• Applied Microscopy
• /
• v.24 no.3
• /
• pp.78-86
• /
• 1994

A TEM study on proeutectoid ${\alpha}$ reaction at sub-eutectoid temperatures has been made in hypoeutectoid Ti-3.gw/o Co and Ti-5.2w/o Fe alloys. Widmanstatten ${\alpha}$ plates were formed in both alloys within the ${\beta}$ matrix with some modification of degenerate forms. These degenerate plates were formed by the sympathetic nucleation of ${\alpha}$ plates at ${\alpha}:{\beta}$ interphase boundaries. Three types of sympathetic nucleation, i.e., edge-to-edge, face-to-edge, face-to-face, were found in both alloys. The edge-to-edge sympathetically nucleated crystals formed a low-angle boundary between two crystals. The ${\alpha}:{\beta}$ interphase boundaries were found to be partially coherent interfaces which consist of regularly spaced misfit dislocations. The growth of these interphase boundaries were accomplished by the lateral movement of growth ledges. The intersection points of two ${\alpha}$ plates or the low angle boundaries which had formed by edge-to-edge sympathetic nucleation played a role as the potential sources of growth ledges during the growth of plate. The interfacial structures and the spatial morphologies of the degenerate proeutectoid ${\alpha}$ plates would be expected to influence the nucleation and growth of the succeeding eutectoid decomposition process.

• Transactions of the Korean hydrogen and new energy society
• /
• v.15 no.3
• /
• pp.250-256
• /
• 2004

Magnesium and its alloys have the high potential as hydrogen storage materials because of their highest hydrogen storage capacity, low density and abundant resources. But poor kinetic properties of hydriding and dehydriding and high working temperature have limited their practical applications. In this study, the Mg-Ni binary alloys with different amount of Ni were produced by gravity casting and characterized in order to investigate the relationship between the microstructures and hydriding properties. The maximum hydrogen absorption capacity decreased, but the absorption kinetics increased with Ni content. The difference in the absorption kinetics was resulted from the differences in the sort and shape of primary solid phases and eutectic microstructure.

• Journal of Korea Foundry Society
• /
• v.24 no.3
• /
• pp.138-144
• /
• 2004

Effects of alloying elements such as Si, Mn, Zn on the fluidity and mechanical properties of high ductility Al-Mg based alloys were investigated. The fluidity of alloys was evaluated using a vacuum suction fluidity test, and Si addition was observed to increase the fluidity of AI-Mg binary alloys substantially while Zn somewhat decreased the fluidity. However, both the strength and ductility were significantly deteriorated by the Si additions. It was observed that a small amount of Mn addition to Al-Mg alloy increased the tensile strength effectively without losing much ductility but the effect of Zn addition on the strength was relatively small.

• Journal of Welding and Joining
• /
• v.13 no.3
• /
• pp.134-146
• /
• 1995

Aluminium nitride(AlN) is currently under investigation as potential candidate for replacing alumium oxide(Al$_{2}$ $O_{3}$) as a substrate material for for electronic circuit packaging. Brazing of aluminium nitride(AlN) to Cu with Ag base active alloy containing Ti has been investigated in vacuum. Binary Ag$_{98}$ $Ti_{2}$(AT) and ternary At-1wt.%Al(ATA), AT-1wt.%Ni(ATN), AT-1wt.% Mn(ATM) alloys showed good wettability to AlN and led to the development of strong bond between brate alloy and AlN ceramic. The reaction between AlN and the melted brazing alloys resulted in the formation of continuous TiN layers at the AlN side iterface. This reaction layer was found to increase by increase by increasing brazing time and temperature for all filler metals. The bond strength, measured by 4-point bend test, was increased with bonding temperature and showed maximum value and then decreased with temperature. It might be concluded that optimum thickness of the reaction layer was existed for maximum bond strength. The joint brazed at 900.deg.C for 1800sec using binary AT alloy fractured at the maximum load of 35kgf which is the highest value measured in this work. The failure of this joint was initiated at the interface between AlN and TiN layer and then proceeded alternately through the interior of the reaction layer and AlN ceramic itself.

• Journal of Technologic Dentistry
• /
• v.33 no.4
• /
• pp.263-270
• /
• 2011

Purpose: The grindability of binary Ti-X%Zr(X=10,20,40) alloys in order to develop a Ti alloy with better machinability than unalloyed titanium has been evaluated. Methods: Experimental Ti-Zr alloys were made in an argon-arc melting furnace. Slabs of experimental alloys were ground using a SiC abrasive wheel on an electric handpiece at circumferential speeds(12000,18000,25000 or 30000rpm) by applying a force(200gr). Grinding rate was evaluated by measuring the amount of metal volume removed after grinding for 1 minute and the volume ratio of metal removed compared to the wheel material lost, which was calculated from the diameter loss (grinding ratio). Experimental datas were compared to those for cp Ti(commercially pure titanium) and Ti-6%Al-4%V alloy were used controls. Results: It was observed that the grindability of Ti-Zr alloys increased with an increase in the Zr concentration. More, they are higher than cp Ti, particularly the Ti-20%Zr alloy exhibited the highest grindability at all circumferential speeds. There was significant difference in the grinding rate and grinding ratio between Ti-20%Zr alloy and cp Ti at any speed(p<0.05). Conclusion: By alloying with Zr, the Ti exhibited better grindability at all circumferential speeds. the Ti-20%Zr alloy has a great potential for use as a dental machining alloy.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2009.11a
• /
• pp.263-263
• /
• 2009

The microtstructures and properties of alloys in the pseudo-binary $Bi_2Te_3-PbTe$ system were investigated as a first step towards the design of nanostructured materials with enhanced thermoelectric properties. The liquid alloys were cooled by water quenching method. Dendritic and lamellar structures were observed clearly by using environmental scanning electron microscope(eSEM) and electron probe micro analyzer(EPMA) take into account composition ratio between $Bi_2Te_3$ and PbTe. The compound $Pb_2Bi_6Te_{11}$ precipitated as a metastable phase under all conditions. The structure of those samples changed from dendritic to lamellar by increasing $Bi_2Te_3$ ratio of composition.

• Journal of the Korean institute of surface engineering
• /
• v.12 no.3
• /
• pp.161-166
• /
• 1979

Theoretical and practical aspects are investigated for electrochemical behavious, plating processes and the structures of electrodeposit of Pb-Sn binary alloy plating through numerous literatures in this report. The anodic and cathodic electrode reaction mechanisms of Pb and Sn could co-deposit and make Pb-Sn alloy deposit from the results of cathode current density-cathode potential curves of Pb, Sn and Pb-Sn alloys in fluoborate solutions. The compositions of the best alloy plating solutions are obtained for the purpose of bearing, anticorrosion and solder plating. In general, the casting anodes of Pb-Sn alloys are used, but separated anodes of Pb and Sn pure metal are used in order to obtain the fine compositions of Pb-Sn alloy deposits. The electrodeposits of Pb-Sn alloy are in nonequilibrium state and saturated solid solutions. Thus, ${\beta}$-phase (Sn-phase) is precipitated by heat treatment. The texture and structure of the electrodeposit are associated with the surface energies of deposit lattice planes and with the cathode polarization. The electrodeposit of Pb-Sn alloy is shown as lamellar structure.

• Journal of Korea Foundry Society
• /
• v.6 no.2
• /
• pp.116-121
• /
• 1986

The effects of pressure during solidification on macro-and micro-structures have been studied in pure aluminium and Al-Si alloys. The application of pressure during solidifcation accelerated both equiaxed and columnar dendritic-growth due to stimulating of equiaxed survival and faster preferential growth of primary dendrites against the parallel direction of heat flow. Burden-Hunt model was modified to express the significant changes of CET behaviours under pressure. A further point to be noted was that greatly fine eutectic silicon flakes ($0.5\;{\times}\;13{\mu}m$) with the decrease of halo layers ($7{\mu}m$) of aluminium riched phases in the periphery of primary silicon particles were observed when pressure was applied during solidification.

• Journal of the Korean Society of Manufacturing Technology Engineers
• /
• v.20 no.2
• /
• pp.187-192
• /
• 2011

UBM(Under Bump Metallurgy) is very important for successful realization of Flip-Chip technology. In this study, it is investigated the interfacial reactions between various Sn-Ag solder alloys and Ni-P/Au UBM and Cu plate finish. It is also evaluated the shear strength by using the micro shear-punch test method for Sn-37Pb alloy, binary and ternary alloys of environment-friendly Pb-free solder alloys which are applied in the electronic packages. In terms of interfacial microstructure, the Pb-free solder joints have thicker IMCs than the Sn-Pb solder joints. The thickness of IMC is related to Reflow time. The IMC has been observed to grow with the increase in Reflow time. As a result of the shear test, in case of Max. shear strength, Pb-free solder showed the highest strength value and Sn-37Pb showed the lowest strength value 10 be generally condition of Reflow time.

• Journal of Sensor Science and Technology
• /
• v.13 no.6
• /
• pp.405-410
• /
• 2004

Compensation wires for Pt/Pd thermocouple was manufactured using Cu/Ni alloys. Their thermoelectric voltage has been tested from room temperature to about $150^{\circ}C$. Alloys of $Cu_{95.5}Ni_{4.5}$ and $Cu_{89.5}Ni_{10.5}$ introduced only small emf differences to Pt/Pd thermocouples, indicating a real possibility of industrial use. Above $1000^{\circ}C$, the temperature difference was expected to he small as ${\pm}0.5^{\circ}C$, and the difference would be minimized by adjusting the Ni content with a small amount.