• Korean Journal of Materials Research
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• v.5 no.2
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• pp.251-258
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• 1995

In an effort to increase the thermoelectric figure of merit by reducing the thermal conductivity, the unidirectionally solidified n-type (Bi, Pb)-Te based alloys which form a $Bi_{2}Te_{3}-PbBi_{4}Te_{7}$eutectic lamellar structure were investigated with the microstructural control at various solidification conditions. PbBi_{4}Te_{7}$ lamellae were grown on cleavage plane(0001) of $Bi_{2}Te_{3}$ and the interlamellar spacing decreased from 10.4 $\mu \textrm{m}$to 3.2$\mu \textrm{m}$ with growth velocity variation from 1.4 \times 10^{-4}$cm/sec to $8.3 \times 10^{-4}$cm/sec. Seebeck coefficient was constant, $\mid$$\alpha$$\mid$=29 $\mu$ V/K regardless of growth direction, growth velocity and temperature gradient. Electrical conductivity showed a tendency to decrease slightly with growth velocity and it parallel to growth direction was about three times as large as perpendicular direction. The figures of merit were varied differently from Seebeck coefficients and electrical conductivities depending on the growth direction, growth velocity and temperature gradients. They showed the relative increase in case of perpendicular direction compared with parallel to growth direction. It is believed to be due to the reduction of the thermal conductivity according to decrease of the interlamellar spacing.

• Journal of Welding and Joining
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• v.20 no.4
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• pp.505-509
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• 2002

Pb is considered to be eliminated from solder, due to its toxicity. However, melting temperatures of most Pb-free solders are known higher than that of Sn37Pb. Therefore, there is a difficulty to apply Pb-free solders to electronic industry. Since Sn3Ag8Bi5In has relatively lower melting range as $188~200^{\circ}C$, on this study. Wettability and soldering characteristics of Sn3Ag8Bi5In solder in BGA were investigated to solve for what kind of problem. Zero cross time, wetting time, and equilibrium force of Sn3Ag8Bi5In solder for Cu and plated Cu such as Sn, Ni, and Au/Ni-plated on Cu were estimated. Plated Sn on Cu showed best wettability for zero cross time, wetting time and equilibrium farce. Shear strength of the reflowed joint with Sn3Ag8Bi5In ball in BGA was investigated. Diameter of the ball was 0.5mm, UBM(under bump metallurgy) was $Au(0.5\mu\textrm{m})Ni(5\mu\textrm{m})/Cu(18\mu\textrm{m})$ and flux was RMA type. For the reflow soldering, the peak reflow temperature was changed in the range of $220~250^{\circ}C$, and conveyor speed was 0.6m/min.. The shear strength of Sn3Ag8Bi5In ball showed similar level as those of Sn37Pb. The soldered balls are aged at $110^{\circ}C$ for 36days and their shear strengths were evaluated. The shear strength of Sn3Ag8Bi5In ball was increased from 480gf to 580gf by aging for 5 days.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.09a
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• pp.203-215
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• 2002

Using eutectic In-Ag and Bi-Sn solder materials, we developed the COG technique having a minimum pitch of 50 ${\mu}{\textrm}{m}$. The maximum temperature in this process is $160^{\circ}C$. We fabricated spherical and uniform solder bumps by controlling the microstructure of Bi-Sn solder bumps. The contact resistances of Bi-Sn solder joints were 19 m$\Omega$ at $80{\mu}{\textrm}{m}$ pitch and 60 m$\Omega$ at $80{\mu}{\textrm}{m}$ pitch, respectively. These values are much lower than the contact resistance of the conventional ACF bonding. The contact resistances of the solder joint are almost the same before and after the underfill process. The contact resistance of the underfilled Bi-Sn solder joint did not change even after reliability test.

• Journal of Magnetics
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• v.20 no.4
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• pp.336-341
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• 2015

MnBi alloys were fabricated by arc melting and annealing at 573 K. The heat treatment enhanced the content of the low-temperature phase (LTP) of MnBi up to 83 wt%. The Bi-excess assisted LTP MnBi alloys were used in the hybridization with the Nd-Fe-B commercial Magnequench ribbons to form the hybrid magnets (100-x)NdFeB/xMnBi, x = 20, 30, 40, 50, and 80 wt%. The as-milled powder mixtures of Nd-Fe-B and MnBi were aligned in a magnetic field of 18 kOe and warm-compacted to anisotropic and dense bulk magnets at 573 K by 2,000 psi for 10 min. The magnetic ordering of two hard phase components strengthened by the exchange coupling enhanced the Curie temperature ($T_c$) of the magnet in comparison to that of the powder mixture sample. The prepared hybrid magnets were highly anisotropic with the ratio $M_r/M_s$ > 0.8. The exchange coupling was high, and the coercivity $_iH_c$ of the magnets was ~11-13 kOe. The maximum value of the energy product $(BH)_{max}$ was 8.4 MGOe for the magnet with x = 30%. The preparation of MnBi alloys and hybrid magnets are discussed in details.

• Proceedings of the Korean Magnestics Society Conference
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• 2002.12a
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• pp.150-151
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• 2002

In recent years, semi-metallic Bismuth (Bi) has attracted significant attention due to very large magnetoresistance (MR) at room temperature originating from long carrier mean free path l and small effective carrier mass m＊[1, 2]. In particular, the MR behavior and long carrier mean free path l in Bi thin films can be exploited for spintronic devices, e.g. magnetic field sensors and spin-valve transistors. In present work, we present the magnetotransport properties of the electroplated and sputtered Bi thin films in the temperature range 4-300 K. (omitted)

• Korean Journal of Mathematics
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• v.32 no.1
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• pp.183-193
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• 2024

In this paper, a new class of bi-univalent functions that are described by Gegenbauer polynomials is presented. We obtain the estimates of the Taylor-Maclaurin coefficients |m₂| and |m₃| for each function in this class of bi-univalent functions. In addition, the Fekete-Szegö problems function new are also studied.

• Korean Journal of Materials Research
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• v.13 no.6
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• pp.360-364
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• 2003

$Sr_{l}$ $\pm$x/$Bi_{2}$ $\pm$y/$Ta_2$ $O_{9}$ and $Sr_{l}$ $\pm$$Bi_{x}$ $2\pm$y$Nb_2$$O_{9}$ ceramics were prepared by a solid state reaction method. X-ray diffraction analysis indicated that single-phase of Bi-layered perovskite was obtained. According to Sr/Bi content ratio, Curie temperature( $T_{c}$), electromechanical factor($K_{p}$ ) and mechanical quality factor($Q_{m}$ ) were measured. The Curie temperature of SBN(SBT) rose from $414^{\circ}C$(314$^{\circ}C$) to $494^{\circ}C$(426$^{\circ}C$) when Sr/Bi content ratio was increased. In the case of Sr/Bi content ratio = 0.55/2.3, the maximum value of the mechanical quality factor $Q_{m}$ of SBT and SBN were obtained 3320 and 1010, respectively.

• Proceedings of the Korea Institute of Applied Superconductivity and Cryogenics Conference
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• 1999.02a
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• pp.10-13
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• 1999

For large scale applications of high temperature superconductor(HTS) such as transmission cables, motors and generators, long length of flexible HTS conductors is required. Currently, HTS tape that is capable of being fabricated in long length by industrial processes is the Bi-2223 HTS tape. In this study, we fabricated 19 filamentary Bi-2223($Bi_{1.8}$$Pb_{0.4}$$Sr_{2}$$Ca_{2}$$Cu_{3}$$O_{10+X}$) HTS tape with 100m length by PIT(Powder In Tube) process. Critical current(Ic) of this long length tape was measured 18.5 A at 77 K, self field and short sample Ic is 32.5 A at the same condition. Critical current of 100m length tape was decreased by about 1/3 compared to that of short tape. This was mainly resulted from the increase of non homogeneity in oxide layer.

• Journal of the Microelectronics and Packaging Society
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• v.12 no.2 s.35
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• pp.95-103
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• 2005

The interfacial reaction between 42Sn-58Bi solder (in wt.$\%$ unless specified otherwise) and electroless Ni-P/immersion Au has been investigated before and after thermal aging, with a focus on formation and growth of an intermetallic compound (IMC) layer, consumption of under bump metallurgy (UBM), and bump shear strength. The immersion Au layer with thicknesses of 0 (bare Ni), 0.1, and $1{\mu}m$ was plated on the $5{\mu}m$ thick electroless Ni-P ($14{\~}15 at.\%$P) layer. Then, the 42Sn-58Bi solder balls were fabricated on three different UBM structures by screen-printing and pre-reflow. The $Ni_3Sn_4$ layer (IMC1) was formed at the joint interface after pre-reflow for all the three UBM structures. On aging at $125^{\circ}C$, a quaternary phase (IMC2) was observed above the $Ni_3Sn_4$ layer in the Au-containing UBM structures, which was identified as $Sn_{77}Ni{15}Bi_6Au_2$ (in at.$\%$). The thick $Sn_{77}Ni{15}Bi_6Au_2$ layer deteriorated the integrity of the solder joint and the shear strength of the solder bump was decreased by about $40\%$ compared with non-aged joints.

• Analytical Science and Technology
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• v.11 no.4
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• pp.281-291
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• 1998

An analytical method for the simultaneous measurement of trace Cu, Sn, and Bi in blood and urine has been investigated by Inductively Coupled Plasma-Mass Spectrometry (ICP-MS). Microwave oven was used for the pretreatment of blood samples using nitric acid and hydrogen peroxide in a closedvessel digestion system with 1 mL whole blood for 8 minutes. Amberlite IRC-718 resin was used as a solid phase in solid-liquid extraction technique for the removal of matrix interferences such as Na, S, P, and other polyatomic ion species. Detection limits for Cu, Sn, and Bi by this method were 0.000375 ng/mL, 0.000297 ng/mL, and 0.000174 ng/mL, respectively. Recoveries of 99.1% for Cu, 102.5% for Sn, and 98.4% for Bi were obtained for the standard spiked NIST SRM 955a blood sample. The developed method was applied for whole real blood and urine samples.