• 한국윤활학회:학술대회논문집
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• 한국윤활학회 2003년도 학술대회지
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• pp.324-328
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• 2003

Water-lubricated frictional characteristics of stainless steel ball bearing is not well known compared to oil-lubricated frictional characteristics. Furthermore study on friction at high temperature is rare because bearing maintenance strategy for water-lubricated or chemicals-lubricated bearings of equipment is mostly based on change of failed bearings and parts. Ball bearings and ball screw are installed on the power transmission for a developing integral reactor and these are lubricated with high temperature and high pressure chemically-controlled pure water. Bearings and power transmitting mechanical elements for an atomic reactor needs high reliability. and high performance during estimated lifetime, and it should be verified. In this paper, experimental research results of frictional characteristics of water-lubricated ball bearing as a preliminary investigation.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2004년도 ISMP Pb-free solders and the PCB technologies related to Pb-free solders
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• 마이크로전자및패키징학회지
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• 제20권4호
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• pp.7-11
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• 2013

As thermosonic ball bonding is developed for more and more advanced applications in the electronic packaging industry, the control of process stresses induced on the integrated circuits becomes more important. If Cu bonding wire is used instead of Au wire, larger ultrasonic levels are common during bonding. For advanced microchips the use of Cu based wire is risky because the ultrasonic stresses can cause chip damage. This risk needs to be managed by e.g. the use of ultrasound during the impact stage of the ball on the pad ("pre-bleed") as it can reduce the strain hardening effect, which leads to a softer deformed ball that can be bonded with less ultrasound. To find the best profiles of ultrasound during impact, a numerical model is reported for ultrasonic bonding with capillary dynamics combined with a geometrical model describing ball deformation based on volume conservation and stress balance. This leads to an efficient procedure of ball bond modelling bypassing plasticity and contact pairs. The ultrasonic force and average stress at the bond zone are extracted from the numerical experiments for a $50{\mu}m$ diameter free air ball deformed by a capillary with a hole diameter of $35{\mu}m$ at the tip, a chamfer diameter of $51{\mu}m$, a chamfer angle of $90^{\circ}$, and a face angle of $1^{\circ}$. An upper limit of the ultrasonic amplitude during impact is derived below which the ultrasonic shear stress at the interface is not higher than 120 MPa, which can be recommended for low stress bonding.

• 한국초전도학회:학술대회논문집
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• 한국초전도학회 2008년도 High Temperature Superconductivity Vol.XVIII
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• pp.80-80
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• 2008

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2005년도 춘계학술발표대회 개요집
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• pp.22-24
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• 2005

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2011년도 춘계학술대회 논문집
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• pp.709-710
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• 2011

• 청정기술
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• 제23권1호
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• pp.64-72
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• 2017

본 연구에서는, $150{\sim}400^{\circ}C$ 영역에서 $NO_x$를 제어하기 위한 ball mill 기법을 사용한 선택적 환원촉매(SCR)의 연구를 수행하였다. 제조된 촉매들의 구조적 특성 및 산화가 특성을 확인하기 위하여 XRD, BET, XPS 분석을 수행하였다. 다양한 ball mill 기법에 의해 제조된 촉매는 $250^{\circ}C$ 이하의 온도구간에서의 활성의 차이를 보였다. 이중 가장 우수한 탈질효율을 갖는 촉매를 기준으로, ball mill 시간이 3시간일 때 가장 높은 활성을 나타내었다. XPS 분석 결과, vanadium의 비 화학양론종의 존재 및 원자 수 증가가 활성증진에 유리하게 작용한 것으로 나타났다. 또한 $O_2$ on-off 실험을 통해 격자산소량의 양과 탈질 효율과의 상관관계를 나타내었고, 이는 서로 비례관계에 있음을 확인하였다.

• Korean Chemical Engineering Research
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• 제55권4호
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• pp.456-466
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• 2017

이 연구는 교반볼밀을 이용한 금속기반 복합재 제조공정에 있어서 분쇄매체의 차이에 의한 입자형상의 변화를 관찰하고, 볼 거동의 DEM시뮬레이션을 행하였다. 교반볼밀에서 볼 거동의 3차원 시뮬레이션을 통해 분쇄메커니즘을 규명하기 위하여 분쇄매체의 힘, 운동에너지, 매체 운동속도 등을 계산하였다. 또한 복합재 제조를 위한 실험조건을 이전의 다른 볼밀에서에 같이 교반볼밀 회전속도를 변화시켰고, 볼 재질, 운동속도, 마찰계수 등도 동일한 조건으로 변화시키면서 투입되는 에너지의 변화량도 계산하였다. 교반볼밀의 회전속도가 증가함에 따라, 분쇄매체와 매체, 매체와 벽면, 그리고 매체와 교반기 사이의 충격에너지가 증가하는 것을 정량적으로 계산 할 수 있었다. 또한 같은 실험 조건에서 입자형상 변화를 명확하게 분석 할 수 있었으며, 볼 거동이 입자형상 변화에 매우 큰 영향을 미치는 것을 알 수 있었다.

• 한국정밀공학회지
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• 제19권6호
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• pp.51-61
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• 2002

A tracking control scheme on the XY ball-screw drive system in the presence of nonlinear dynamic friction is proposed. A nonlinear dynamic friction is regarded as the Lund-Grenoble friction model to compensate effects of friction. The conventional VSC method that often has been used as a non-model-based friction controller has poor tracking performance in high-precision position tracking application since it cannot compensate the friction effect below a certain precision level completely. Thus to improve the precise position tracking performance, we propose the integral type VSC method combined with the friction-model-based observer. Then this control scheme has the high precise tracking performance compared with the non-model-baked VSC method and the PID control method with a similar observer. This fact is shown through the experiment on the XY ball-screw drive system with the nonlinear dynamic friction.