• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2003년도 The 8th Asian Symposium on Precision Forging ASPF
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• pp.138-142
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• 2003

In this study, to show well favorable characteristics of warm forged material, we compared and analyzed microstructure and mechanical properties of general hot-forged material which finished heat treatment with warm-forged material which was produced by control cooling condition. Along with this, we suggested better direction of control cooling condition to be able to remove heat treatment process while satisfying mechanical properties.

• 한국운동역학회지
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• 제12권2호
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• pp.109-130
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• 2002

따라서 본 연구의 목적은 국가대표 수준급 대학 우수 야구 투수를 대상으로 한 3차원 영상분석을 통한 데이터를 가지고 직구 커브볼에 대한 구간별 운동학적 패턴을 비교 분석하여 자료를 제시하는데 있다. 본 연구는 부산 D대학교 우완 오버핸드 투수 가운데 국가대표 2명과 수준급 대학선수 2명, 총 4명을 대상으로 직구 커브 투구시 구간별로 나타나는 여러 운동학적 변인의 차이를 비교 분석한 결과 다음과 같은 결론을 얻었다. 직구 및 커브볼 투구시 구간별, 국면별 투구시간은 거의 비슷하게 나타냈으며, 직구의 총 소요시간은 1.78${\pm}$0.07초이며 커브 총 소요시간은 1.77${\pm}$0.11초로 나타났다. 직구 및 커브볼 투구시 Z(상 하)방향에 대한 신체 중심의 위치변화는 구간별, 국면별 거의 차이가 나지 않았다. 직구 및 커브볼 투구시 왼쪽 다리의 무릎높이는 각각 $125.38{\pm}11.85cm,\;124.95{\pm}11.63cm$로 큰 차이가 없었다. 신장대비율(%H)로는 직구, 커브 각각 68.42${\pm}$5.53(%H), 68.40${\pm}$5.45(%H)로 나타났다. 직구 및 커브볼 투구시 스트라이드 거리는 각각 140.35${\pm}$4.96cm, 144.83${\pm}$1.69cm로 커브 투구시 더 많은 스트라이드 거리를 보였다. 직구 및 커브볼 투구시 왼쪽 슬관절 ST 구간과 LKU 구간, HBP 구간에서는 별 차이가 없었지만 LFC, MCP, BRP구간에서는 직구보다 커브 투구시 슬관절 각도가 더 굴곡 된 것으로 나타났다. 직구 및 커브볼 투구시 오른팔 견관절 각도는 ST 구간과 LKU구간, HBP 구간에서는 별차이가 없었다. 직구 및 커브볼 투구시 오른팔 주관절 각도는 ST 구간과 LKU구간, HBP 구간에서는 별차이 가 없었다. LFC구간과 MCP구간에서는 직구보다 커브가 다소 많이 굴곡되었고, BRP구간에서 는 직구, 커브 모두 다 근소한 차로 신전 된 것으로 나타났다. 직구 및 커브볼 투구시 오른팔 수관절 각도는 LFC 구간과 MCP 구간에서는 커브가 직구보다 더 신전되었다. 그리고 BRP 구간은 직구가 커브보다 더 신전 된 것으로 나타났다.

• 동력기계공학회지
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• 제22권6호
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• pp.44-50
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• 2018

As a type of bolt with a spherical head, the ball stud is widely used as a part of a ball joint in steering or suspension systems in automobiles. Balls and studs are subjected to heat treatment suitable for each material; in particular, the shear strength of the ball stud must meet the specifications of the production company. This study evaluated the shear strength of joints according to the cooling method of ball studs subject to resistance welding. The shear stress of water cooling was higher than that of air cooling (as-received material). Note, however, th at oil cooling showed lower stress than that of as-received. When judged by standard deviation, mean, and coefficient of variation according to the arithmetic statistics and shape parameter as well as scale parameter, oil cooling is suitable.

• Journal of Welding and Joining
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• 제33권3호
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• pp.19-24
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• 2015

Joint properties of electric control unit (ECU) module using Sn-Cu-(X)Al(Si) lead-free solder alloy were investigated for automotive electronics module. In this study, Sn-0.5Cu-0.01Al(Si) and Sn-0.5Cu-0.03Al(Si) (wt.%) lead-free alloys were fabricated as bar type by doped various weight percentages (0.01 and 0.03 wt.%) of Al(Si) alloy to Sn-0.5Cu. After fabrications of lead-free alloys, the ball-type solder alloys with a diameter of 450 um were made by rolling and punching. The melting temperatures of 0.01Al(Si) and 0.03Al(Si) were 230.2 and $230.8^{\circ}C$, respectively. To evaluation of properties of solder joint, test printed circuit board (PCB) finished with organic solderability perseveration (OSP) on Cu pad. The ball-type solders were attached to test PCB with flux and reflowed for formation of solder joint. The maximum temperature of reflow was $260^{\circ}C$ for 50s above melting temperature. And then, we measured spreadability and shear strength of two Al(Si) solder materials compared to Sn-0.7Cu solder material used in industry. And also, microstructures in solder and intermetallic compounds (IMCs) were observed. Moreover, thickness and grain size of $Cu_6Sn_5$ IMC were measured and then compared with Sn-0.7Cu. With increasing the amounts of Al(Si), the $Cu_6Sn_5$ thickness was decreased. These results show the addition of Al(Si) could suppress IMC growth and improve the reliability of solder joint.

• Journal of Welding and Joining
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• 제31권5호
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• pp.54-58
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• 2013

Joint properties of vehicle ECU (Electric Control Unit) module which was manufactured by using Sn-Cu-Cr-Ca alloy were investigated. A new solder which has a middle melting temperature about $231^{\circ}C$ was fabricated as the type of 300um solder ball and paste type. The prototype modules were made by reflow process and measured spreadability, wettability shear strength and estimated interface reaction. The spreadability of the alloy was about 84% from the measurement of contact angle of the solder ball and the wetting force was measured 2mN. The average shear strength of the module which was manufactured by using the solder paste, was 1.9 $kg/mm^2$. Also, the thickness of IMC(intermetallic compound) was evaluated with various aging temperature and time in order to understand Cr effect on Sn-0.7Cu solder. $Cu_6Sn_5$ IMC was formed between Cu pad and the solder alloy and the average thickness of the $Cu_6Sn_5$ IMC was measured about 4um and it was about 50% of thickness of $Cu_6Sn_5$ IMC in Sn-0.7Cu. It is expected to have a positive effect on reliability of the solder joint.

• 로봇학회논문지
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• 제8권1호
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• pp.8-19
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• 2013

One of the important issues for structural and electrical specifications in developing a robot is to determine lengths of links and motor specifications, which need to be appropriate to the purpose of robot. These issues become more critical for a gait rehabilitation robot, since a patient wears the robot. Prior to developing an entire gait rehabilitation robot, designing of a 1DOF assistive knee joint of the robot is considered in this paper. Human gait motions were used to determine an allowable range of knee joint that was rotated with a linear type actuator (ball-screw type) and links. The lengths of each link were determined by using an optimization process, minimizing the stroke of actuator and the total energy (kinetic and potential energy). Kinetic analysis was performed in order to determine maximum rotational speed and maximum torque of the motor for tracking gait trajectory properly. The prototype of 1 DOF assistive knee joint was built and examined with a impedance controller.

• 마이크로전자및패키징학회지
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• 제22권1호
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• pp.69-74
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• 2015

첨단 전자기기에 사용되는 전자부품의 크기와 접속피치가 감소하면서 리플로우 공정 후 플럭스 잔사의 세정이 어려워짐에 따라 무세정 솔더 페이스트에 대한 요구가 증가하고 있다. 본 연구에서는 SAC305 솔더분말과 에폭시 레진을 주성분으로 하는 경화성 플럭스를 혼합하여 제조한 에폭시 경화형 솔더 페이스트에 대하여 리플로우 공정성, 플럭스 잔사의 부식성, 솔더볼 및 보드레벨 BGA 패키지 솔더 접합부의 기계적 거동을 기존 로진계 솔더 페이스트와 비교하여 평가하였다. 에폭시 경화형 솔더 페이스트는 솔더 접합부 주변에 경화물 필렛을 형성한 것으로 보아 플럭싱 작용에 의해 솔더 접합부가 형성된 이후에 경화반응이 진행되는 것을 확인할 수 있었으며, 동판에 대한 젖음성 시험을 통해 기존상용 솔더 페이스트 정도의 납퍼짐성을 갖는 것을 알 수 있었다. 리플로우 후 동판에 대한 고온 고습 시험을 통해 에폭시 경화형 솔더 페이스트는 동판 부식을 전혀 발생시키지 않는 것으로 나타났는데, 이는 FT-IR 분석결과 에폭시 경화반응을 통해 단단히 고정된 결과로 생각되었다. 볼전단, 볼당김 및 다이전단 시험 결과, 솔더 접합부 주변에 형성된 경화물 필렛은 솔더 표면과 접착본딩을 형성하며, 다이전단강도를 15~40% 정도 향상시키는 것으로 보아 에폭시 경화형 솔더 페이스트는 플럭스 잔사 세정공정의 생략과 함께 솔더 접합부 보강효과를 통해 패키지 신뢰성 향상에도 기여할 수 있을 것으로 생각되었다.

• 한국재료학회지
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• 제21권12호
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• pp.650-654
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• 2011

In this paper, the effects of conventional and newly developed elastomer modified underfill materials on the mechanical shock reliability of BGA board assembly were studied for application in mobile electronics. The mechanical shock reliability was evaluated through a three point dynamic bending test proposed by Motorola. The thermal properties of the underfills were measured by a DSC machine. Through the DSC results, the curing condition of the underfills was selected. Two types of underfills showed similar curing behavior. During the dynamic bending reliability test, the strain of the PCB was step increased from 0.2% to 1.5% until the failure circuit was detected at a 50 kHz sampling rate. The dynamic bending reliability of BGA board assembly using elastomer modified underfill was found to be superior to that of conventional underfill. From mechanical and microstructure analyses, the disturbance of crack propagation by the presence of submicron elastomer particles was considered to be mainly responsible for that result rather than the shear strength or elastic modulus of underfill joint.

• 한국기계가공학회지
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• 제12권4호
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• pp.47-54
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• 2013

The main cause of die failure in hot forging is wear. Die wear directly generates the gradual loss of part tolerances, thereby causing deterioration in the dimensional accuracy of a forged part. It is very important to estimate forging cycles, called as die life, at which the die should be repaired or replaced. In this study, in order to estimate the hot forging die life, the finite element simulation of wear on an asymmetric part like a ball joint socket used in vehicle was carried out based on Archard's model. Finite element simulation results were compared with wear amounts of a used die that were measured using a contact stylus profilometer. The simulation results were in relatively good agreement with measurements obtained from the virtual die which was used by 7,000 forging cycles in a forging industry. Consequently, the die life in the hot forging of the ball joint socket was estimated by 10,500 forging cycles on the finisher die.

• 대한정형도수물리치료학회지
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• 제12권1호
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• pp.16-26
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• 2006

The purpose of this study was to investigate the influence of the various knee angles and ground state on the muscular activities and fatigue of the ankle muscles by integrated electromyograms (iEMG) and median frequency of tibialis anterior (TA), peroneus longus (PL), flexor digitorum longus (FDL) and gastrocnemius (GC). Ten healthy male subjects were participated into stable and balance ball sessions at four angles of knee joint. The surface electromyograms (sEMG) were recorded from the TA, PL, FDL and GC on stable and balance ball with full weight bearing at four knee angles of $0^{\circ}$, $15^{\circ}$, $30^{\circ}$ and $45^{\circ}$. The time serial data of the surface electromyographic signals were transformed into integrated and frequency serial data by fast fourier transformation. On the stable ground, the iEMG signals of the TA, PL, FDL and GC were significantly higher at $45^{\circ}$ and $30^{\circ}$ of knee angles than $0^{\circ}$ and $15^{\circ}$ of knee flexion (p<0.05). On the balance ball, the iEMG of the TA, PL, FDL and GC were significantly higher at $45^{\circ}$ and $30^{\circ}$ of knee angles than $0^{\circ}$ and $15^{\circ}$ of knee flexion (p<0.05). The median frequency of the TA, PL, FDL and GC were significantly lower at $45^{\circ}$ and $30^{\circ}$ of knee angles than $0^{\circ}$ and $15^{\circ}$ of knee on the stable ground (p<0.05). On the balance ball, also the median frequency of the TA, PL, FDL and GC were significantly lower at $45^{\circ}$ and $30^{\circ}$ of knee angles than $0^{\circ}$ and $15^{\circ}$ of knee flexion (p<0.05). The iEMG of the TA, PL, FDL and GC were significantly higher on the balance ball at $0^{\circ}$, $15^{\circ}$, $30^{\circ}$ and $45^{\circ}$ of knee angles compared with stable ground. The median frequency of the TA, PL, FDL and GC were significantly lower on the balance ball at $0^{\circ}$, $15^{\circ}$, $30^{\circ}$ and $45^{\circ}$ of knee angles compared with stable ground. These results indicate that the ground conditions and angles of the knee joint involved to muscular activities and fatigue of ankles muscles, may performed at first on stable ground and then balance ball in order to $0^{\circ}$, $15^{\circ}$, $30^{\circ}$ and $45^{\circ}$ of knee flexion.