• Journal of Adhesion and Interface
• /
• v.7 no.4
• /
• pp.13-17
• /
• 2006

The elasto-plastic finite element method (FEM) was used to investigate the effect of off-center recessing location (8 mm length) on the stress distribution in the lap zone of adhesively bonded aluminium double lap joint. The results from simulation showed that the effect of off-cent recessing in bondline of double lap joint in the mid-bondline is not evidently to stress distribution in mid-bondline but the peak stresses both in mid-bondline and in the interface near the adherend side of the joint may increase markedly when an 8 mm length recessing was arranged symmetrical to the point of x =18 mm. When shifting an 8 mm length recess from near left end to the right end of the lap zone, all the highest peak stresses in the mid-bondline occurred under the condition of recess arranged symmetrical to the point of x = 6 mm.

• Proceedings of the KSME Conference
• /
• 2003.11a
• /
• pp.1039-1044
• /
• 2003

Adhesive-bonded joints are widely used in the industry. Recently aircraft applications of adhesive bonding joints have been increased extensively in automobile and air industry. Because adhesives which are available for structural applications have been developed a lot and understanding of adhesive bonding has been improved so much. In this study, as the fundamental research of design of adhesive bonding joints, this study considers specimen shape are affect strength and durability of Al/Polymer lap joints. In this research, cross head speed difference were concerned to evaluate their effects on the adhesive strength. Cross head speed makes a change 0.05mm/min, 0.5mm/min, 5mm/min. The result is load-displacement diagram showed brittleness fracture tendency. Fracture tendency that is shown enough on stress distribution of trigonal single lap joint and trigonal edged single lap joint occur the inside of adhesive.

• Journal of Welding and Joining
• /
• v.31 no.3
• /
• pp.4-10
• /
• 2013

In electronic industry, the trend of future electronics will be flexible, bendable, wearable electronics. Until now, there is few study on bonding technology and reliability of bonding joint between chip with micro solder bump and flexible substrate. In this study, we investigated joint properties of Si chip with eutectic Sn-58Bi solder bump on Cu pillar bump bonded on flexible substrate finished with ENIG by flip chip process. After flip chip bonding, we observed microstructure of bump joint by SEM and then evaluated properties of bump joint by die shear test, thermal shock test, and bending test. After thermal shock test, we observed that crack initiated between $Cu_6Sn_5IMC$ and Sn-Bi solder and then propagated within Sn-Bi solder and/or interface between IMC and solder. On the other hands, We observed that fracture propated at interface between Ni3Sn4 IMC and solder and/or in solder matrix after bending test.

• Proceedings of the KSME Conference
• /
• 2004.11a
• /
• pp.196-201
• /
• 2004

Adhesive joints have been widely used for fastening thin adherends because they can distribute the load over a larger area than mechanical joints, require no hole, add very little weight to the structure and have superior fatigue resistance. However, the fatigue characteristics of adhesive joints are much affected by applied pressure during curing operation because actual curing temperature is changed by applied pressure and the adhesion characteristics of adhesives are very sensitive to manufacturing conditions. In this study, cure monitoring and torsional fatigue tests of adhesive joints with an epoxy adhesive were performed in order to investigate the effects of the applied pressure during curing operation. From the experiments, it was found that the actual curing temperature increased as the applied pressure increased, which increased residual thermal stress in the adhesive layer. Therefore, the fatigue life decreased as the applied pressure increased because the mean stress during fatigue tests increased due to the residual thermal stress.

• Composites Research
• /
• v.25 no.1
• /
• pp.14-18
• /
• 2012

The structural adhesives have the advantage of improving automobile performances and are being applied to joining light weight materials like aluminium and composite. In order to characterize the impact behavior of structural adhesive, instrumented impact tests were performed with respect to pin-ring adhesively bonded joint specimens. Also dynamic FE analysis was carried out using LS-DYNA to compare the results with experiments.

• Composites Research
• /
• v.32 no.1
• /
• pp.37-44
• /
• 2019

The reinforcement effect of micro-bolt for a bonded scarf joint was investigated. Three scarf ratios of 1/10, 1/20, and 1/30 were considered to examine the effect of scarf patch configuration on joint strength. To maintain the same density of micro-bolt, 16, 32, and 48 bolts were installed in the scarf joint specimens with scarf ratios of 1/10, 1/20, and 1/30, respectively. Tests were also carried out on the joints that are bonded with only adhesive and that are fastened with only micro-bolts to obtain reference values. The average failure loads of the adhesive joints with scarf ratios of 1/10, 1/20, and 1/30 were 29.7, 39.6, and 44.8 kN, respectively. In case of micro-bolt reinforcement, the failure loads at the same scarf ratios were 28.4, 37.2, and 40.1 kN, respectively, which corresponds to 96, 94, and 90% of the pure adhesive joint failure loads. In the case of using only micro-bolts, the failure loads were only 13-25% of the average failure loads of pure adhesive joints. Fatigue test was also conducted for the joints with scarf ratio of 1/10. The results show that the fatigue strength of hybrid joints using both adhesive and microbolts together slightly increased compared to the fatigue strength of adhesive joint, but the rate of increase was small to 2-3%. Through this study, it was confirmed that the reinforcement effect of micro-bolt is negligible in the scarf joints where shear stress is dominating the failure, unlike in the structure where peel stress is dominant.

• Proceedings of the Korean Institute of Building Construction Conference
• /
• 2017.05a
• /
• pp.234-235
• /
• 2017

The bonding of the asphalt-based waterproof sheet is carried out in such a manner that the sheet and the sheet are adhered together and the lower adhesive layer of one sheet is adhered to the upper film layer of the other sheet, and the asphalt layer and the PE or HDPE film layer are bonded. When the joints are formed in the form of junctions between heterogeneous materials and exposed to the concrete joint movements and other deteriorating factors, the integrity of the joints can deteriorate and problems such as lifting and peeling off of the joints can occur. Therefore, this study was carried out to prevent unstable joint adhesion of the asphalt compound and film layer and to prevent defects in the adhesion between self - adhesive waterproof sheets. The self-adhesive waterproof sheet of this study can maximize bond stability by inducing bond between asphalt compounds during sheet-to-sheet bonding, thereby improving bonding strength.

• Proceedings of the KWS Conference
• /
• 2005.06a
• /
• pp.25-27
• /
• 2005

Sn-9Zn solder balls were bonded to Cu and ENIG (Electroless Nickel/Immersion Gold) pads, and the effect of aging on their joint reliability was investigated. The interfacial products were different from the general reaction layer formed in a Sn-base solder. The intermetallic compounds formed in the solder/Cu joint were $Cu_{5}Zn_{8}$ and $Cu_{6}Sn_{5}$. After aging treatment, voids formed irregularly at the bottom side of the solder because of Sn diffusion into the $Cu_{5}Zn_{8}$ IMC. In the case of the solder/ENIG joint, $AuZn_{3}$ IMCs were formed at the interface. In the case of the Sn-9Zn/ENIG, the shear strength remained nearly constant in spite of aging for 1000 hours at $150^{\circ}C$. On the other hand, in the case of the Sn-9Zn/Cu, the shear strength significantly decreased after aging at $150^{\circ}C$ for 100hours and then remained constant by further prolonged aging. Therefore, the protective plating layer such as ENIG must be used to ensure the mechanical reliability of the Sn-9Zn/Cu joint.

• Smart Structures and Systems
• /
• v.22 no.4
• /
• pp.459-468
• /
• 2018

In this paper, the effect of non-persistent joints was determined on the behavior of concrete specimens subjected to biaxial loading through numerical modeling using particle flow code in two dimensions (PFC2D). Firstly, a numerical model was calibrated by uniaxial, Brazilian and triaxial experimental results to ensure the conformity of the simulated numerical model's response. Secondly, sixteen rectangular models with dimension of 100 mm by 100 mm were developed. Each model contains two non-persistent joints with lengths of 40 mm and 20 mm, respectively. The angularity of the larger joint changes from $30^{\circ}$ to $90^{\circ}$. In each configuration, the small joint angularity changes from $0^{\circ}$ to $90^{\circ}$ in $30^{\circ}$ increments. All of the models were under confining stress of 1 MPa. By using of the biaxial test configuration, the failure process was visually observed. Discrete element simulations demonstrated that macro shear fractures in models are because of microscopic tensile breakage of a large number of bonded discs. The failure pattern in Rock Bridge is mostly affected by joint overlapping whereas the biaxial strength is closely related to the failure pattern.

• Journal of Welding and Joining
• /
• v.21 no.3
• /
• pp.78-84
• /
• 2003

The changes of microstructure and hardness of TLP bonds of directionally solidified Ni base superalloy, GTD-111, with variation of homogenizing and aging treatment were investigated. The specimens were bonded at 1403K for 7.2ks using different insert metals such as MBF-50, MBF-80 and MBF-90 and they were homogenized at 1393K with various holding time. At center of bonded interlayer homogenized for hold time 30h, the contents of aluminum and titanium were approximately 90% and 95% of base metal, respectively. In this study, aging was performed at three different kinds : one step aging ; 1113K $\times$ 16h, two step aging ; 1113K $\times$ 10h ⇒ 1103K $\times$ 10h, three step aging ; 1113K $\times$ 10h ⇒ 1103K $\times$ 8h ⇒ 922K $\times$ 24h. ${\gamma}$' volume fraction and hardness of joints were high in the sequence of one step, two step and three step aging, whereas ${\gamma}$' volume fraction and hardness of joints obtained by three step aging treatment were higher than those of raw material. Tensile properties of joints bonded with MBF-80 and MBF-90, homogenized at 1393K for 30h and then three step aged became excellent than those of raw material, however, joint bonded with MBF-50 was poor.