• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.10a
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• pp.343-346
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• 2004

In recent years, various forms of indentation testing have been increasingly used to determine the material properties of specimens. This technique, particularly the nano-indentation method , has been extended to the testing of coating systems in order to calculate the individual properties of the thin coatings and the substrates. However, the interpretation of the test data to achieve this is complex and continues to be a widely studied subject. Based on the finite element method of coated surfaces indented by a Berkovich diamond tip, this paper describes methods for combining FEM and experimental indentation testing to determine coating modulus and hardness independent of substrate effects. Using this proposed methodology, testing and FEM to measure coefficients of friction of sheet steel for outer panel were studied.

• Journal of the Korean Society for Precision Engineering
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• v.21 no.4
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• pp.24-31
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• 2004

The objective of this work is to suggest a mastless pattern fabrication technique using the combination of machining by Nanoindenter(equation omitted) XP and HF wet etching. Sample line patterns were machined on a borosilicate surface by constant load scratch (CLS) of the Nanoindenter(equation omitted) XP with a Berkovich diamond tip, and they were etched in HF solution to investigate chemical characteristics of the machined borosilicate surface. All morphological data of scratch traces were scanned using atomic force microscope (AFM).

• Journal of the Korean Society for Precision Engineering
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• v.21 no.3
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• pp.139-146
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• 2004

In this study, to achieve the optimal conditions for mechanical hyper-fine pattern fabrication process, deformation behavior of the materials during indentation scratch test was studied with numerical method by ABAQUS S/W. Brittle materials (Si, Pyrex glass 7740) were used as specimens, and forming conditions to reduce the elastic recovery and pile-up were proposed. The indenter was modeled as a rigid surface. Minimum mesh sizes of specimens are 1-l0nm. Variables of the nanoindentation scratch test analysis are scratching speed, scratching load, tip radius and tip geometry. The nano-indentation scratch tests were performed by using the Berkovich pyramidal diamond indenter. Comparison between the experimental data and numerical result demonstrated that the FEM approach can be a good model of the nanoindentation scratch test. The result of the investigation will be applied to the fabrication of the hyper-fine pattern.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2000.11a
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• pp.3-4
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• 2000

Many researchers are interested in the synthesis and characterization of carbon nitride and diamond-like carbon (DLq because they show excellent mechanical properties such as low friction and high wear resistance and excellent electrical properties such as controllable electical resistivity and good field electron emission. We have deposited amorphous carbon nitride (a-C:N) thin films and DLC thin films by shielded arc ion plating (SAIP) and evaluated the structural and tribological properties. The application of appropriate negative bias on substrates is effective to increase the film hardness and wear resistance. This paper reports on the deposition and tribological OLC films in relation to the substrate bias voltage (Vs). films are compared with those of the OLC films. A high purity sintered graphite target was mounted on a cathode as a carbon source. Nitrogen or argon was introduced into a deposition chamber through each mass flow controller. After the initiation of an arc plasma at 60 A and 1 Pa, the target surface was heated and evaporated by the plasma. Carbon atoms and clusters evaporated from the target were ionized partially and reacted with activated nitrogen species, and a carbon nitride film was deposited onto a Si (100) substrate when we used nitrogen as a reactant gas. The surface of the growing film also reacted with activated nitrogen species. Carbon macropartic1es (0.1 -100 maicro-m) evaporated from the target at the same time were not ionized and did not react fully with nitrogen species. These macroparticles interfered with the formation of the carbon nitride film. Therefore we set a shielding plate made of stainless steel between the target and the substrate to trap the macropartic1es. This shielding method is very effective to prepare smooth a-CN films. We, therefore, call this method "shielded arc ion plating (SAIP)". For the deposition of DLC films we used argon instead of nitrogen. Films of about 150 nm in thickness were deposited onto Si substrates. Their structures, chemical compositions and chemical bonding states were analyzed by using X-ray diffraction, Raman spectroscopy, X-ray photoelectron spectroscopy and infrared spectroscopy. Hardness of the films was measured with a nanointender interfaced with an atomic force microscope (AFM). A Berkovich-type diamond tip whose radius was less than 100 nm was used for the measurement. A force-displacement curve of each film was measured at a peak load force of 250 maicro-N. Load, hold and unload times for each indentation were 2.5, 0 and 2.5 s, respectively. Hardness of each film was determined from five force-displacement curves. Wear resistance of the films was analyzed as follows. First, each film surface was scanned with the diamond tip at a constant load force of 20 maicro-N. The tip scanning was repeated 30 times in a 1 urn-square region with 512 lines at a scanning rate of 2 um/ s. After this tip-scanning, the film surface was observed in the AFM mode at a constant force of 5 maicro-N with the same Berkovich-type tip. The hardness of a-CN films was less dependent on Vs. The hardness of the film deposited at Vs=O V in a nitrogen plasma was about 10 GPa and almost similar to that of Si. It slightly increased to 12 - 15 GPa when a bias voltage of -100 - -500 V was applied to the substrate with showing its maximum at Vs=-300 V. The film deposited at Vs=O V was least wear resistant which was consistent with its lowest hardness. The biased films became more wear resistant. Particularly the film deposited at Vs=-300 V showed remarkable wear resistance. Its wear depth was too shallow to be measured with AFM. On the other hand, the DLC film, deposited at Vs=-l00 V in an argon plasma, whose hardness was 35 GPa was obviously worn under the same wear test conditions. The a-C:N films show higher wear resistance than DLC films and are useful for wear resistant coatings on various mechanical and electronic parts.nic parts.

• Journal of the Korean Vacuum Society
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• v.18 no.5
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• pp.372-376
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• 2009

In the modern semiconductor industry, lithography process is used to construct specific patterns. However, due to the decreasing of line width, these days, more and more researchers are interested in PMMA(Poly Methyl Methacrylate) lithography by using e-beam instead of the prior method, PR(Photoresist) lithography by using UV(Ultra-Violet). Additionally, the patterns constructed by lithography are collapsed during the process of cleansing remnants and the resistance against the breakdown of the patterns is known to be proportional to the elastic modulus of pattern-constructing materials. In this research, we measured the change of hardness and elastic modulus of PMMA film surface according to the change of time spent to soft-bake the PMMA film. During the measurement, we controlled the tip pressure from $25{\mu}N$ to $8,500{\mu}N$ having intervals that are $134.52{\mu}N$. For these measurements, we used the Triboindenter from Hysitron to gauge the hardness and elastic modulus and the tip we used was Berkovich diamond Tip.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.1507-1510
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• 2005

This study was carried out as a part of the research on the development of a maskless and electroless process for fabricating metal micro/nanostructures by using a nanoindenter and an electroless deposition technique. $2-\mu{m}-deep$ indentation tests on Ni and Cu samples were performed. The elastic recovery of the Ni and Cu was 9.30% and 9.53% of the maximum penetration depth, respectively. The hardness and the elastic modulus were 1.56 GPa and 120 GPa for Ni and 1.49 GPa and 100 GPa for Cu. The effect of single-point diamond machining conditions such as the Berkovich tip orientation (0, 45, and $90^{\circ}$) and the normal load (0.1, 0.3, 0.5, 1, 3, and 5 mN), on both the deformation behavior and the morphology of cutting traces (such as width and depth) was investigated by constant-load scratch tests. The tip orientation had a significant influence on the coefficient of friction, which varied from 0.52-0.66 for Ni and from 0.46-0.61 for Cu. The crisscross-pattern sample showed that the tip orientation strongly affects the surface quality of the machined area during scratching. A selective deposition of Cu at the pit-like defect on a p-type Si(111) surface was also investigated. Preferential deposition of the Cu occurred at the surface defect sites of silicon wafers, indicating that those defect sites act as active sites for the deposition reaction. The shape of the Cu-deposited area was almost the same as that of the residual stress field.

• Journal of the Korean Society for Precision Engineering
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• v.23 no.8 s.185
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• pp.171-177
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• 2006

This study was performed as a part of the research on the development of a maskless and electroless process for fabricating metal micro/nanostructures by using a nanoindenter and an electroless deposition technique. $2-{\mu}m$-deep indentation tests on Ni and Cu samples were performed. The elastic recovery of the Ni and Cu was 9.30% and 9.53% of the maximum penetration depth, respectively. The hardness and the elastic modulus were 1.56 GPa and 120 GPa for Ni and 1.51 GPa and 104 GPa for Cu. The effect of single-point diamond machining conditions such as the Berkovich tip orientation (0, 45, and $90^{\circ}$ ) and the normal load (0.1, 0.3, 0.5, 1, 3, and 5 mN), on both the deformation behavior and the morphology of cutting traces (such as width and depth) was investigated by constant-load scratch tests. The tip orientation had a significant influence on the coefficient of friction, which varied from 0.52-0.66 for Ni and from 0.46- 0.61 for Cu. The crisscross-pattern sample showed that the tip orientation strongly affects the surface quality of the machined are a during scratching. A selective deposition of Cu at the pit-like defect on a p-type Si(111) surface was also investigated. Preferential deposition of the Cu occurred at the surface defect sites of silicon wafers, indicating that those defect sites act as active sites for the deposition reaction. The shape of the Cu-deposited area was almost the same as that of the residual stress field.

• Transactions of Materials Processing
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• v.12 no.7
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• pp.640-646
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• 2003

The nanoprobe based on lithography, mainly represented by SPM based technologies, has been recognized as potential application to fabricate the surface nanostructures because of its operational versatility and simplicity. The objective of the work is to suggest new mastless pattern fabrication technique using the combination of machining by nanoindenter and KOH wet etching. The scratch option of the nanoindenter is a very promising method for obtaining nanometer scale features on a large size specimen because it has a very wide working area and load range. Sample line patterns were machined on a silicon surface, which has a native oxide on it, by constant load scratch (CLS) of the Nanoindenter with a Berkovich diamond tip, and they were etched in KOH solutions to investigate chemical characteristics of the machined silicon surface. After the etching process, the convex structure was made because of masking effect of the affected layer generated by nano-scratch. On the basis of this fact, some line patterns with convex structures were fabricated. Achieved patterns can be used as a mold that will be used for mass production processes such as nanoimprint or PDMS molding process. All morphological data of scratch traces were scanned using atomic force microscope (AFM).

• Transactions of the Korean Society of Mechanical Engineers A
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• v.33 no.9
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• pp.859-869
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• 2009

The sharp indenters such as Berkovich and conical indenters have a geometrical self-similarity in theory, but different materials have the same load-depth curve in case of single indentation. In this study, we analyze the load-depth curves of conical indenter with angles of indenter via finite element method. From FE analyses of dual-conical indentation test, we investigate the relationships between indentation parameters and load-deflection curves. With numerical regressions of obtained data, we finally propose indentation formulae for material properties evaluation. The proposed approach provides stress-strain curve and the values of elastic modulus, yield strength and strain-hardening exponent with an average error of less than 2%. It is also discussed that the method is valid for any elastically deforming indenters made of tungsten carbide and diamond for instance. The proposed indentation approach provides a substantial enhancement in accuracy compared with the prior methods.