• 제목/요약/키워드: Bi-materials

검색결과 1,361건 처리시간 0.03초

Wafer-Level MEMS Capping Process using Electrodeposition of Ni Cap and Debonding with SnBi Solder Layer (Ni 캡의 전기도금 및 SnBi 솔더 Debonding을 이용한 웨이퍼 레벨 MEMS Capping 공정)

  • Choi, J.Y.;Lee, J.H.;Moon, J.T.;Oh, T.S.
    • Journal of the Microelectronics and Packaging Society
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    • 제16권4호
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    • pp.23-28
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    • 2009
  • We investigated the wafer-level MEMS capping process for which cavity formation in Si wafer was not required. Ni caps were formed by electrodeposition on 4" Si wafer and Ni rims of the Ni caps were bonded to the Cu rims of bottom Si wafer by using epoxy. Then, top Si wafer was debonded from the Ni cap structures by using SnBi layer of low melting temperature. As-evaporated SnBi layer was composed of double layers of Bi and Sn due to the large difference in vapor pressures of Bi and Sn. With keeping the as-evaporated SnBi layer at $150^{\circ}C$ for more than 15 sec, SnBi alloy composed of eutectic phase and Bi-rich $\beta$ phase was formed by interdiffusion of Sn and Bi. Debonding between top Si wafer and Ni cap structures was accomplished by melting of the SnBi layer at $150^{\circ}C$.

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Study on Thermoelectric Properties of Cu Doping of Pulse-Electrodeposited n-type Bi2(Te-Se)3 Thin Films (펄스 전기도금법에 의해 제조된 n형 Bi2(Te-Se)3 박막의 Cu 도핑에 따른 열전특성에 관한 연구)

  • Heo, Na-Ri;Kim, Kwang-Ho;Lim, Jae-Hong
    • Journal of the Korean institute of surface engineering
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    • 제49권1호
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    • pp.40-45
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    • 2016
  • Recently, $Bi_2Te_3$-based alloys are the best thermoelectric materials near to room temperature, so it has been researched to achieve increased figure of merit(ZT). Ternary compounds such as Bi-Te-Se and Bi-Sb-Te have higher thermoelectric property than binary compound Bi-Te and Sb-Te, respectively. Compared to DC plating method, pulsed electrodeposition is able to control parameters including average current density, and on/off pulse time etc. Thereby the morphology and properties of the films can be improved. In this study, we electrodeposited n-type ternary Cu-doped $Bi_2(Te-Se)_3$ thin film by modified pulse technique at room temperature. To further enhance thermoelectric properties of $Bi_2(Te-Se)_3$ thin film, we optimized Cu doping concentration in $Bi_2(Te-Se)_3$ thin film and correlated it to electrical and thermoelectric properties. Thus, the crystal, electrical, and thermoelectric properties of electrodeposited $Bi_2(Te-Se)_3$ thin film were characterized the XRD, SEM, EDS, Seebeck measurement, and Hall effect measurement, respectively. As a result, the thermoelectric properties of Cu-doped $Bi_2(Te-Se)_3$ thin films were observed that the Seebeck coefficient is $-101.2{\mu}V/K$ and the power factor is $1412.6{\mu}W/mK^2$ at 10 mg of Cu weight. The power factor of Cu-doped $Bi_2(Te-Se)_3$ thin film is 1.4 times higher than undoped $Bi_2(Te-Se)_3$ thin film.

Recent Progress in Bi-Te-based Thermoelectric Materials (Bi-Te계 열전소재 연구 동향)

  • Lee, Kyu Hyoung;Kim, Jong-Young;Choi, Soon-Mok
    • Journal of the Korean Ceramic Society
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    • 제52권1호
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    • pp.1-8
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    • 2015
  • Thermoelectric (TE) technology is becoming increasingly important in applications of solid-state cooling and renewable energy sources. $Bi_2Te_3$-based TE materials are widely used in small-scale cooling and temperature control applications; however, higher levels of TE performance are required for new applications such as large-scale cooling (e.g., domestic refrigerators or air conditioners) and for highly efficient power generation system. Recently, the TE performance of $Bi_2Te_3$-based materials has been remarkably enhanced by the introduction of nanostructuring technologies which can be used to prepare TE raw materials. Because it takes into account the theoretical and experimental characteristics, nanostructuring has been shown to be one of the most promising ways to realize the simultaneous control of the electronic and thermal transport properties. In this review, emphasis is placed on bulk-type nanostructured $Bi_2Te_3$-based TE materials. Nanostructuring technologies for enhanced TE performance are summarized, and a few important strategies are presented.

High Electrochemical Activity of Bi2O3-based Composite SOFC Cathodes

  • Jung, Woo Chul;Chang, Yun-Jie;Fung, Kuan-Zong;Haile, Sossina
    • Journal of the Korean Ceramic Society
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    • 제51권4호
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    • pp.278-282
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    • 2014
  • Due to high ionic conductivity and favorable oxygen electrocatalysis, doped $Bi_2O_3$ systems are promising candidates as solid oxide fuel cell cathode materials. Recently, several researchers reported reasonably low cathode polarization resistance by adding electronically conducting materials such as (La,Sr)$MnO_3$ (LSM) or Ag to doped $Bi_2O_3$ compositions. Despite extensive research efforts toward maximizing cathode performance, however, the inherent catalytic activity and electrochemical reaction pathways of these promising materials remain largely unknown. Here, we prepare a symmetrical structure with identically sized $Y_{0.5}Bi_{1.5}O_3$/LSM composite electrodes on both sides of a YSZ electrolyte substrate. AC impedance spectroscopy (ACIS) measurements of electrochemical cells with varied cathode compositions reveal the important role of bismuth oxide phase for oxygen electrocatalysis. These observations aid in directing future research into the reaction pathways and the site-specific electrocatalytic activity as well as giving improved guidance for optimizing SOFC cathode structures with doped $Bi_2O_3$ compositions.

Characterizations of fine Bi-2223 precursor powder by spray pyrolysis process (분무 열분해법으로 제조된 미세 Bi-2223 전구분말의 특성)

  • Kim S. H.;Yoo J. M.;Ko J. W.;Kim Y. K.
    • Progress in Superconductivity
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    • 제6권2호
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    • pp.124-128
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    • 2005
  • Homogeneous and fine powders for Bi-2223 tape were prepared by ultrasonic spray pyrolysis (SP) method from an aqueous solution of metal nitrates. Bi-2223 precursor powders were synthesized with various solutes concentration and pyrolysis temperature. The synthesized precursor powders had a narrow particle size distribution and an average particle size was $\~{\cal}um$. The reactivity of precursor powder by SP method is very high, attributed to the fine and narrow particle size distribution. Bi-2223/Ag tape was prepared using PIT method and followed by various sintering conditions. The precursor powder by SP method promoted a very quick formation of the Bi-2223 phase for short sintering time while the secondary phase such as large AEC phase and $Ca_2PbO_4$ were minimized for SP tapes.

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P-type and N-type $Bi_2Te_3/PbTe$ Functional Gradient Materials for Thermoelectric Power Generation

  • Lee, Kwang-Yong;Oh, Tae-Sung
    • Proceedings of the Korean Powder Metallurgy Institute Conference
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    • 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part2
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    • pp.1223-1224
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    • 2006
  • The p-type $(Bi_{0.2}Sb_{0.8})_2Te_3/(Pb_{0.7}Sn_{0.3})$Te functional gradient material (FGM) was fabricated by hot-pressing the mechanically alloyed $(Bi_{0.2}Sb_{0.8})_2Te_3$ and the 0.5 at% $Na_2Te-doped$ $(Pb_{0.7}Sn_{0.3})Te$ powders. Also, the n-type $Bi_2(Te_{0.9}Se_{0.1})_3/PbTe$ FGM was processed by hot-pressing the mechanically alloyed $Bi_2(Te_{0.9}Se_{0.1})_3$ and the 0.3 wt% Bi-doped PbTe powders. With ${\Delta}T$ larger than $300^{\circ}C$, the p-type $(Bi_{0.2}Sb_{0.8})_2Te_3/(Pb_{0.7}Sn_{0.3})Te$ FGM exhibited larger thermoelectric output power than those of the $(Bi_{0.2}Sb_{0.8})_2Te_3$ and the 0.5 at% $Na_2Te-doped$ $(Pb_{0.7}Sn_{0.3})Te$ alloys. For the n-type $Bi_2(Te_{0.9}Se_{0.1})_3/PbTe$ FGM, the thermoelectric output power superior to those of the $Bi_2(Te_{0.9}Se_{0.1})_3$ and the 0.3 wt% Bi-doped PbTe was predicted at ${\Delta}T$ larger than $300^{\circ}C$.

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