• Journal of Information Display
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• v.1 no.1
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• pp.63-69
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• 2000

In order to improve both the level and the stability of electron emission, Mo and Co silicides were formed from Mo mono-layer and Ti/Co bi-layers on single crystal silicon field emitter arrays (FEAs), respectively. Using the slope of Fowler-Nordheim curve and tip radius measured from scanning electron microscopy (SEM), the effective work function of Mo and Co silicide FEAs were calculated to be 3.13 eV and 2.56 eV, respectively. Compared with silicon field emitters, Mo and Co silicide exhibited 10 and 34 times higher maximum emission current, 10 V and 46 V higher device failure voltage, and 6.1 and 4.8 times lower current fluctuation, respectively. Moreover, the emission currents of the silicide FEAs depending on vacuum level were almost the same in the range of $10^{-9}{\sim}10^{-6}$ torr. This result shows that silicide is robust in terms of anode current degradation due to the absorption of air molecules.

• Proceedings of the KIEE Conference
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• 2001.07c
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• pp.1518-1520
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• 2001

Bi-layer Mo films were deposited on sodalime glass substrates using DC magnetron sputtering. As the gas pressure and power density, the resistivity varied from $1.5{\times}10^{-5}$ to $4.97{\times}10^{-4}{\Omega}{\cdot}cm$. Furthermore, stress direction yielded compressive-to-tensile transition stress curves. The microstructure of the compressive stress films which had poor adhesion consists of tightly packed columns, but of the tensile-stressed films had less dense structure. Under all gas pressure conditions, Mo films exhibited distinctly increasing optical reflection with decreasing gas pressure. The expansion of (110) peak width with the gas pressure meant the worse crystalline growth. Also, The highest efficiency was 15.2% on 0.2 $cm^2$. The fill factor, open circuit voltage and short circuit current were 63 %, 570 mV and 42.6 mA/$cm^2$ respectively.

• Transactions on Electrical and Electronic Materials
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• v.1 no.1
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• pp.40-44
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• 2000

Metal-ferroelectric-insulator-semoiconductor field effect transistor (MFISFETs) were fabricated using CMOS processes. The Pt/SBT/NO combined layers were etched for forming a conformal gate by using Ti/Cr metal masks and a two step etching method, By the method, we were able to fabricate a small-sized gate with the dimension of $16/4{\mu}textrm{m}$ in the width/length of gate. It has been chosen the non-self aligned source and drain implantation process, We have deposited inter-layer dielectrics(ILD) by low pressure chemical vapor deposition(LPCVD) at $380^{circ}C$ after etching the gate structure and the threshold voltage of p-channel MFISFETs were about 1.0 and -2.1V, respectively. It was also observed that the current difference between the $I_{ON}$(on current) and $I_{OFF}$(off current) that is very important in sensing margin, is more that 100 times in $I_{D}-V_{G}$ hysteresis curve.

• JSTS:Journal of Semiconductor Technology and Science
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• v.1 no.3
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• pp.141-157
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• 2001

Highly reliable packaged 64kbit ferroelectric memories with $0.8{\;}\mu\textrm{m}$ CMOS ensuring ten-year retention and imprint at 125^{\circ}C$ have been successfully developed. These superior reliabilities have resulted from steady integration schemes free from the degradation, due to layer stress and attacks of process impurities. The resent results of research and development for ferroelectric memories at Hynix Semiconductor Inc. are summarized in this invited paper.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.74-79
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• 2000

In an attempt to estimate the wetting properties of wettable metal layers by wetting balance method, an analysis of wetting curves of the coating layer was performed. Based on the analysis, wetting properties of UBM-coated Si-plate were estimated by the new wettability indices. The wetting curves of the one and both sides-coated UBM layers have the similar shape and show the similar tendency to the temperature. So the wetting property estimation of one side coating is possible with wetting balance method. For UBM of Si-chip, Cr/Cu/Au UBM is better than Ti/Ni/Au in the point of wetting time. At general reflow temperature, the wettability of high melting point solders(Sn-Sb, Sn-Ag) is better than that of few melting point ones(Sn-Bi, Sn-In).The contact angle of the one side coated plate to the solder can be calculated from the farce balance equation by measuring the static state force and the tilt angle.

• Proceedings of the Materials Research Society of Korea Conference
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• 2010.05a
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• pp.32.1-32.1
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• 2010

본 연구에서는 질화물계 발광 다이오드의 광추출효율을 향상시키기 위해서 Bi-layer나노 임프린트 리소그래피와 Lift-off 공정을 이용하여 ITO투명전극 층 상부에 TiO2 나노 패턴을 형성하였다. 발광 다이오드의 투명전극 층 상부에 UV 나노 임프린트 리소그래피를 이용하여 주기적인 폴리머 패턴을 형성한 후 폴리머 패턴 상부에 RF magnetron Sputtering 공법을 이용하여 TiO2를 증착하고 Lift-off 공정을 이용하여 TiO2 나노 패턴을 제작하였다. 그 결과를 주사전사 현미경(SEM)으로 확인한 결과 임프린트 스탬프와 동일한 나노 패턴이 질화물 계 발광다이오드 투명 전극층 표면에 주기적으로 형성되었다. TiO2 나노 패턴 형성을 통한 광추출 효율의 향상 효과를 확인하기 위해 Electroluminescence (EL) 측정한 결과 TiO2 나노 패턴이 형성된 발광다이오드 소자의 EL 강도가 나노 패턴이 없는 발광다이오드와 비교하여 12% 정도 향상 되었음을 보였고, 이는 고 굴절율 나노 패턴이 활성층에서 발생된 빛의 산란 효과를 유도하여 빛의 내부 전반사를 감소시킨 결과로 해석된다. 또한 소자의 전기적 특성평가를 위한 I-V 측정결과, TiO2 나노 패턴이 형성된 발광 다이오드의 전기적 성질이 저하되지 않았음을 확인하였다.

• Proceedings of the Materials Research Society of Korea Conference
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• 2010.05a
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• pp.12.1-12.1
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• 2010

We have developed a facile method to position different dyes (N719 and N749) sequentially in a mesoporous TiO2 layer through selective desorption and adsorption processes. Only upper part of the first adsorbed N719 dye was selectively removed by the desorption solution formulated with polypropylene glycol and tetrabutylammonium hydroxide without any damages of the dye. The desorption depth was controlled by the number of desorption process. Multi-dyed dye-sensitized solar cells (MDSSC) were fabricated by utilizing the method and their photovoltaic properties were investigated. From the incident photon-to-current conversion efficiency (IPCE) measurement, it was found that the MDSSC exhibited the extended spectral response for the solar spectrum while without decrease of maximum IPCE value compare to the DSSCs using one kind of dye (N719 or N749). The highest photocurrent density of 19.3 mA/cm2 was obtained from the MDSSC utilizing $15\;{\mu}m$ N719 / $14\;{\mu}m$ N749 bi-layered mesoporous TiO2 film. The photocurrent density was 25% and 8% higher than that of the DSSC using only N719 and N749 dye as a sensitizer, respectively. The power conversion efficiency of 9.8% was achieved from the MDSSC under the AM 1.5G one sun illumination.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2002.05c
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• pp.63-66
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• 2002

Bi-layer Mo films were deposited on sodalime glass substrates using DC magnetron sputtering. As the gas pressure and power density, the resistivity varied from $1.5{\times}10^{-5}$ to $4.97{\times}10^{-4}{\Omega}{\cdot}cm$. Furthermore, stress direction yielded compressive-to-tensile transition stress curves. The microstructure of the compressive stress films which had poor adhesion consists of tightly packed columns, but of the tensile-stressed films had less dense structure. Under all gas pressure conditions, Mo films exhibited distinctly increasing optical reflection with decreasing gas pressure. The expansion of (110) peak width with the gas pressure meant the worse crystalline growth. Also, The highest efficiency was 15.2% on 0.2 $cm^2$. The fill factor, open circuit voltage and short circuit current were 63 %, 570 m V and 42.6 $mA/cm^2$ respectively.

• Journal of Sensor Science and Technology
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• v.16 no.4
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• pp.259-262
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• 2007

This paper describes the electrical characteristics of polycrystalline (poly) 3C-SiC thin film diodes, in which poly 3C-SiC thin films on n-type and p-type Si wafers, respectively, were deposited by APCVD using HMDS, $H_{2}$, and Ar gas at $1150^{\circ}C$ for 3 hr. The schottky diode with Au/poly 3C-SiC/Si (n-type) structure was fabricated. Its threshold voltage ($V_{bi}$), breakdown voltage, thickness of depletion layer, and doping concentration ($N_{D}$) value were measured as 0.84 V, over 140 V, 61 nm, and $2.7{\times}10^{19}cm^{-3}$, respectively. Moreover, for the good ohmic contact, Al/poly 3C-SiC/Si (n-type) structure was annealed at 300, 400, and $500^{\circ}C$, respectively for 30 min under the vacuum condition of $5.0{\times}10^{-6}$ Torr. Finally, the p-n junction diodes fabricated on the poly 3C-Si/Si (p-type) were obtained like characteristics of single 3CSiC p-n junction diode. Therefore, poly 3C-SiC thin film diodes will be suitable for microsensors in conjunction with Si fabrication technology.

• Journal of Korean Society on Water Environment
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• v.25 no.6
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• pp.935-942
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• 2009

During period of the rainy season of spring tide Aug. 2005, the suspended sediment transport rate from Seomjin River increased ten times as high as neap tide of low river discharge. During ebb tide of high terrestrial input, the grain size of suspended particles of both surface and bottom layer of the water column, showed a uni-modal distribution with a dominant peak at coarse fraction, which suggests a characteristic development of floc-sized particles of low mean effective density. On the contrary, the particles supplied toward upstream of Seomjin river from Gwangyang Bay during flood tide showed a bi-modal distribution with a secondary peak at finer fraction, possibly due to the resuspension and the deflocculation associated with the increased shear velocity at near bottom. Break-up of large flocs is also suggested by the increased mean effective density. However, settling velocity was lower during flood tide because of smaller grain size. Thus, net deposition of suspended sediment is expected at within Gwangyang Bay instead of upstream of Seomjin River, even though suspended sediment transport rate at near bottom water was three times higher than that at surface water during flood tide.