• Title/Summary/Keyword: Board densities

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Effect of XPS and Polyethylene Aggregates in Model Tests for Prevention of Frost Heave in Railroad Track (철도에서의 동상방지를 위한 모형시험에서 XPS 및 PE골재의 설치 효과)

  • Kim, Donggwan;Yoon, Yeowon;Kim, Youngchin
    • Journal of the Korean GEO-environmental Society
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    • v.15 no.10
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    • pp.5-13
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    • 2014
  • In this research, in order to study insulation effect of commercial XPS and recycled PE aggregates for prevention of frost heave in the roadbed of railroad track from the freezing temperature, model tests were carried out in the large freezing room. For this, thermal conductivities were measured for various dry densities, water contents, temperatures and mixing ratios of PE aggregates. From the tests, it can be seen that thermal conductivities of roadbed decrease with the increase of the ratio of mixed PE aggregates. However it was sensitive to the changes of temperature and water content due to the amount of water in the voids. From the model test of railroad track, it can be seen that the time to reach $0^{\circ}C$ was longer for XPS than that for the PE aggregates. Also the test shows best insulation effect can be achieved when XPS board was installed above the PE aggregate layer rather than the opposite order.

Development of a Data Acquisition System for the Long-term Monitoring of Plum (Japanese apricot) Farm Environment and Soil

  • Akhter, Tangina;Ali, Mohammod;Cha, Jaeyoon;Park, Seong-Jin;Jang, Gyeang;Yang, Kyu-Won;Kim, Hyuck-Joo
    • Journal of Biosystems Engineering
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    • v.43 no.4
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    • pp.426-439
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    • 2018
  • Purpose: To continuously monitor soil and climatic properties, a data acquisition system (DAQ) was developed and tested in plum farms (Gyewol-ri and Haechang-ri, Suncheon, Korea). Methods: The DAQ consisted of a Raspberry-Pi processor, a modem, and an ADC board with multiple sensors (soil moisture content (SEN0193), soil temperature (DS18B20), climatic temperature and humidity (DHT22), and rainfall gauge (TR-525M)). In the laboratory, various tests were conducted to calibrate SEN0193 at different soil moistures, soil temperatures, depths, and bulk densities. For performance comparison of the SEN0193 sensor, two commercial moisture sensors (SMS-BTA and WT-1000B) were tested in the field. The collected field data in Raspberry-Pi were transmitted and stored on a web server database through a commercial communications wireless network. Results: In laboratory tests, it was found that the SEN0193 sensor voltage reading increased significantly with an increase in soil bulk density. A linear calibration equation was developed between voltage and soil moisture content depending on the farm soil bulk density. In field tests, the SEN0193 sensor showed linearity (R = 0.76 and 0.73) between output voltage and moisture content; however, the other two sensors showed no linearity, indicating that site-specific calibration is important for accurate sensing. In the long-term monitoring results, it was observed that the measured climate temperature was almost the same as website information. Soil temperature information was higher than the values measured by DS18B20 during spring and summer. However, the local rainfall measured using TR 525M was significantly different from the values on the website. Conclusion: Based on the test results obtained using the developed monitoring system, it is thought that the measurement of various parameters using one device would be helpful in monitoring plum growth. Field data from the local farm monitoring system can be coupled with website information from the weather station and used more efficiently.

An Empirical Formulation for Predicting the Thickness of Multilayer PCB (다층 PCB의 두께 예측을 위한 실험식 도출 연구)

  • Kim, Nam-Hoon;Han, Gwan-Hee;Lee, Min-Su;Kim, Hyun-Ho;Shin, Kwang-Bok
    • Composites Research
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    • v.35 no.3
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    • pp.182-187
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    • 2022
  • In this paper, the thickness of a multilayer PCB was predicted through an empirical formulation based on the physical properties of the prepreg used in multilayer PCB. Since the thickness of prepreg reduction when manufacturing a PCB due to the physical properties and copper foil residual rate, it is necessary to accurately predict the thickness of the PCB through the thickness empirical formulation. To determine the density of the prepreg, the mass and thickness of the prepreg were measured. To manufacture the CCL, the prepreg and copper foil were laminated using a hot press machine, and the thickness was measured using a microscope and micrometer. An 8-layerd PCB was designed with different circuit densities to measure the change in the thickness with the copper foil residual ratio, and the proposed empirical formulation was verified by comparing the measured thickness with the value obtained using the empirical formulation. As a result, the errors for the CCL and multilayer PCB were 2.56% and 4.48%, respectively, which demonstrated the reliability of the empirical formulation.