• Title/Summary/Keyword: Bolometer

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A new fabrication process of vanadium oxides($VO_{x}$) thin films showing high TCR and low resistance for uncooled IR detectors

  • Han, Yong-Hee;Kang, Ho-Kwan;Moon, Sung-Uk;Oh, Myung-Hwan;Choi, In-Hoon
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2001.11b
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    • pp.558-561
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    • 2001
  • Vanadium oxide ($VO_x$) thin films are very good candidate material for uncooled infrared (IR) detectors due to their high temperature coefficient of resistance (TCR) at room temperature. But, the deposition of $VO_x$ thin films showing good electrical properties is very difficult in micro bolometer fabrication process using sacrificial layer removal because of its low process temperature and thickness of thin films less than $1000{\AA}$. This paper presents a new fabrication process of $VO_x$ thin films having high TCR and low resistance. Through sandwich structure of $VO_{x}(100{\AA})/V(80{\AA})/VO_{x}(500{\AA})$ by sputter method and post-annealing at oxygen ambient, we have achieved high TCR more than $-2%/^{\circ}C$ and low resistance less than $10K\Omega$ at room temperature.

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Implementation of Infrared Thermal Image Processing System for Disaster Monitoring (재난 감시를 위한 적외선 열화상 처리 시스템의 구현)

  • Kim, Won-Ho;Kim, Dong-Keun
    • Journal of the Institute of Convergence Signal Processing
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    • v.11 no.1
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    • pp.9-12
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    • 2010
  • This paper presents design and implementation of infrared thermal image processing system based on the digital media processor for disaster monitoring. The digital thermal image processing board is designed and implemented by using commercial chips such as DM642 processor and video encoder, video decoder. The implemented functions for disaster monitoring are to analyze temperature distribution of a monitoring infrared thermal image and to detect disaster situation such as fire. For the input of infrared thermal image processing system, an infrared camera of type of the $320\;{\times}\;240\;{\mu}$-bolometer is used. The required functions are confirmed with 10 frame/second of processing performance by testing of the prototype and Practicality of the system was verified.

Design and analysis of a signal readout integrated circuit for the bolometer type infrared detect sensors (볼로미터형 적외선 센서의 신호처리회로 설계 및 특성)

  • Kim, Jin-Su;Park, Min-Young;Noh, Ho-Seob;Lee, Seoung-Hoon;Lee, Je-Won;Moon, Sung-Wook;Song, Han-Jung
    • Journal of Sensor Science and Technology
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    • v.16 no.6
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    • pp.475-483
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    • 2007
  • This paper proposes a readout integrated circuit (ROIC) for $32{\times}32$ infrared focal plane array (IRFPA) detector, which consist of reference resistor, detector resistor, reset switch, integrated capacitor and operational amplifier. Proposed ROIC is designed using $0.35{\;}{\mu}m$ 2P-4M (double poly four metal) n-well CMOS process parameters. Low noise folded cascode operational amplifier which is a key element in the ROIC showed 12.8 MHz unity-gain bandwidth and open-gain 89 dB, phase margin $67^{\circ}$, SNR 82 dB. From proposed circuit, we gained output voltage variation ${\Delta}17{\};mV/^{\circ}C$ when the detector resistor varied according to the temperature.

A new fabrication process of vanadium oxides($VO_{x}$) thin films showing high TCR and low resistance for uncooled IR detectors

  • Han, Yong-Hee;Kang, Ho-Kwan;Moon, Sung-Uk;Oh, Myung-Hwan;Park, In-Hoon
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
    • /
    • 2001.11a
    • /
    • pp.558-561
    • /
    • 2001
  • Vanadium oxide ($VO_{x}$) thin films are very good candidate material for uncooked infrared (IR) detectors due to their high temperature coefficient of resistance (TCR) at room temperature. But, the deposition of $VO_{x}$ thin films showing good electrical properties is very difficult in micro bolometer fabrication process using sacrificial layer removal because of its low process temperature and thickness of thin films less than 1000${\AA}$. This paper presents a new fabrication process of $VO_{x}$ thin films having high TCR and low resistance. Through sandwich structure of $VO_{x}$(100${\AA}$)/V(80${\AA}$)/$VO_{x}$(500${\AA}$) by sputter method and post-annealing at oxygen ambient, we have achieved high TCR more than -2%/$^{\circ}C$ and low resistance less than $10K\Omega$ at room temperature.

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Modeling of a Superconducting Flux Flow Sensor Inductance Radiometer (인덕턴스 복사계 측정을 위해 사용된 초전도 자속 흐름 센서기 모델링)

  • Ko, Seok-Cheol;Kang, Hyeong-Gon;Lim, Sung-Hun;Choi, Myong-Ho;Han, Byoung-Sung
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2003.05c
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    • pp.19-22
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    • 2003
  • For use in constructing highly sensitive thermal detectors, the present authors have been studying the preparation of Superconducting Flux Flow Sensor(SFFS). In this research, SFFS with five channel ($5{\mu}m$/1channel) has been fabricated based on the flux flow using high temperature superconducting thin films by the ICP etching technique. We have designed a bolometer based on the temperature dependence of the kinetic inductance of a superconducting flux flow thin film. In this paper examines the fabrications and flux flow resistance and thermometer responses of the highly sensitive sensor constructed of a thin YBCO film. It is also suggested that they will be applicable to a new type of flux flow sensor.

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The characterization of the $Si_{1-x}Sb_x$ thin films for infrared microbolometer (적외선 마이크로 볼로미터를 위한 $Si_{1-x}Sb_x$ 박막의 특성)

  • Lee, Dong-Keun;Ryu, Sang-Ouk;Yang, Woo-Seok;Cho, Seong-Mok;Cheon, Sang-Hoon;Ryu, Ho-Jun
    • Journal of the Semiconductor & Display Technology
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    • v.8 no.3
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    • pp.13-17
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    • 2009
  • we have studied characterization of microbolometer based on the co-sputtered silicon-antimony ($Si_{1-x}Sb_x$) thin film for infrared microbolometer. We have investigated the resistivity and the temperature coefficient of resistance (TCR) with annealing. We deposited the films using co-sputtering method at $200^{\circ}C$ in the Ar environment. The Sb concentration has been adjusted by applying variable DC power from Sb targets. TCR of deposited $Si_{1-x}Sb_x$ films have been measured the range of -2.3~-2.8%/K. The resistivity of the film is low but TCR is higher than the other bolometer materials. Resistivity of the films has not been affected hugely according to the low annealing temperature however the resistivity has been dramatically decreased over $250^{\circ}C$. It is caused of a phase change due to the rearrangement of Si and Sb atoms during crystallization process of the films.

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Optical Characteristics of Bolometric Terahertz Sensor (볼로미터형 테라헤르츠 센서의 광학적 특성 연구)

  • Han, Myung Soo;Song, Woosub;Hong, Jung Taek;Lee, Donghee
    • Journal of Sensor Science and Technology
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    • v.27 no.5
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    • pp.335-339
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    • 2018
  • The optical characteristics of a terahertz (THz) antenna-coupled bolometer (ACB) detector were evaluated using a pulsed quantum cascade laser (QCL) and radiation blackbody sources. We investigated a method for measuring the responsivity and noise-equivalent power (NEP) of the THz detector using two different types of light sources. When using a QCL source with a frequency of 3 THz, the average responsivity of 24 devices was $1.44{\times}10^3V/W$ and the average NEP of those devices was $3.33{\times}10^{-9}W/{\surd}Hz$. The average responsivity and NEP as measured by blackbody source were $1.79{\times}10^5V/W$ and $6.51{\times}10^{-11}W/{\surd}Hz$, respectively, with the measured values varying depending on the light source. This was because the output power of each light source was different, with the laser source being driven by a pulse type wave and the blackbody source being driven by a continuous wave. The power input to the THz sensor was also different. Futhermore, the responsivity and NEP values measured using band pass filter (BPF) were similar to those measured when using only THz windows. It was found that ACB sensor responds normally in the THz region to both the laser and the blackbody source, and the method was confirmed to effectively evaluate the characteristics of the THz sensor.