moreover, any damages or separation of MICA/Si bonded interfaces do not occur during actuation test. Therefore, it is expected that anodic bonding technology of MICA/Si wafers could be usefully applied for the fabrication process of high-performance piezoelectric MEMS devices.

• Journal of the Korean Ceramic Society
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• v.40 no.10
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• pp.1015-1020
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• 2003

The Corrosion behavior of the matrix of the $\rho$-alumina bonded alumina vibrated castable was, on the basis of Jabsen's theory, elucidated by use of the Kingery's reaction mechanism. Corrosion of the matrix during induction period was controlled by the molecular diffusion. The temperature dependence of activation process is well established by the Arrhenius plots. The difference of Ca concentration between slag and interface is 23.2%, which causes a driving force of the materials transfer. The extent of the corrosion of the matrix is more deeper than that of the sintered mullite, but the corrosion mechanism can be well employed as the reaction mechanism proposed by the Kingery. The life time of the castable may be well estimated by the corrosion mechanism of Kingery.

• Steel and Composite Structures
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• v.11 no.6
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• pp.435-454
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• 2011

Bonding composite materials to structural members for strengthening purpose has received a considerable attention in recent years. The major problem when using bonded FRP or steel plates to strengthen existing structures is the high interfacial stresses that may be built up near the plate ends which lead to premature failure of the structure. As a result, many researchers have developed several analytical methods to predict the interface performance of bonded repairs. In this paper, a numerical solution using finite - difference method is used to calculate the interfacial stress distribution in beams strengthened with FRP plate having a tapered ends with different thinning profiles. These latter, can significantly reduce the stress concentration. In the present theoretical analysis, the adherend shear deformations are taken into account by assuming a parabolic shear stress through the thickness of both beam and bonded plate. Numerical results from the present analysis are presented to demonstrate the advantages of use the tapers in design of strengthened beams.

• Korean Journal of Materials Research
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• v.11 no.3
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• pp.159-163
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• 2001

The success of SDB (silicon wafer direct bonding) technology can be estabilished by bonding on the bonded interface with no defects and Preventing temperature dependent bubbles. In this research, we observed the behavior of the intrinsic bubbles by transmitting the infrared light and the increase of the bubble pressure was found. And, the $SiO_2$-$SiO_2$ bonded wafer was achieved, which generates no intrinsic bubbles in the annealing under the atmospheric pressure. The intrinsic bubbles in the $SiO_2$-$SiO_2$ bonded wafer were generated in the annealing in the ultra high vacuum. This experimental result shows the relation between the bubble growth and the pressure.

• Advances in materials Research
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• v.6 no.4
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• pp.317-328
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• 2017

In this paper, an improved theoretical solution for interfacial stress analysis is presented for simply supported concrete beam bonded with a sandwich FGM plate. Interfacial stress analysis is presented for simply supported concrete beam bonded with a sandwich plate. This improved solution is intended for application to beams made of all kinds of materials bonded with a thin plate, while all existing solutions have been developed focusing on the strengthening of reinforced concrete beams, which allowed the omission of certain terms. It is shown that both the normal and shear stresses at the interface are influenced by the material and geometry parameters of the composite beam. A numerical parametric study was performed for different simulated cases to assess the effect of several parameters. Numerical comparisons between the existing solutions and the present new solution enable a clear appreciation of the effects of various parameters. The results of this study indicated that the FGM sandwich panel strengthening systems are effective in enhancing flexural behavior of the strengthened RC beams.