• Journal of the Microelectronics and Packaging Society
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• v.23 no.4
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• pp.1-6
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• 2016

In this article, the recent developments in electroless plating of copper, electroless bath formulation and effect of plating parameters have been reviewed. Cyanide free electroless baths are now being developed and studied due to the various environmental concerns. Various organic chemicals such as complexing agents, reducing agents, and additives such as poly-alcohols and aromatic ring compounds have been added to copper plating baths for promising results. The effects of various reducing and complexing agents, bath conditions like additives, bath pH, and composition have been summarized. Finally the applications of the electroless plating of copper and latest developments have been overviewed for further guidance in this field.

• Journal of the Korean institute of surface engineering
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• v.44 no.4
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• pp.137-143
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• 2011

The internal stress and magnetic properties (coercivity and squareness) of Ni-Fe nano thin film synthesized by electrodeposition method were studied as a function of acidic chloride bath conditions (composition and temperature) and current density. Fe deposition patterns were different depending on the temperature of the solution, the stress of film decreased with increasing the solution temperature, and the depending on the amount of Fe deposition showed a parabolic shape. The grain size of film was inversely proportional to stress of thin film. The internal stress of thin film and magnetic properties were deeply relevant, and the stress of thin film had a relationship with bath conditions and grain size of the thin film surface.

• Journal of the Korean institute of surface engineering
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• v.36 no.1
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• pp.42-47
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• 2003

Hot-dip galvanizing process is used widely in industry to achieve corrosion resistant coatings. Poor drainage during this process often leads to problems such as icicle formation and bridging In this work, mild steel specimens were hot-dip galvanized. Influence of the addition of bismuth, aluminum and both (bismuth and aluminum) to the zinc bath on the zinc drainage were determined. Bismuth additions improved the drainage significantly. Zinc bath containing 0.1 wt.% Bi and 0.025∼0.05 wt.% Al showed uniformity of coatings. Industrial trials with this bath composition showed reduction in zinc consumption, reduction of ash and dross, and good luster of workpiece.

• Journal of the Korean institute of surface engineering
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• v.21 no.1
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• pp.3-9
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• 1988

An electroless plating both for normal orientation of HCP-structure of Co-P to the film plane was developed. An ammonical succinate-citrate bath containg MnSo4, NiSO4 was studied Ni was codeposited into the films in order to decrease the saturation magentization (MS) since low Ms is necessary to decrease the magentizing fild. Mn was also codeposited to increase perpendicular orentaon of Co-P film. Effects on film composition and magnetic properties were studid in connection with follwing four factors such as concentration of NiSo4 and MnSo4, bath temp and pH.

• Bulletin of the Korean Chemical Society
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• v.28 no.12
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• pp.2214-2218
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• 2007

The effects of bath temperature on electrochemical behavior, alloy composition, crystallographic structure, morphology and the magnetic properties of electrodeposited Co-Pt-W(P) films were investigated. Electrochemical studies show that alloy electrodeposition has been shifted to more positive potentials and the critical time for nucleation decreased as electrolyte temperature increased. As the temperature increased from 40 oC to 80 oC, tungsten content in the deposit increased, while phosphorus content decreased. The films deposited at T = 40 oC exhibited soft magnetic properties. However, electrodeposited at T = 70 oC, the films exhibited hard magnetic properties. It is also demonstrated that higher temperature more than 70 oC could weaken hard magnetic properties. XRD results indicated that the deposits obtained at 50 oC-70 oC showed enhancement of [00.1] P.O. (preferred orientation) with the bath temperature, which resulted in the stronger perpendicular magnetic anisotropy.

• Journal of the Korean institute of surface engineering
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• v.19 no.2
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• pp.31-43
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• 1986

The properties of the electroless nickel deposit mainly depends on the pH of the bath, the plating temperature, and the molar ratio of nickel to hypophosphite but they are also affected by its formulation and concentration of complexing and buffering agents. According to changeing the concentration of triethanolamine and boric acid, phosphorous contents, microsturcture, crystalline, hardness and wear resistance of deposits obtained from ammoniacal alkaline bath were investigated by EPMA, differential thermal analyser, X-ray diffractometer and wear tester. The results are as follows; (1) Increasing concentration of triethanolamine in the bath, the deposits is slightly inclined to increase its phosphorous content(3.7% P). (2) In the as-plated state, the deposits are not crystallized state but they are thermally unstable phase, and they are crystallized with precipitating $Ni_3P$ at 400$^{\circ}C$. (3) The deposit containing 2.3% P has higher hardness value in the as plated and heat treated state at below 300$^{\circ}C$ than those of 3.7% phosphorous deposit (1090Hk). But in the case of heat treating at 400$^{\circ}C$, the former has lower hardness value (1000Hk) than the latter and has remarkably Ni(III) orientation by heat treatment. (4) The 3.7% phosphorous deposit heat treated at 400$^{\circ}C$ has better wear resistance than hard chromium plating.

• Journal of the Korean institute of surface engineering
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• v.32 no.4
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• pp.487-495
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• 1999

In order to form metallic electrodes on PZT (Pb (Zr, Ti)O$_3$) ceramics, plating conditions for optimal electroless Ni deposition were investigated. Pb in PZT is the major component to inhibit the electroless deposition, because it plays a active role of catalytic poison in plating solution. Adhesion of the electroless Ni deposits is measured by push-pull scale test and peel test. Results such as deposition ability, deposition rate, and thickness of deposits showed in terms of concentration of etchant, composition of catalyzing solution, and composition and pH of electroless bath solution.

• Journal of the Korean institute of surface engineering
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• v.55 no.2
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• pp.102-119
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• 2022

Gold plating is used as a coating of connecter in printed circuit boards, ceramic integrated circuit packages, semiconductor devices and so on, because the film has excellent electric conductivity, solderability and chemical properties such as durability to acid and other chemicals. As increasing the demand for miniaturization of printed circuit boards and downsizing of electronic devices, several types of electroless gold plating solutions have been developed. Most of these conventional gold plating solutions contain cyanide compounds as a complexing agent. The gold film obtained from such baths usually satisfies the requirements for electronic parts mentioned above. However, cyanide bath is highly toxic and it always has some possibility to cause serious problems in working environment or other administrative aspects. The object of this investigation was to develop a cyanide-free electroless gold plating process that assures the high stability of the solution and gives the excellent solderability of the deposited film. The investigation reported herein is intended to establish plating bath composition and plating conditions for electroless gold plating, with thiomalic acid as a complexing agent. At the same time, we have investigated the solution stability against nickel ion and pull strength of solder ball. Furthermore, by examining the characteristics of the plated Au plating film, the problems of the newly developed electroless Au plating solution were improved and the applicability to various industrial fields was examined. New type electroless gold-plating bath which containing thiomalic acid as a complexing agent showing so good solution stability and film properties as cyanide bath. And this bath shows the excellent stability even if the dissolved nickel ion was added from under coated nickel film, which can be used at the neutral pH range.

• Journal of the Korean institute of surface engineering
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• v.37 no.2
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• pp.86-91
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• 2004

Effect of potassium formate, glycine and oxalic acid in a sulfate solution on the deposit composition and current efficiency of trivalent chromium plating was studied. The trivalent chromium layers prepared by solutions with potassium formate, glycine and oxalic acid contain a few carbon inside. The solutions containing potassium formate, glycine and oxalic acid are relatively stable with pH change. The solution with the potassium formate shows 6-30％ current efficiency with current density, whereas, the solutions with oxalic acid and glycine show about 5％ current efficiency, respectively. The improved current efficiency is related to enough supply of chromium ions to the electrode due to the increase of pH at the front of electrode.

• 한국신재생에너지학회:학술대회논문집
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• 2006.06a
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• pp.152-153
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• 2006

The new approach to buffer layer design for CIGS solar cells that permitted to reduce the buffer absorption losses in the short wavelength range and to overcome the disadvantages inherent to Cd-free CIGS solar cells was proposed. A chemical bath deposition method has been used to produce a high duality buffer layer that comprises thin film of CdS and Zn-based film. The double layer was grown on either ITO or CIGS substrates and its morphological, structural and optical properties were characterized. The Zn-based film was described as the ternary compound $ZnS_x(OH)_y$. The composition of the $ZnS_x(OH)_y$ layer was not uniform throughout its thickness. $ZnS_x(OH)_y$/CdS/substrate region was a highly intermixed region with gradually changing composition. The short wavelength cut-off of double layer was shifted to shorter wavelength (400nm) compared to that (520 nm) for the standard CdS by optimization of the double buffer design. The results show the way to improve the light energy collection efficiency of the nearly cadmium-free CIGS-based solar cells.