• 한국신재생에너지학회:학술대회논문집
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• 2010.06a
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• pp.58.1-58.1
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• 2010

In solar cell module manufacturing, single solar cells has to be joined electrically to strings. Copper stripes coated with tin-silver-copper alloy are joined on screen printed silver of solar cells which is called busbar. The bus bar collects the electrons generated in solar cell and it is connected to the next cell in the conventional module manufacturing by a metal stringer using conventional hot air or infrared lamp soldering systems. For thin solar cells, both soldering methods have disadvantages, which heats up the whole cell to high temperatures. Because of the different thermal expansion coefficient, mechanical stresses are induced in the solar cell. Recently, the trend of solar cell is toward thinner thickness below 180um and thus the risk of breakage of solar cells is increasing. This has led to the demand for new joining processes with high productivity and reduced error rates. In our project, we have developed a new method to solder solar cells with a laser heating source. The soldering process using diode laser with wavelength of 980nm was examined. The diode laser used has a maximum power of 60W and a scanner system is used to solder dimension of 6" solar cell and the beam travel speed is optimized. For clamping copper stripe to solar cell, zirconia(ZrO)coated iron pin-spring system is used to clamp both joining parts during a scanner system is traveled. The hot plate temperature that solar cell is positioned during lasersoldering process is optimized. Also, conventional solder joints after $180^{\circ}C$ peel tests are compared to the laser soldering methods. Microstructures in welded zone shows that the diffusion zone between solar cell and metal stripes is better formed than inIR soldering method. It is analyzed that the laser solder joints show no damages to the silicon wafer and no cracks beneath the contact. Peel strength between 4N and 5N are measured, with much shorter joining time than IR solder joints and it is shown that the use of laser soldering reduced the degree of bending of solar cell much less than IR soldering.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.8 no.3
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• pp.508-512
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• 1998

The NTC thermistors were sintered by using microwave hybrid heating method at $1100^{\circ}C$~$1300^{\circ}C$ and those electrical properties were investigated. The obtained $B_{25^{\circ}C/85^{\circ}C}$ values from temperature dependence of electrical resisitivity were around 3100~3200 K which were almost the same values as conventionally sintered ones. Compared with conventional sintering process, this process could complete whole sintering process within 20 minutes. This the processing time and energy consumption could be reduced through this rapid heating by using microwave hybrid heating.t there were showed only two peaks, glycolide melting peak and lower molecular weight melting peak without lauryl alcohol. Conversion increased slowly with the reaction time up to 50 minutes, and then gave a sudden increase above that. The reaction time to disappear in glycolide melting peak during polymerization was shortened with the increase of lauryl alcohol content. Zero-shear viscosity of polyglycolic acid decreased with the increase of free acid content in glycolide.ssional energy and bending hysteresis increased. \circled3 Surface characteristics such as friction coefficient and thickness variation of highly shrinkage fabrics became relatively roughened state. \circled4 Since stiffened and roughened characteristics of highly shrinkage fabrics, drapabilities of them were significantly lowered. Additionally thermal insulation property of high shrinkage fabric was higher than that of low shrinkage fabric due to bulky and thickened feature. From the results, it is considered that the silk fabrics with high filling shrinkage have the good bulkiness and heat keeping properties and thus they have the suitable characteristics for high quality men's and women's formal garments.

• Journal of the Korean Society for Precision Engineering
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• v.17 no.10
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• pp.192-199
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• 2000

The design of multi-stage gear drives is a time-consuming process because it includes more complicated problems, which are not considered in the design of single-stage gear drives. The designer has no determine the number of reduction stages and the gear ratios of each reduction stage. In addition, the design problems include not only dimensional design but also configuration design of gear drive elements. There is no definite rule or principle for these types of design problems. Thus the design practices largely depend on the sense and the experiences of the designer, and consequently result in undesirable design solution. A new and generalized design algorithm has been proposed to support the designer at the preliminary phase of the design of multi-stage gear drives. The proposed design algorithm automates the design process by integrating the dimensional design and the configuration design process. The algorithm consists of four steps. In the first step, the user determines the number of reduction stages. In the second step, gear ratios of every stage are chosen using the random search method. The values of the basic design parameters of a gear are chose in the third step by using the generate and test method. Then the values of the dimensions, such as pitch diameter, outer diameter and face width, are calculated for the configuration design in the next step. The strength and durability of each gear is guaranteed by the bending strength and the pitting resistance rating practices by using AGMA rating formulas. In the final step, the configuration design is carried out using simulated annealing algorithm. The positions of gears and shafts are determined to minimize the geometrical volume (size) of a gearbox while avoiding interferences between them. These steps are carried out iteratively until a desirable solution is acquired. The proposed design algorithm is applied to the preliminary design of four-stage gear drives in order to validate the availability. The design solution has considerably good results in both aspects of the dimensional and the configuration design.

• Science of Emotion and Sensibility
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• v.13 no.4
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• pp.687-692
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• 2010

This paper surveys emission characteristics of Far-infrared of the fabrics fabricated with germanium imbedded sheath-core conjugate composite filaments. For this purpose, master batch chip was prepared with PET semi-dull chip and nano sized germanium particles and sheath-core type conjugate composite filament was spun using this master batch chip and polyester semi dull. The emission power and emissivity of the germanium imbedded fabrics were measured and investigated using FT-IR spectrophotometer by KICM- FIR 1005 measurement method. In addition, the fabric mechanical properties were measured and discussed with the effects of the optimum texturing process conditions and fabric structural design conditions. The sheath/core type PET composite germanium imbedded filaments were manufactured by the optimum spinning condition, its tenacity and breaking strain showed the same level as the regular PET filament. The tenacity and breaking strain of the DTY showed good physical properties and no problem in the weaving process. Then, wet and dry shrinkages showed higher values than those of regular PET filament. The emission power of the germanium imbedded fabric was $3.53{\times}10^2W/m^2$ at the $5-20{\mu}m$ wave length range, and emissivity was 0.874. The fabric hand of germanium imbedded fabrics was inhanced by the optimum texturing process and fabric structural design with improved mechanical properties such as fabric bending and compressional properties.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.21 no.1
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• pp.21-26
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• 2011

Ni-YSZ (Yttria Stabilized Zirconia) composite powders were fabricated by glycine nitrate process. The prepared powders were sintered at $1300{\sim}1400^{\circ}C$ for 4 h in air and reduced at $1000^{\circ}C$ for 2 h in a nitrogen and hydrogen atmosphere. The microstructure, electrical conductivity, thermal expansion and mechanical properties of the Ni-YSZ cermets have been investigated with respect to the volume contents of Ni. A porous microstructure consisting of homogeneously distributed Ni and YSZ phases together with well-connected grains was observed. It was found that the open porosity, electrical conductivity, thermal expansion and bending strength of the cermets are sensitive to the volume content of Ni. The Ni-YSZ cermet containing 40 vol% Ni was ascertained to be the optimum composition. This composition offers sufficient open porosity of more than 30 %, superior electrical conductivities of 917.4 S/cm at $1000^{\circ}C$ and a moderate average thermal expansion coefficient of $12.6{\times}10^{-6}^{\circ}C^{-1}$ between room temperature and $1000^{\circ}C$.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.29 no.5
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• pp.215-221
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• 2019

Ceramic tiles, which are widely used as interior and exterior materials for construction, have recently been required to have pollution prevention function. In order to remove contaminants, many researches of ceramic tiles with hydrophilic surface property through $TiO_2$ coating and hydrophobic surface property by improving the flow of water droplets have been proceeded. Expecially, it is very important to develop a surface glaze having hydrophobicity through a sintering process above $1000^{\circ}C$ without an additional coating process and the degradation of mechanical properties. In this study, surface glaze with copper powder was applied to manufacture of ceramic tile. Contact angle of ceramic tile according to thickness of surface glaze layer was investigated after the conventional sintering process. The contact angle of the ceramic tile surface without the copper powder was shown to be $25.3^{\circ}$, which is close to hydrophilic surface. However, the contact angle was increased up to $109.8^{\circ}$ when the thickness of surface glaze with the copper powder was $150{\mu}m$. The excellent hydrophobic property of the surface glaze with copper powder was resulted from the cellular structure of copper particles on the glaze surface. In addition, the mechanical properties of the developed hydrophobic ceramic tiles such as bending strength, chemical resistance, abrasion resistance, and frost resistance were well maintained and meet the criteria of 'KS L 1001 Ceramic tile'.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.2
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• pp.113-119
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• 2022

In order to improve the mechanical reliability of next-generation electronic devices including flexible, wearable devices, a high level of mechanical reliability is required at various flexible joints. Organic adhesive materials such as epoxy for bonding existing polymer substrates inevitably have an increase in the thickness of the joint and involve problems of thermodynamic damage due to repeated deformation and high temperature hardening. Therefore, it is required to develop a low-temperature bonding process to minimize the thickness of the joint and prevent thermal damage for flexible bonding. This study developed flexible laser transmission welding (f-LTW) that allows bonding of flexible substrates with flexibility, robustness, and low thermal damage. Carbon nanotube (CNT) is thin-film coated on a flexible substrate to reduce the thickness of the joint, and a local melt bonding process on the surface of a polymer substrate by heating a CNT dispersion beam laser has been developed. The laser process conditions were constructed to minimize the thermal damage of the substrate and the mechanism of forming a CNT junction with the polymer substrate. In addition, lap shear adhesion test, peel test, and repeated bending experiment were conducted to evaluate the strength and flexibility of the flexible bonding joint.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.4
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• pp.21-27
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• 2022

Flexible pressure sensor was developed using low-cost conductive graphite as printed electronics. Flexible pressure sensors are attracting attention as materials to be used in future industries such as medical, games, and AI. As a result of evaluating various electromechanical properties of the printed electrode for flexible pressure sensors, it showed a constant resistance change rate in a maximum tensile rate of 20%, 30° tension/bending, and a simple pulse test. A more appropriate matrix pattern was designed by simulating the electrodes for which this verification was completed. Utilizing the Serpentine pattern, we utilized a process that allows simultaneous fabrication and encapsulation of the matrix pattern. One side of the printed graphite electrode was O₂ plasma surface treated to increase adhesive strength, rotated 90 times, and two electrodes were made into one through a lamination process. As a result of pasting the matrix pattern prepared in this way to the wrist pulse position of the human body and proceeding with the actual measurement, a constant rate of resistance change was shown regardless of gender.

• Journal of the Microelectronics and Packaging Society
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• v.31 no.3
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• pp.24-37
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• 2024

Due to the thin nature of semiconductor packages, even minor thermal loads can cause significant warpage, impacting product reliability through issues like delamination or cracking. The mold curing process, which encloses the package to protect the semiconductor chip, is particularly challenging to predict due to the complex thermal, chemical, and mechanical interactions. This study proposes a cost-effective machine learning model to predict warpage in the mold curing process. We developed methods to characterize the curing degree based on time and temperature and quantify the material's mechanical properties accordingly. A Finite Element Method (FEM) simulation model was created by integrating these properties into ABAQUS UMAT to predict warpage for various design factors. Additionally, a Warpage formula was developed to estimate local warpage based on the package's stacking structure. This formula combines bending theory with thermo-chemical-mechanical properties and was validated through FEM simulation results. The study presents a method to construct a machine learning model for warpage prediction using this formula and proposes a cost-effective approach for building a training dataset by analyzing input variables and design factors. This methodology achieves over 98% prediction accuracy and reduces simulation time by 96.5%.

• Proceedings of the Korea Technical Association of the Pulp and Paper Industry Conference
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• 2000.06a
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• pp.16-23
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• 2000

The increasing functional needs of top-quality printing papers and packaging paperboards, and especially the rapid developments in electronic printing processes and various computer printers during past few years, set new targets and requirements for modern paper quality. Most of these paper grades of today have relatively high filler content, are moderately or heavily calendered , and have many coating layers for the best appearance and performance. In practice, this means that many of the traditional quality assurance methods, mostly designed to measure papers made of pure. native pulp only, can not reliably (or at all) be used to analyze or rank the quality of modern papers. Hence, introduction of new measurement techniques is necessary to assure and further develop the paper quality today and in the future. Paper formation , i.e. small scale (millimeter scale) variation of basis weight, is the most important quality parameter of paper-making due to its influence on practically all the other quality properties of paper. The ideal paper would be completely uniform so that the basis weight of each small point (area) measured would be the same. In practice, of course, this is not possible because there always exists relatively large local variations in paper. However, these small scale basis weight variations are the major reason for many other quality problems, including calender blacking uneven coating result, uneven printing result, etc. The traditionally used visual inspection or optical measurement of the paper does not give us a reliable understanding of the material variations in the paper because in modern paper making process the optical behavior of paper is strongly affected by using e.g. fillers, dye or coating colors. Futhermore, the opacity (optical density) of the paper is changed at different process stages like wet pressing and calendering. The greatest advantage of using beta transmission method to measure paper formation is that it can be very reliably calibrated to measure true basis weight variation of all kinds of paper and board, independently on sample basis weight or paper grade. This gives us the possibility to measure, compare and judge papers made of different raw materials, different color, or even to measure heavily calendered, coated or printed papers. Scientific research of paper physics has shown that the orientation of the top layer (paper surface) fibers of the sheet paly the key role in paper curling and cockling , causing the typical practical problems (paper jam) with modern fax and copy machines, electronic printing , etc. On the other hand, the fiber orientation at the surface and middle layer of the sheet controls the bending stiffness of paperboard . Therefore, a reliable measurement of paper surface fiber orientation gives us a magnificent tool to investigate and predict paper curling and coclking tendency, and provides the necessary information to finetune, the manufacturing process for optimum quality. many papers, especially heavily calendered and coated grades, do resist liquid and gas penetration very much, bing beyond the measurement range of the traditional instruments or resulting invonveniently long measuring time per sample . The increased surface hardness and use of filler minerals and mechanical pulp make a reliable, nonleaking sample contact to the measurement head a challenge of its own. Paper surface coating causes, as expected, a layer which has completely different permeability characteristics compared to the other layer of the sheet. The latest developments in sensor technologies have made it possible to reliably measure gas flow in well controlled conditions, allowing us to investigate the gas penetration of open structures, such as cigarette paper, tissue or sack paper, and in the low permeability range analyze even fully greaseproof papers, silicon papers, heavily coated papers and boards or even detect defects in barrier coatings ! Even nitrogen or helium may be used as the gas, giving us completely new possibilities to rank the products or to find correlation to critical process or converting parameters. All the modern paper machines include many on-line measuring instruments which are used to give the necessary information for automatic process control systems. hence, the reliability of this information obtained from different sensors is vital for good optimizing and process stability. If any of these on-line sensors do not operate perfectly ass planned (having even small measurement error or malfunction ), the process control will set the machine to operate away from the optimum , resulting loss of profit or eventual problems in quality or runnability. To assure optimum operation of the paper machines, a novel quality assurance policy for the on-line measurements has been developed, including control procedures utilizing traceable, accredited standards for the best reliability and performance.