• Journal of Powder Materials
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• v.23 no.2
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• pp.120-125
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• 2016

P-type ternary $Bi_{0.5}Sb_{1.5}Te_3$ alloys are fabricated via mechanical alloying (MA) and spark plasma sintering (SPS). Different ball sizes are used in the MA process, and their effect on the microstructure; hardness, and thermoelectric properties of the p-type BiSbTe alloys are investigated. The phases of milled powders and bulks are identified using an X-ray diffraction technique. The morphology of milled powders and fracture surface of compacted samples are examined using scanning electron microscopy. The morphology, phase, and grain structures of the samples are not altered by the use of different ball sizes in the MA process. Measurements of the thermoelectric (TE) transport properties including the electrical conductivity, Seebeck coefficient, and power factor are measured at temperatures of 300-400 K for samples treated by SPS. The TE properties do not depend on the ball size used in the MA process.

• Journal of the Korean Ceramic Society
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• v.44 no.6 s.301
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• pp.308-312
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• 2007

Ferroelectric, magnetic, and magnetoelectric effects for lanthanum modified $BiFeO_3-PbTiO_3$ ceramics have been investigated. The data show that magnetoelectric polarization coefficient, ${\alpha}_p$ is due to a linear coupling between polarization and magnetization, and that ${\alpha}_p$ is independent of dc magnetic bias and ac magnetic field. The values of ${\alpha}_p$ and magnetic induced susceptibility for lanthanum modified $BiFeO_3-PbTiO_3$ ceramics are much larger than those of single $BiFeO_3$ crystal. We believe that the magnetoelectric effect is significantly enhanced by breaking of the cycloidal spin state of a long-period spiral spin structure due to randomly distributed charged imperfections.

• Journal of Powder Materials
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• v.17 no.6
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• pp.494-498
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• 2010

The p-type thermoelectric compounds of $Bi_2Te_3$ based doped with 3wt% Te were fabricated by a combination of rapid solidification and spark plasma sintering (SPS) process. The effect of holding time during spark plasma sintering (SPS) on the microstructure and thermoelectric properties were investigated using scanning electron microscope (SEM), X-ray diffraction (XRD) and thermoelectric properties. The powders as solidified consisted of homogeneous thermoelectric phases. The thermoelectric figure of merit measured to be maximum ($3.41{\times}10^{-3}/K$) at the SPS temperature of $430^{\circ}C$.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.385-385
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• 2012

A two terminal N+/P/N+ junction device to replace the conventional selective transistor was studied as a bilateral switching device for spin transfer torque (STT) MRAM based on 3D device simulation. An N+/P/N+ junction structure with $30{\times}30nm$ area requires bi-directional current flow enough to write a data by a drain induced barrier lowering (DIBL) under a reverse bias at N+/P (or P/N+ junction), and high current on/off ratio of 106. The SiGe materials are widely used in hetero-junction bipolar transistors, bipolar compensation metal-oxide semiconductors (BiCMOS) since the band gap of SiGe materials can be controlled by changing the fraction and the strain epilayers, and the drift mobility is increased with the increasing Ge content. In this work, N+/P/N+ SiGe material based junction provides that drive current is increased from 40 to $130{\mu}A$ by increased Ge content from 10~80%. When Ge content is about 20%, the drive current density of SiGe device substantially increased to 2~3 times better than Si-based junction device in case of 28 nm P length, which is sufficient current to operation of STT-MRAM.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2018.06a
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• pp.93.2-93.2
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• 2018

최근 기후 변화 문제로 $CO_2$배출량 억제 정책에 따라 열전재료가 다양한 분야에 크게 주목 받고 있다. 열전 모듈은 전류를 흘려 온도차를 발생시키는 펠티어 효과와 온도차를 전력으로 변환하는 제백 효과를 이용한다. 열전발전용에 적용되는 상용 열전모듈의 경우, 열전소자의 접합부의 수는 수십 개 이상이다. 따라서 단 한 개의 접합 불량 열전소자가 모듈 전체의 열전성능에 큰 영향을 미친다. 현재 상용화 된 Bi-Te계 열전 모듈은 Bi-Te의 Te와 Sn계 솔더의 주성분인 Sn이 $250^{\circ}C$ 부근에서 취성의 Sn-Te계 금속 화합물을 형성한다고 알려져 있다. 이 때 생성된 Sn-Te 화합물은 열전모듈의 접합강도를 약화시키고 이로 인해 열전모듈의 접합 신뢰성을 크게 저하 시킬 수 있다. 이를 해결하기 위해 솔더와 소자 사이에 확산방지층이 적용되고 있으며, 이 중에서 니켈합금이 가장 널리 적용되고 있다. 니켈층을 형성시키는 방법 중에서, 무전해 도금법은 간단하게 열전소자 표면 위에 도금 층을 균일한 두께로 만들어 낼 수 있다. 하지만, 니켈 도금층과 Bi-Te 소자 간에 화학적 결함이 존재하지 않기 때문에, 무전해 니켈 도금층의 밀착성이 떨어진다. 이 때. 소자 표면에 거칠기 효과(anchor effect)를 부여하기 위해 물리적 샌딩법을 사용하는데 이 방법의 경우 소자에 크랙 같은 손상을 미쳐 열전모듈의 신뢰성 저하를 가져온다. 그러므로 거칠기 효과를 부여하면서 소자에 손상을 최소화하는 습식 식각법을 개발하여 Bi-Te계 열전소자의 표면 조도를 조절하고 무전해 Ni-P 도금을 실시하였다. 그리고 열처리 유무에 따른 열전모듈의 접합강도를 측정하였으며, 제작한 열전 모듈의 접합부 및 파단부의 계면 분석하여 무전해 Ni-P도금을 위한 습식식각법(wet etching법)에 대하여 검토하였다. N-type은 질산과 구연산의 혼합수용액에, P-type은 왕수에 습식 식각처리를 해서 적당히 표면 조도를 조절한 후에 EPMA로 분석을 해본 결과 니켈 도금층과 Bi-Te 소자 간에 anchor effect가 부여 된 것을 확인했다. 습식 식각에 의해서 제조된 열전모듈의 접합강도는 종래의 알루미나 샌딩법으로 제조한 열전모듈 보다 높은 접합강도를 나타내었다.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.14 no.6
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• pp.233-235
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• 2004

Shaped single crystals of Bi : $Y_3Ga_5O_{12}$(Bi = 0.041, 0.047 and 0.061 mol%) were grown by the micro-pulling-down method. Optical absorption spectra show an absorption band at 288 nm ascribed to the lowest energy $6s^2$ \longrightarrow 6s6p transition of $Bi^{3+}$ , while luminescence spectra demonstrate the band at 314 nm ascribed to the reverse radiative transition of the excited $Bi^{3+}$ centres. At room temperature, dominant decay time component was found to be about 440 ns with a minor slower component 580 ns.

• Electrical & Electronic Materials
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• v.8 no.2
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• pp.204-210
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• 1995

The characteristics of the internal circuits and the load capacitance should be included to optimize the size of BiCMOS buffer. In order to get the optimum size and delay time of the BiCMOS buffer, new size plane is suggested. By using the size plane, the optimum characteristics of CMOS buffer according to the number of stages can be obtained. From this method, delaytime, .tau.$_{D}$, is obtained 2.39 nsec with $V_{\var}$=5V, $C_{L}$=5pF, W=30.mu.m and $A_{e}$=135.mu. $m^{2}$.>..>...>.

• Electrical & Electronic Materials
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• v.9 no.7
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• pp.680-689
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• 1996

SrCaCuO와 BiPbCuO 화합물로 이루어진 이중층시료가 만들어 졌으며, 소결과정에서 나타나는 확산과 입자간의 상호작용으로 108K의 임계온도를 나타내었다. 이 시료는 820.deg. C에서 0-210 시간동안 소결되었다. 초전도체의 생성, 성장메카니즘과 임계온도의 관계가 연구되었으며, 최적조건은 820.deg. C에서 210시간 소결하고 SrCaCuO와 BiPbCuO의 도포비가 1:0.6인 시편에서 나타났다. 또한 이중층시료에서 가장 좋은 조성비는 S $r_{2}$C $a_{2}$C $u_{2}$ $O_{x}$와 B $i_{1.9}$P $b_{0.5}$C $u_{3}$ $O_{y}$ 이었다.다.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.15 no.3
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• pp.220-226
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• 2002

Amorphous $Sb_{2-x}Bi_xTe_3$ (x = 0.0, 0.5 and 1.0) thin films were prepared by vacuum evaporation. The resistivity of 7he films decreases from 1.4{\times}10^{-2}$ to $8.84{\times}10^{-5}\Omega cm$ and the type of conductivity changes from p to n with the increase of the x value of the films. D.C. conduction studies on these films ate performed at various electric fields in the temperature range of 303-403 K. At low electric fields, two types of conduction mechanisms, i.e. the variable range hopping and the phonon assisted hopping are found to be responsible for the conduction, depending upon the temperature. The activation energy decreases from 0.082 to 0.076 eV in the temperature range of 303-363 K and from 0.47-0.456 eV in the second range of 363-403 K, indicating the shift of the Fermi level towards the conduction band edge and hence the change of the conduction from P to n type with the increase of the Bi concentration. Poole-Frankel emission dominates at high fields. The shape of the potential well of the localized centre is deduced and the mean free path of the charge carriers is also calculated.

• Journal of applied mathematics & informatics
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• v.5 no.3
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• pp.819-826
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• 1998

The purpose of this paper is to prove the following results; (1) Let R be a prime ring of char $(R)\neq 2$ and I a nonzero left ideal of R. The existence of a nonzero symmetric bi-derivation D : $R\timesR\;\longrightarrow\;$ such that d is sew-commuting on I where d is the trace of D forces R to be commutative (2) Let m and n be integers with $m\;\neq\;0.\;or\;n\neq\;0$. Let R be a noncommutative prime ring of char$ (R))\neq \; 2-1\; p_1 \;n_1$ where p is a prime number which is a divisor of m, and I a nonzero two-sided ideal of R. Let $D_1$ ; $R\;\times\;R\;\longrightarrow\;and\;$ $D_2\;:\;R\;\times\;R\;longrightarrow\;R$ be symmetric bi-derivations. Suppose further that there exists a symmetric bi-additive mapping B ; $R\;\times\;R\;\longrightarrow\;and\;$ such that $md_1(\chi)\chi ＋ n\chi d_2(\chi)=f(\chi$) holds for all $\chi$$\in$I, where $d_1 \;and\; d_2$ are the traces of $D_1 \;and\; D_2$ respectively and f is the trace of B. Then we have $D_1=0 \;and\; D_2=0$.