• 한국재료학회지
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• 제5권2호
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• pp.251-258
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• 1995

$Bi_{2}Te_{3}$와 PbTe의 혼합물에서 $Bi_{2}Te_{3}-PbBi_{4}Te_{7}$의 공정조직이 형성됨을 이용, 제2상의 미세조직 제어로 열전도도의 감소에 따른 성능지수 향상을 목적하여 여러 조건에서 제조된 n-type(Bi, Pb)-Te계 공정조성 일방향 응고재의 열전특성을 조사하였다. 일방향응고시 공정상 PbBi_{4}Te_{7}$이 $Bi_{2}Te_{3}$의 벽개면(0001)을 따라 lamellar 형태로 성장하였으며, 성장속도가 1.4 \times 10^{-4}$cm/sec에서 $8.3 \times 10^{-4}$cm/sec로 증가됨에 따라 4PbBi_[4]Te_{7}$의 상간격은 10.4 $\mu \textrm{m}$에서 3.2$\mu \textrm{m}$로 감소되었다. Seeback계수는 성장방향 및 성장속도와 온도구배에는 관계없이 약 $\mid$$\alpha$$\mid$=29 $\mu$ V/K일정하였다. 전기전도도는 성장속도에 따라 약간 감소하는 경향을 보였고 성장방향에 평행한 경우가 수직한 경우보다 약 3배 정도 컸다. 성능지수는 성장방향과 성장속도 및 온도구배에 따라 약간씩 변화를 보였다. 수직한 경우가 평행한 경우에 비해 상대적으로 증가하는 경향을 나타내었는데 이는 lamellar 간격이 줄어듦에 따른 열전도도의 감속에서 비롯된 것으로 분석되었다.

• Journal of Welding and Joining
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• 제20권4호
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• pp.505-509
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• 2002

Pb is considered to be eliminated from solder, due to its toxicity. However, melting temperatures of most Pb-free solders are known higher than that of Sn37Pb. Therefore, there is a difficulty to apply Pb-free solders to electronic industry. Since Sn3Ag8Bi5In has relatively lower melting range as $188~200^{\circ}C$, on this study. Wettability and soldering characteristics of Sn3Ag8Bi5In solder in BGA were investigated to solve for what kind of problem. Zero cross time, wetting time, and equilibrium force of Sn3Ag8Bi5In solder for Cu and plated Cu such as Sn, Ni, and Au/Ni-plated on Cu were estimated. Plated Sn on Cu showed best wettability for zero cross time, wetting time and equilibrium farce. Shear strength of the reflowed joint with Sn3Ag8Bi5In ball in BGA was investigated. Diameter of the ball was 0.5mm, UBM(under bump metallurgy) was $Au(0.5\mu\textrm{m})Ni(5\mu\textrm{m})/Cu(18\mu\textrm{m})$ and flux was RMA type. For the reflow soldering, the peak reflow temperature was changed in the range of $220~250^{\circ}C$, and conveyor speed was 0.6m/min.. The shear strength of Sn3Ag8Bi5In ball showed similar level as those of Sn37Pb. The soldered balls are aged at $110^{\circ}C$ for 36days and their shear strengths were evaluated. The shear strength of Sn3Ag8Bi5In ball was increased from 480gf to 580gf by aging for 5 days.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2002년도 International Symposium
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• pp.203-215
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• 2002

Using eutectic In-Ag and Bi-Sn solder materials, we developed the COG technique having a minimum pitch of 50 ${\mu}{\textrm}{m}$. The maximum temperature in this process is $160^{\circ}C$. We fabricated spherical and uniform solder bumps by controlling the microstructure of Bi-Sn solder bumps. The contact resistances of Bi-Sn solder joints were 19 m$\Omega$ at $80{\mu}{\textrm}{m}$ pitch and 60 m$\Omega$ at $80{\mu}{\textrm}{m}$ pitch, respectively. These values are much lower than the contact resistance of the conventional ACF bonding. The contact resistances of the solder joint are almost the same before and after the underfill process. The contact resistance of the underfilled Bi-Sn solder joint did not change even after reliability test.

• Journal of Magnetics
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• 제20권4호
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• pp.336-341
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• 2015

MnBi alloys were fabricated by arc melting and annealing at 573 K. The heat treatment enhanced the content of the low-temperature phase (LTP) of MnBi up to 83 wt%. The Bi-excess assisted LTP MnBi alloys were used in the hybridization with the Nd-Fe-B commercial Magnequench ribbons to form the hybrid magnets (100-x)NdFeB/xMnBi, x = 20, 30, 40, 50, and 80 wt%. The as-milled powder mixtures of Nd-Fe-B and MnBi were aligned in a magnetic field of 18 kOe and warm-compacted to anisotropic and dense bulk magnets at 573 K by 2,000 psi for 10 min. The magnetic ordering of two hard phase components strengthened by the exchange coupling enhanced the Curie temperature ($T_c$) of the magnet in comparison to that of the powder mixture sample. The prepared hybrid magnets were highly anisotropic with the ratio $M_r/M_s$ > 0.8. The exchange coupling was high, and the coercivity $_iH_c$ of the magnets was ~11-13 kOe. The maximum value of the energy product $(BH)_{max}$ was 8.4 MGOe for the magnet with x = 30%. The preparation of MnBi alloys and hybrid magnets are discussed in details.

• 한국자기학회:학술대회 개요집
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• 한국자기학회 2002년도 동계연구발표회 논문개요집
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• pp.150-151
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• 2002

In recent years, semi-metallic Bismuth (Bi) has attracted significant attention due to very large magnetoresistance (MR) at room temperature originating from long carrier mean free path l and small effective carrier mass m＊[1, 2]. In particular, the MR behavior and long carrier mean free path l in Bi thin films can be exploited for spintronic devices, e.g. magnetic field sensors and spin-valve transistors. In present work, we present the magnetotransport properties of the electroplated and sputtered Bi thin films in the temperature range 4-300 K. (omitted)

• Korean Journal of Mathematics
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• 제32권1호
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• pp.183-193
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• 2024

In this paper, a new class of bi-univalent functions that are described by Gegenbauer polynomials is presented. We obtain the estimates of the Taylor-Maclaurin coefficients |m₂| and |m₃| for each function in this class of bi-univalent functions. In addition, the Fekete-Szegö problems function new are also studied.

• 한국재료학회지
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• 제13권6호
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• pp.360-364
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• 2003

$Sr_{l}$ $\pm$x/$Bi_{2}$ $\pm$y/$Ta_2$ $O_{9}$ and $Sr_{l}$ $\pm$$Bi_{x}$ $2\pm$y$Nb_2$$O_{9}$ ceramics were prepared by a solid state reaction method. X-ray diffraction analysis indicated that single-phase of Bi-layered perovskite was obtained. According to Sr/Bi content ratio, Curie temperature( $T_{c}$), electromechanical factor($K_{p}$ ) and mechanical quality factor($Q_{m}$ ) were measured. The Curie temperature of SBN(SBT) rose from $414^{\circ}C$(314$^{\circ}C$) to $494^{\circ}C$(426$^{\circ}C$) when Sr/Bi content ratio was increased. In the case of Sr/Bi content ratio = 0.55/2.3, the maximum value of the mechanical quality factor $Q_{m}$ of SBT and SBN were obtained 3320 and 1010, respectively.

• 한국초전도저온공학회:학술대회논문집
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• 한국초전도저온공학회 1999년도 제1회 학술대회논문집(KIASC 1st conference 99)
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• pp.10-13
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• 1999

For large scale applications of high temperature superconductor(HTS) such as transmission cables, motors and generators, long length of flexible HTS conductors is required. Currently, HTS tape that is capable of being fabricated in long length by industrial processes is the Bi-2223 HTS tape. In this study, we fabricated 19 filamentary Bi-2223($Bi_{1.8}$$Pb_{0.4}$$Sr_{2}$$Ca_{2}$$Cu_{3}$$O_{10+X}$) HTS tape with 100m length by PIT(Powder In Tube) process. Critical current(Ic) of this long length tape was measured 18.5 A at 77 K, self field and short sample Ic is 32.5 A at the same condition. Critical current of 100m length tape was decreased by about 1/3 compared to that of short tape. This was mainly resulted from the increase of non homogeneity in oxide layer.

• 마이크로전자및패키징학회지
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• 제12권2호
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• pp.95-103
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• 2005

42Sn-58Bi 솔더(이하 wt.$\%$에 의한 표기)와 무전해 Ni-P/치환 Au under bump metallurgy (UBM) 간의 계면 반응을 intermetallic compound (IMC)의 형성과 성장, UBM의 감소, 그리고 범프 전단강도의 영향 관점에서 시효 처리 전 후에 어떠한 변화가 생기는 지를 알아보고자 하였다. 치환 Au 층을 $5{\mu}m$ 두께의 무전해 Ni-P ($14{\~}15 at.\%$ P)위에 세 가지 각기 다른 두께, 즉 $0{\mu}m$(순수한 무전해 Ni-P UBM), $0.1{\mu}m$, $1{\mu}m$로 도금하였다. 그 후 42Sn-58Bi 솔더 범프를 세 가지 다른 UBM 구조에 스크린프린팅 방식으로 형성하였다. 범프 형성 직후에는 세 가지 다른 UBM구조에서 솔더와 UBM 사이에 공통적으로 $Ni_3Sn_4$ IMC (IMC1) 만이 형성됐다. 하지만, 이를 $125^{\circ}C$에서 시효 처리를 할 경우 특이하게 Au를 함유한 UBM 구조에서는 $Ni_3Sn_4$ 위로 또 다른 4원계 화합물 (IMC2)이 관찰되었다. 원자 비로 $Sn_{77}Ni{15}Bi_6Au_2$인 4원계 화합물로 확인되었다. $Sn_{77}Ni{15}Bi_6Au_2$ 층은 솔더 조인트의 접합성에 매우 치명적인 영향을 미쳤다. 시효 처리를 거친 Au를 함유한 UBM 구조에서 솔더 범프의 전단 강도 값은 시효 처리 전에 비해 $40\%$ 이상의 감소를 보였다.

• 분석과학
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• 제11권4호
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• pp.281-291
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• 1998

혈액과 소변중의 미량 Cu, Sn 및 Bi를 유도결합 플라스마 질량분석법으로 동시 분석하였다. 혈액시료 1 mL를 closed-vessel digestion system에 넣고 질산과 과산화수소수를 가한 후 microwave oven에서 8분 동안 전처리하였다. Amberlite IRC-718 수지를 정지상으로 사용한, 고체-액체추출법으로 Na, S, P 및 polyatomic species에 의한 매트릭스 방해를 제거하였다. 위 방법에 대한 검출한계를 구한 결과 Cu는 0.000375 ng/mL, Sn 은 0.000297 ng/mL, Bi는 0.000174 ng/mL 이었다. NIST SRM 955a 혈액시료에 표준용액을 첨가하여 구한 회수율은 Cu의 경우 99.1%, Sn은 102.5%, Bi는 98.4%이었다. 아울러 본 연구에서 조사한 최적기기 및 분석조건에서 실제 혈액과 소변시료의 분석을 시도하였다.