• The korean journal of orthodontics
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• v.48 no.4
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• pp.245-252
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• 2018

Objective: We aimed to perform in-vitro evaluation to compare 1) shear bond strength (SBS), adhesive remnant index (ARI), and color change between self-etched and acid-etched primers; 2) the SBS, ARI and color change between direct and indirect bonding; and 3) the enamel roughness (ER) between 12-blade bur and aluminum oxide polisher debonding methods. Methods: Seventy bovine incisors were distributed in seven groups: control (no bonding), direct (DTBX), and 5 indirect bonding (ITBX, IZ350, ISONDHI, ISEP, and ITBXp). Transbond XT Primer was used in the DTBX, ITBX, and ITBXp groups, flow resin Z350 in the IZ350 group, Sondhi in the ISONDHI group, and SEP primer in the ISEP group. SBS, ARI, and ER were evaluated. The adhesive remnant was removed using a low-speed tungsten bur in all groups except the ITBXp, in which an aluminum oxide polisher was used. After coffee staining, color evaluations were performed using a spectrophotometer immediately after staining and prior to bonding. Results: ISONDHI and ISEP showed significantly lower SBS (p < 0.01). DTBX had a greater number of teeth with all the adhesive on the enamel (70%), compared with the indirect bonding groups (0-30%). The ER in the ITBX and ITBXp groups was found to be greater because of both clean-up techniques used. Conclusions: Direct and indirect bonding have similar results and all the primers used show satisfactory adhesion strength. Use of burs and polishers increases the ER, but polishers ensure greater integrity of the initial roughness. Resin tags do not change the color of the teeth.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.398-398
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• 2013

The electronic properties and the local structure of tantalum oxide thin film with variation of oxygen flow rate ranging from 9.5 to 16 sccm (standard cubic centimeters per minute) have been investigated by X-ray photoelectron spectroscopy (XPS), Reflection Electron Energy Loss Spectroscopy (REELS), and X-ray absorption spectroscopy (XAS). The XPS results show that the Ta4f spectrum for all films consist of the strong spin-orbit doublet $Ta4f_{7/2}$ and $Ta4f_{5/2}$ with splitting of 1.9 eV. The oxygen flow rate of the film results in the appearance of new features in the Ta4f at binding energies of 23.2 eV, 24.4 eV, 25.8, and 27.3 eV, these peaks attribute to $Ta^{1+}$, $Ta^{2+}$, $Ta^{4+}$/$Ta^{2+}$, and $Ta^{5+}$, respectively. Thus, the presence of non-stoichiometric state from tantalum oxide ($TaO_x$) thin films could be generated by the oxygen vacancies. The REELS spectra suggest the decrease of band gap for tantalum oxide thin films with increasing the oxygen flow rate. The absorption coefficient ${\mu}$ and its fine structure were extracted from the fluorescence mode of extended X-ray absorption fine structure (EXAFS) spectra. In addition, bond distances (r), coordination numbers (N) and Debye-Waller factors (${\sigma}^2$) each film were determined by a detailed of EXAFS data analysis. EXAFS spectrapresent both the increase of coordination number of the first Ta-O shell and a considerable reduction of the Ta-O bond distance with the increase of oxygen flow rate.

• Journal of Electrochemical Science and Technology
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• v.11 no.3
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• pp.291-309
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• 2020

Chromium was electrodeposited from deep eutectic solvents-based Cr³⁺ electrolytes on HB-pencil graphite electrode. Factors influencing the electrochemical behavior and the processes of Cr nucleation and growth were explored using cyclic voltammetry and chronoamperometry techniques, respectively. Cr³⁺ reduction was found to occur through an irreversible diffusion-controlled step followed by another irreversible one of impure diffusional behaviour. The reduction behavior was found to be greatly affected by Cr³⁺ concentration, temperature, and type of hydrogen bond donor used in deep eutectic solvents (DESs) preparation. A more comprehensive model was suggested and successfully applied to extract a consistent data relevant to Cr nucleation kinetics from the experimental current density transients. The potential, the temperature, and the hydrogen bond donor type were estimated to be critical factors controlling Cr nucleation. The nucleation and growth processes of Cr from either choline chloride/ethylene glycol (EG-DES) or choline chloride/urea (U-DES) deep eutectic solvents were evaluated at 70℃ to be three-dimensional (3D) instantaneous and diffusion-controlled, respectively. However, the kinetics of Cr nucleation from EG-DES was found to be faster than that from U-DES. Cr nucleation was tending to be instantaneous at higher temperature, potential, and Cr³⁺ concentration. Cr nuclei electrodeposited from EG-DES were characterized at different conditions using scanning electron microscope (SEM). SEM images show that high number density of fine spherical nuclei of almost same sizes was nearly obtained at higher temperature and more negative potential. Energy dispersive spectroscopy (EDS) analysis confirms that Cr deposits were obtained.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.43-55
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• 2000

In traditional electronic packages the die and the substrate are interconnected with fine wire. Wire bonding technology is limited to bond pads around the peripheral of the die. As the demand for I/O increases, there will be limitations with wire bonding technology. Flip chip technology eliminates the need for wire bonding by redistributing the bond pads over the entire surface of the die. Instead of wires, the die is attached to the substrate utilizing a direct solder connection. Although several steps and processes are eliminated when utilizing flip chip technology, there are several new problems that must be overcome. The main issue is the mismatch in the coefficient of thermal expansion (CTE) of the silicon die and the substrate. This mismatch will cause premature solder Joint failure. This issue can be compensated for by the use of an underfill material between the die and the substrate. Underfill helps to extend the working life of the device by providing environmental protection and structural integrity. Flux residues may interfere with the flow of underfill encapsulants causing gross solder voids and premature failure of the solder connection. Furthermore, flux residues may chemically react with the underfill polymer causing a change in its mechanical and thermal properties. As flip chip packages decrease in size, cleaning becomes more challenging. While package size continues to decrease, the total number of 1/0 continue to increase. As the I/O increases, the array density of the package increases and as the array density increases, the pitch decreases. If the pitch is decreasing, the standoff is also decreasing. This paper will present the keys to successful flip chip cleaning processes. Process parameters such as time, temperature, solvency, and impingement energy required for successful cleaning will be addressed. Flip chip packages will be cleaned and subjected to JEDEC level 3 testing, followed by accelerated stress testing. The devices will then be analyzed using acoustic microscopy and the results and conclusions reported.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.5 no.2
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• pp.189-196
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• 1995

Abstract The short range structure of pure $TeO_2$ glass was studied by neutron diffraction. In order to decide the values of $Te{\cdot}O$ bond length ($d_{Te-O}$) and the coordination number $(N_{Te-O})$ of oxygen atoms surrounding a Te atom, the first peak of the $Q_{max}$ = 20, 23, 25, 28 and 30 in the highly resolved RDF curves was deconvoluted by the least - squares method under the assumption that both of the pair distribution functions have a Gaussian form On the basis of these results, it is found that pure $TeO_2$ glass consists of $TeO_4$ structural units, in which Te atoms are coordinated by four oxygens and each two oxygen atoms are bonded to a Te atom with the average bond length of 1.916 $\AA$ and 2.123 $\AA$, respectively.

• Restorative Dentistry and Endodontics
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• v.14 no.1
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• pp.179-188
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• 1989

The purpose of this study was to measure Micro vicker's hardness of 4 kinds of anterior Composite resins (Pyrofil light bond anterior, Lite-fil anterior, Photo clear fil anterior, Silux) and 6 kinds of posterior Composite resin (Pyrofil light bond posterior. Lite-fil posterior, Photo clear fil posterior, Occlusin posterior, Palfique light posterior, P-30, posterior) according to deference of depth and distance of light tip from surface of composite resin. Each composite resin was filled into Teflon tube of 5mm in diameter and 5mm in depth, celluloid matrix was covered and the light in accordance with each composite resin was irradiated in distance of zero millimeter and 1 cm from light tip to surface of composite resin for 30 seconds. Specimens were sectioned longitudinally with cutting device. Microvicker's hardness measurements ware made at the depth of surface, 1mm, 2mm, 3mm, 4mm and 5mm from the surface to deep portion. Vicker's hardness numbers were taken on each depth under 200gm load for 30 seconds with MVK-E. The following results were: 1. The highest hardness value was measured at 1 mm depth. Then the deeper the depth, the lesser the hardness was observed. 2. The hardness value of anterior composite resins is lower than one of posterior composite resins. 3. Hardness number of composite resin irradiated in distance of zero millimeter from surface of composite resin was higher than one of 1 cm from surface of composite resin. 4. The pattern of hardness change at varying depth was similar to all the experimental material with no relation to distance of light from specimen.

• Applied Chemistry for Engineering
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• v.10 no.3
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• pp.354-361
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• 1999

The films annealed after physical deposition of titanium and chemical deposition of amorphous silicon by plasma were formed Si-rich titanium silicide with a good quality of crystallinity and had the various lattice structures due to orientation of lattices for epitaxy growth during annealing process. Band gap of the titanium silicide had 1.14~1.165 eV and the films annealed after chemical deposition of a-Si:H by plasma were influenced by a-Si and the dangling bond offered by desorption of hydrogen. Urbach tail ($E_0$) of the films annealed after physical deposition of Ti was nearly constant within a range of 0.045~0.05 eV, and the number of defect in films annealed after chemical deposition of a-Si:H by plasma was about 2~3 times more than that in annealed Ti/Si films.

• International Journal of Highway Engineering
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• v.15 no.2
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• pp.47-55
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• 2013

PURPOSES : This study aimed to evaluate the feasibility of AASHTO86 design method for Bonded Concrete Overlay. METHODS : The Feasibility of AASHTO86 design method for Bonded Concrete Overlay is investigated based on the following study : i) Sensitivity analysis of designed service life of Bonded Concrete Overlay by major design input for AASHTO86 guide. ii) Comparison of actual Bonded Concrete Overlay life and predicted Bonded Concrete Overlay life by AASHTO86. iii) Finding the stress component influence the potential distress of Bonded Concrete Overlay based on 3-d FEM analysis. iv) Exploring the limitation of AASHTO86 in the aspect of design input. RESULTS : Sensitivity analysis showed that the condition of existing pavement significantly on the Bonded Concrete Overlay life. Also the overlay thickness affect the Bonded Concrete Overlay life. The comparison of actual Bonded Concrete Overlay life and predicted Bonded Concrete Overlay life showed relatively good agreement when the early distress sections are excluded in comparison. Bonding stress occurred at the interface may be larger than the bond strength used in the specification of Bonded Concrete Overlay construction. CONCLUSIONS : Bonded Concrete Overlay life predicted by the AASHTO86 may not be reliable. Number of points to improve the reliability in the design of Bonded Concrete Overlay are suggested in this study.

• Structural Engineering and Mechanics
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• v.16 no.4
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• pp.493-517
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• 2003

Attempts at improving beam-column joint performance has resulted in non-conventional ways of reinforcement such as the use of the crossed inclined bars in the joint area. Despite the wide accumulation of test data, the influence of the crossed inclined bars on the shear strength of the cyclically loaded exterior beam-column joints has not yet been quantified and incorporated into code recommendations. In this study, the investigation of joints has been pursued on two different fronts. In the first approach, the parameters that influence the behaviour of the cyclically loaded beam-column joints are investigated. Several parametric studies are carried out to explore the shear resisting mechanisms of cyclically loaded beam-column joints using an experimental database consisting of a large number of joint tests. In the second approach, the mechanical behaviour of joints is investigated and the equations for the principal tensile strain and the average shear stress are derived from joint mechanics. It is apparent that the predictions of these two approaches agree well with each other. A design equation that predicts the shear strength of the cyclically loaded exterior beam-column joints is proposed. The design equation proposed has three major differences from the previously suggested design equations. First, the influence of the bond conditions on the joint shear strength is considered. Second, the equation takes the influence of the shear transfer mechanisms of the crossed inclined bars into account and, third, the equation is applicable on joints with high concrete cylinder strength. The proposed equation is compared with the predictions of the other design equations. It is apparent that the proposed design equation predicts the joint shear strength accurately and is an improvement on the existing code recommendations.

• Journal of the Korea institute for structural maintenance and inspection
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• v.16 no.3
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• pp.99-108
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• 2012

In this paper, to intend anticorrosive effect and weight reduction of conventional reinforced concrete slab, lightweight concrete slab reinforced with glass fiber reinforced polymer(GFRP) bar was considered and some basic behaviour of the slab were investigated. Measurement of splitting tensile strength and fracture energy of the concrete, a number of flexural experiment of the slab, numerical analysis using nonlinear finite element analysis, and comparison of the experimental results to the numerical analysis, were conducted. As a result, even the weight of the lightweight concrete slab could be reduced by about 28% than the normal concrete slab, failure load of the lightweight concrete slab was 36% smaller than the normal concrete slab. Such a thing can be attributed to the lower axial stiffness and lower bond strength of GFRP bar. In the numerical analysis, to consider decreasing property of bond strength of the lightweight concrete, interface element was used between the concrete and the GFRP bar elements and this method was shown to be a better way for the numerical analysis to approach the experimental results.