• 한국분말재료학회지
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• 제27권6호
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• pp.490-497
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• 2020

The 3D printing process provides a higher degree of freedom when designing ceramic parts than the conventional press forming process. However, the generation and growth of the microcracks induced during heat treatment is thought to be due to the occurrence of local tensile stress caused by the thermal decomposition of the binder inside the green body. In this study, an alumina columnar specimen, which is a representative ceramic material, is fabricated using the digital light process (DLP) 3D printing method. DTG analysis is performed to investigate the cause of the occurrence of microcracks by analyzing the debinding process in which microcracks are mainly generated. HDDA of epoxy acrylates, which is the main binder, rapidly debinded in the range of 200 to 500℃, and microcracks are observed because of real-time microscopic image observation. For mitigating the rapid debinding process of HDDA, other types of acrylates PETA, PUA, and MMA are added, and the effect of these additives on the debinding rate is investigated. By analyzing the DTG in the 25 to 300℃ region, it is confirmed that the PETA monomer and the PUA monomer can suppress the rapid decomposition rate of HDDA in this temperature range.

• 공업화학
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• 제26권3호
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• pp.306-310
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• 2015

본 연구에서는 광 전기화학적 물 분해 전극 재료로 이용되는 산화철($Fe_2O_3$, hematite)을 표면적을 크게 하기 위하여 DC 열플라즈마 장치를 이용하여 나노입자로 합성한 후 전극을 제조 시 binder의 종류 및 조성을 다르게 하여 염기성 전해질에서 각각의 물 분해 효율을 측정하는 실험을 진행하였으며 질소 도핑을 통해 질소가 산화철의 광전기화학 반응에 끼치는 영향을 확인하였다. 산화철 전극을 제조하여 solar simulator를 이용한 LSV 실험을 통해 각 전극의 onset potential 및 설정한 전압 범위에서의 최대 전류밀도를 측정하였으며, 전극의 내구성 평가를 위하여 LSV 실험을 반복하여 진행하였다. CMC (carboxymethyl cellulose)를 50 : 1의 비율로 섞어 binder로 이용한 산화철 전극이 가장 높은 전류밀도인 $12mA/cm^2$의 전류밀도를 나타내었고, CMC를 20 : 1 비율로 섞은 binder를 이용할 시 $3mA/cm^2$의 초기 전류밀도를 가지고 약 20회의 반복 실험을 견뎌내는 내구성을 나타내었다. 질소의 도핑이 산화철 나노입자의 광 전기 화학적 반응에 끼치는 영향은 미미한 것으로 확인되었다.

• 전기화학회지
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• 제24권2호
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• pp.28-33
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• 2021

이차전지의 에너지 밀도를 높이기 위한 방법으로 전극의 로딩을 높이는 방법에 대하여 많은 시도가 이루어지고 있다. 본 연구에서는 리튬이온 이차전지용 양극에서 보편적으로 사용되어 온 기존의 polyvinylidene fluoride (PVdF) 바인더가 아닌 polytetrafluoroethylene (PTFE) 바인더를 적용하여 고로딩의 LiNi_0.5Co_0.2Mn_0.3O₂ (NCM523) 양극을 제조하였다. 기존의 슬러리 공정이 아닌 PTFE 현탁액을 이용한 반죽공정을 통하여 로딩을 높인 두꺼운 전극이 용이하게 제조되었다. PTFE 및 PVdF 기반의 전극을 5.0 mAh/cm²의 로딩레벨로 각각 제조한 결과로 PTFE를 적용한 전극이 좀 더 우수한 사이클 수명과 속도특성을 지니고 있음을 확인하였다. PTFE 바인더를 사용한 반죽공정으로 제조된 전극은 기공도가 커서 전극밀도가 높지 않기 때문에 압연을 상온이 아닌 120℃ 이상의 고온에서 진행함으로써 기공도를 낮출 수 있었으나, 이에 따른 사이클 성능의 차이는 크지 않았다. 또한, 전극조성에서 도전재의 함량을 높임으로써 고로딩 전극의 사이클 수명을 소폭 향상시킬 수 있었다. PTFE 바인더 적용으로 고로딩 전극의 성능을 향상시킬 수 있었으나, 추가적인 개선이 필요할 것이다.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 1996년도 자동차부품 제작기술의 진보
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• pp.75-86
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• 1996

Three-Dimensional finite element analysis is performed using PAM-STAMP for design evaluation of automotive back door inner panel die. Gravity process by blanks own weight, binder-wrap process, and drawing process in the forming operations are sequentially simulated with Virtual Manufacturing Method. The most valuable result in this research is that 3-D FEM analysis can be applied to the design evaluation of draw die in the die try-out, though effects of mesh size and drawbead resistance force on the numerical accuracy are much sensitive. For the intensive application to draw-die design and try-out, the experimental know-hows about the forming variables such as friction coefficient, punch velocity, drawbead force, etc are necessary.

• 한국전기전자재료학회논문지
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• 제13권9호
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• pp.801-804
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• 2000

High-temperature superconductor of Bi-2212 system was fabricated by CFP(Centrifugal Forming Process). To make a uniform specimen slurry was prepared in the ratio of 7:3(powder : binder) and ball milled for 24 hours. Milled slurry was charged into a rotating mold with 450 rpm and dried at room temperature. Then the specimen was performed binder burn-out at 35$0^{\circ}C$ and heated for partial melting to 86$0^{\circ}C$. XRD analysis of most specimens were shown 2212 phase and observed a local plate shped microstructure with a well aligned c-axis direction from SEM images. Measured T$_{c}$(Critical temperature) was about 64 K.K.

• 한국분말재료학회지
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• 제7권1호
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• pp.27-34
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• 2000

The fabrication process and mechanical properties of SiC particle prefrrms with high volume fraction ranged 50∼71% were investigated to make metal matrix composites for possible applications as heat sinks in electronic packares. The SiC particle preforms with 50∼71vol% of reinforcement were fabricated by a new modified process named ball milling and pressing method. The SiC particle performs were fabricated by ball milling of SiC particles with single sized of 48${\mu}$m in diameter or two different size of 8${\mu}$m and 48${\mu}$min diameter, with collodal SiO2 as inorgnic binder in distilled water, and the mixed slurries were cold pressed for consolidation into final prefom. The compressive strengths og calcined SiC particle prefoms increased from 20MPa to 155MPa with increasing the content of inorganis binder, temperature and time for calcination. The increase of compressive strength of SiC particle bridge the interfaces of two neighboring SiC particles.

• 한국세라믹학회지
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• 제36권7호
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• pp.725-733
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• 1999

It is a fundamental experiment to use blast-furnace slag in solidification/stabilization process. The compressive strength and leaching test of Pb and Cr doped samples were evaluated and the effects of heavy-metal ions on the hydration of slag was investigated. Sodium silicates(5wt%) was added as alkali-activator and the effects of replacing a part of slag with flyash or gypsum was also discussed. Pb ion was solidified by encapsulation of matrix. In of slag${\pm}$gypsum binder microstructure was densified by accelerating to form AFt/AFm phase and compressive strength was improved resulting in reducing leaching amount of Pb ion. Cr ion was solidified by substituting with Al ion in aluminate product. Slag+fly ash binder improved compressive strength and decreased leaching amount of Cr ion.

• 소성∙가공
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• 제12권6호
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• pp.521-528
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• 2003

Powder injection molding (PIM) uses the shaping advantage of injection molding but is applicable to metals and ceramics. This process combines a small quantity of polymer with an inorganic powder to form a feedstock that can be molded. After shaping, the polymeric binder is extracted and the powder is sintered, often to near-theoretical densities. According1y, PIM delivers structural materials in a shaping technology previously restricted to polymers. The process overcomes the shape limitations of traditional powder compaction, the costs of machining, the productivity limits of isostatic pressing and slip casting, and the defect and tolerance limitations of conventional casting. Since 1980s when major attention was given to PIM process, it has been widening the application area from small parts with complex shape and tailored properties to structural parts requiring strength and ductility as in automotive, military and medical industries.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2000년도 하계학술대회 논문집
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• pp.189-192
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• 2000

High-temperature superconductor of Bi-2212 system was fabricated by CFP(centrifugal forming process). To make a uniform specimen slurry was prepared in the ratio of 7:3(powder:binder) and ball milled for 24 hours. Milled slurry was charged into a rotating mold with 450 rpm and dried at room temperature. Then the specimen was performed binder burn-out at 35$0^{\circ}C$ and heated for partial melting to 86$0^{\circ}C$. XRD analysis of most specimens were shown 2212 phase and observed a local plate shaped microstructure with a well aligned c-axis direction from SEM images. T$_{c}$(Critical temperature) of Bi-2212 was 64K.K.

• 소성∙가공
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• 제6권2호
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• pp.152-160
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• 1997

Three-Dimensional finite element analysis is performed using PAM-STAMP for design evaluation of automotive back door inner panel die. Gravity process by blank own weigth, binder-wrap process, and drawing process in the forming operations are sequentially simulated with Virtual Manufacturing Method. The most valuable result in this research is that 3-D FEM analysis can be applied to the design evaluation of draw dies in the die try-out, though effects of mesh size and drawbead resistance force on the try-out, the experimental knowhows about the forming variables such as friction coefficient punch velocity, drawbead force, etc are necessary.