• 대한치과교정학회지
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• 제48권4호
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• pp.245-252
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• 2018

Objective: We aimed to perform in-vitro evaluation to compare 1) shear bond strength (SBS), adhesive remnant index (ARI), and color change between self-etched and acid-etched primers; 2) the SBS, ARI and color change between direct and indirect bonding; and 3) the enamel roughness (ER) between 12-blade bur and aluminum oxide polisher debonding methods. Methods: Seventy bovine incisors were distributed in seven groups: control (no bonding), direct (DTBX), and 5 indirect bonding (ITBX, IZ350, ISONDHI, ISEP, and ITBXp). Transbond XT Primer was used in the DTBX, ITBX, and ITBXp groups, flow resin Z350 in the IZ350 group, Sondhi in the ISONDHI group, and SEP primer in the ISEP group. SBS, ARI, and ER were evaluated. The adhesive remnant was removed using a low-speed tungsten bur in all groups except the ITBXp, in which an aluminum oxide polisher was used. After coffee staining, color evaluations were performed using a spectrophotometer immediately after staining and prior to bonding. Results: ISONDHI and ISEP showed significantly lower SBS (p < 0.01). DTBX had a greater number of teeth with all the adhesive on the enamel (70%), compared with the indirect bonding groups (0-30%). The ER in the ITBX and ITBXp groups was found to be greater because of both clean-up techniques used. Conclusions: Direct and indirect bonding have similar results and all the primers used show satisfactory adhesion strength. Use of burs and polishers increases the ER, but polishers ensure greater integrity of the initial roughness. Resin tags do not change the color of the teeth.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
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• pp.398-398
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• 2013

The electronic properties and the local structure of tantalum oxide thin film with variation of oxygen flow rate ranging from 9.5 to 16 sccm (standard cubic centimeters per minute) have been investigated by X-ray photoelectron spectroscopy (XPS), Reflection Electron Energy Loss Spectroscopy (REELS), and X-ray absorption spectroscopy (XAS). The XPS results show that the Ta4f spectrum for all films consist of the strong spin-orbit doublet $Ta4f_{7/2}$ and $Ta4f_{5/2}$ with splitting of 1.9 eV. The oxygen flow rate of the film results in the appearance of new features in the Ta4f at binding energies of 23.2 eV, 24.4 eV, 25.8, and 27.3 eV, these peaks attribute to $Ta^{1+}$, $Ta^{2+}$, $Ta^{4+}$/$Ta^{2+}$, and $Ta^{5+}$, respectively. Thus, the presence of non-stoichiometric state from tantalum oxide ($TaO_x$) thin films could be generated by the oxygen vacancies. The REELS spectra suggest the decrease of band gap for tantalum oxide thin films with increasing the oxygen flow rate. The absorption coefficient ${\mu}$ and its fine structure were extracted from the fluorescence mode of extended X-ray absorption fine structure (EXAFS) spectra. In addition, bond distances (r), coordination numbers (N) and Debye-Waller factors (${\sigma}^2$) each film were determined by a detailed of EXAFS data analysis. EXAFS spectrapresent both the increase of coordination number of the first Ta-O shell and a considerable reduction of the Ta-O bond distance with the increase of oxygen flow rate.

• Journal of Electrochemical Science and Technology
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• 제11권3호
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• pp.291-309
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• 2020

Chromium was electrodeposited from deep eutectic solvents-based Cr³⁺ electrolytes on HB-pencil graphite electrode. Factors influencing the electrochemical behavior and the processes of Cr nucleation and growth were explored using cyclic voltammetry and chronoamperometry techniques, respectively. Cr³⁺ reduction was found to occur through an irreversible diffusion-controlled step followed by another irreversible one of impure diffusional behaviour. The reduction behavior was found to be greatly affected by Cr³⁺ concentration, temperature, and type of hydrogen bond donor used in deep eutectic solvents (DESs) preparation. A more comprehensive model was suggested and successfully applied to extract a consistent data relevant to Cr nucleation kinetics from the experimental current density transients. The potential, the temperature, and the hydrogen bond donor type were estimated to be critical factors controlling Cr nucleation. The nucleation and growth processes of Cr from either choline chloride/ethylene glycol (EG-DES) or choline chloride/urea (U-DES) deep eutectic solvents were evaluated at 70℃ to be three-dimensional (3D) instantaneous and diffusion-controlled, respectively. However, the kinetics of Cr nucleation from EG-DES was found to be faster than that from U-DES. Cr nucleation was tending to be instantaneous at higher temperature, potential, and Cr³⁺ concentration. Cr nuclei electrodeposited from EG-DES were characterized at different conditions using scanning electron microscope (SEM). SEM images show that high number density of fine spherical nuclei of almost same sizes was nearly obtained at higher temperature and more negative potential. Energy dispersive spectroscopy (EDS) analysis confirms that Cr deposits were obtained.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2000년도 Proceedings of 5th International Joint Symposium on Microeletronics and Packaging
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• pp.43-55
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• 2000

In traditional electronic packages the die and the substrate are interconnected with fine wire. Wire bonding technology is limited to bond pads around the peripheral of the die. As the demand for I/O increases, there will be limitations with wire bonding technology. Flip chip technology eliminates the need for wire bonding by redistributing the bond pads over the entire surface of the die. Instead of wires, the die is attached to the substrate utilizing a direct solder connection. Although several steps and processes are eliminated when utilizing flip chip technology, there are several new problems that must be overcome. The main issue is the mismatch in the coefficient of thermal expansion (CTE) of the silicon die and the substrate. This mismatch will cause premature solder Joint failure. This issue can be compensated for by the use of an underfill material between the die and the substrate. Underfill helps to extend the working life of the device by providing environmental protection and structural integrity. Flux residues may interfere with the flow of underfill encapsulants causing gross solder voids and premature failure of the solder connection. Furthermore, flux residues may chemically react with the underfill polymer causing a change in its mechanical and thermal properties. As flip chip packages decrease in size, cleaning becomes more challenging. While package size continues to decrease, the total number of 1/0 continue to increase. As the I/O increases, the array density of the package increases and as the array density increases, the pitch decreases. If the pitch is decreasing, the standoff is also decreasing. This paper will present the keys to successful flip chip cleaning processes. Process parameters such as time, temperature, solvency, and impingement energy required for successful cleaning will be addressed. Flip chip packages will be cleaned and subjected to JEDEC level 3 testing, followed by accelerated stress testing. The devices will then be analyzed using acoustic microscopy and the results and conclusions reported.

• 한국결정성장학회지
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• 제5권2호
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• pp.189-196
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• 1995

중성자 회절에 의해 고순도 $TeO_2$ 유리의 단범위 구조를 조사하였다. $Te{\cdot}O$의 결합길이$d_{Te-O}$)와 산소원자를 둘러싼 Te 원자의 배위수($N_{Te-O}$)를 결정하기 위해 고해상도 RDF 곡선의 $Q_{max}$ = 20, 23, 25, 28, 30의 첫 번째 peak를, pairdistribution함수 모두 Gaussian 형식을 따른다는 가정하에 least-squae법으로 peak 분리를 했다. 이 결과를 토대로, 고순도$TeO_2$유리는 하나의 Te 원 자에 4개의 산소가 배위되어 있는$TeO_4$의 단위구조로 이루어져 있으며, 각 2개의 산소원자는 평균 결합길이가 각각 1.916 $\AA$과 2.123 $\AA$으로 Te 원자에 결합하고 있는 것으로 밝혀졌다.

• Restorative Dentistry and Endodontics
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• 제14권1호
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• pp.179-188
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• 1989

The purpose of this study was to measure Micro vicker's hardness of 4 kinds of anterior Composite resins (Pyrofil light bond anterior, Lite-fil anterior, Photo clear fil anterior, Silux) and 6 kinds of posterior Composite resin (Pyrofil light bond posterior. Lite-fil posterior, Photo clear fil posterior, Occlusin posterior, Palfique light posterior, P-30, posterior) according to deference of depth and distance of light tip from surface of composite resin. Each composite resin was filled into Teflon tube of 5mm in diameter and 5mm in depth, celluloid matrix was covered and the light in accordance with each composite resin was irradiated in distance of zero millimeter and 1 cm from light tip to surface of composite resin for 30 seconds. Specimens were sectioned longitudinally with cutting device. Microvicker's hardness measurements ware made at the depth of surface, 1mm, 2mm, 3mm, 4mm and 5mm from the surface to deep portion. Vicker's hardness numbers were taken on each depth under 200gm load for 30 seconds with MVK-E. The following results were: 1. The highest hardness value was measured at 1 mm depth. Then the deeper the depth, the lesser the hardness was observed. 2. The hardness value of anterior composite resins is lower than one of posterior composite resins. 3. Hardness number of composite resin irradiated in distance of zero millimeter from surface of composite resin was higher than one of 1 cm from surface of composite resin. 4. The pattern of hardness change at varying depth was similar to all the experimental material with no relation to distance of light from specimen.

• 공업화학
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• 제10권3호
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• pp.354-361
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• 1999

티타늄을 물리증착시킨 후 열처리한 막과 플라즈마에 의해 무정형 실리콘을 증착시킨 후 열처리한 막은 양질의 결정성을 갖는 Si가 풍부한 티타늄 실리사이드가 형성되고, 열처리 과정에서 에피택시 성장을 위한 격자들의 회전에 의해 다양한 형태의 격자구조를 갖는다. 티타늄 실리사이드 막의 band gap은 플라즈마에 의해 a-Si:H막을 증착시킨 후 열처리한 막이 수소의 탈착에 의해 제공된 dangling bond, a-Si 등의 영향을 받아 1.14~1.165 eV의 값을 가진다. 물리증착하여 열처리한 막의 Urbach tail인 $E_0$는 0.045~0.05 eV 범위로 거의 일정하고, 플라즈마에 의해 a-Si:H 막을 증착시킨 후 열처리한 막의 결함수는 Ti/Si를 열처리했을 때 얻어진 결함수보다 약 2~3 배 정도 많은 것으로 나타났다.

• 한국도로학회논문집
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• 제15권2호
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• pp.47-55
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• 2013

PURPOSES : This study aimed to evaluate the feasibility of AASHTO86 design method for Bonded Concrete Overlay. METHODS : The Feasibility of AASHTO86 design method for Bonded Concrete Overlay is investigated based on the following study : i) Sensitivity analysis of designed service life of Bonded Concrete Overlay by major design input for AASHTO86 guide. ii) Comparison of actual Bonded Concrete Overlay life and predicted Bonded Concrete Overlay life by AASHTO86. iii) Finding the stress component influence the potential distress of Bonded Concrete Overlay based on 3-d FEM analysis. iv) Exploring the limitation of AASHTO86 in the aspect of design input. RESULTS : Sensitivity analysis showed that the condition of existing pavement significantly on the Bonded Concrete Overlay life. Also the overlay thickness affect the Bonded Concrete Overlay life. The comparison of actual Bonded Concrete Overlay life and predicted Bonded Concrete Overlay life showed relatively good agreement when the early distress sections are excluded in comparison. Bonding stress occurred at the interface may be larger than the bond strength used in the specification of Bonded Concrete Overlay construction. CONCLUSIONS : Bonded Concrete Overlay life predicted by the AASHTO86 may not be reliable. Number of points to improve the reliability in the design of Bonded Concrete Overlay are suggested in this study.

• Structural Engineering and Mechanics
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• 제16권4호
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• pp.493-517
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• 2003

Attempts at improving beam-column joint performance has resulted in non-conventional ways of reinforcement such as the use of the crossed inclined bars in the joint area. Despite the wide accumulation of test data, the influence of the crossed inclined bars on the shear strength of the cyclically loaded exterior beam-column joints has not yet been quantified and incorporated into code recommendations. In this study, the investigation of joints has been pursued on two different fronts. In the first approach, the parameters that influence the behaviour of the cyclically loaded beam-column joints are investigated. Several parametric studies are carried out to explore the shear resisting mechanisms of cyclically loaded beam-column joints using an experimental database consisting of a large number of joint tests. In the second approach, the mechanical behaviour of joints is investigated and the equations for the principal tensile strain and the average shear stress are derived from joint mechanics. It is apparent that the predictions of these two approaches agree well with each other. A design equation that predicts the shear strength of the cyclically loaded exterior beam-column joints is proposed. The design equation proposed has three major differences from the previously suggested design equations. First, the influence of the bond conditions on the joint shear strength is considered. Second, the equation takes the influence of the shear transfer mechanisms of the crossed inclined bars into account and, third, the equation is applicable on joints with high concrete cylinder strength. The proposed equation is compared with the predictions of the other design equations. It is apparent that the proposed design equation predicts the joint shear strength accurately and is an improvement on the existing code recommendations.

• 한국구조물진단유지관리공학회 논문집
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• 제16권3호
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• pp.99-108
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• 2012

본 연구에서는 철근콘크리트 슬래브의 내부식성과 경량화를 도모하기 위하여 GFRP bar를 휨보강근으로 사용하는 경량골재콘크리트 슬래브를 고려하고 이 구조물에 대하여 기초적인 거동을 조사하였다. 경량콘크리트의 압축강도 및 인장강도 그리고 콘크리트 파괴에너지 측정, 일련의 슬래브 휨실험, 비선형유한요소해석을 통한 수치해석, 휨실험과 수치해석의 결과비교 등이 행하여졌다. 그 결과, GFRP bar를 휨보강근으로 사용한 경량콘크리트 슬래브는 기준시험체로 사용된 동일 규격의 철근콘크리트 슬래브에 비하여 무게를 28%정도 감소시킬 수 있었지만 파괴하중은 36%정도 감소되었다. 이는 GFRP bar의 낮은 축강성과 경량콘크리트의 낮은 부착강도 때문인 것으로 판단된다. 그리고 경량콘크리트의 부착력 감소 특성을 고려하기 위하여 GFRP bar와 콘크리트 경계면 사이에 계면요소를 사용한 수치해석 결과는 계면요소의 사용이 실험결과에 더 근접해갈 수 있는 방법임을 보여주었다.