• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2003.10b
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• pp.138-142
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• 2003

In this study, to show well favorable characteristics of warm forged material, we compared and analyzed microstructure and mechanical properties of general hot-forged material which finished heat treatment with warm-forged material which was produced by control cooling condition. Along with this, we suggested better direction of control cooling condition to be able to remove heat treatment process while satisfying mechanical properties.

• Korean Journal of Applied Biomechanics
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• v.12 no.2
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• pp.109-130
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• 2002

The purpose of this paper was to make a comparative analysis for the difference of the various kinematic variation which is occurred in the each situation when pitchers throw a straight and a curve ball. Four pitchers, who are two national team players and two high level pitchers, were selected among the right over hand pitchers of D university in the Busan for this paper. The data were analyzed by using 3D equipment. The results of the analysis which was about the elapsed time of the pitching, the movement of the body center-point, the highest height of the left knee, stride length, knee joint angle, shoulder joint angle, elbow joint angle and wrist joint angle in the each section(ST, LKU, HBP, LCF, MCP, BRP) were as follows : 1. Pitching time in the each section and step in the pitching for straight and curve ball was similar. The total elapsed time of the straight and curve ball was 1.78${\pm}$0.07sec and 1.77${\pm}$0.11sec in the order. 2. The position change of the body center to the Z(above below) direction did not show significant difference in the each situation of the section and step between pitching for the straight and curve ball. 3. Height of the left knee did not show significant difference as 125.38${\pm}$11.85cm and 124.95${\pm}$11.63m in the each pitching motion for straight and curve ball. The rate(%H) between height and stride length showed 68.42${\pm}$5.53(%H), 68.40${\pm}$5.45(%H) in the each pitching motion. 4. Pitching for curve ball showed longer stride length than pitching for straight ball that as the stride length was 140.35${\pm}$4.96cm and 144.8${\pm}$1.69cm. The rate(%H) between height and stride length showed 76.9${\pm}$3.77(%H), 79.39${\pm}$2.23(%H) in the each pitching motion. 5. Left knee joint angle did not show significant difference in the ST, LKU and HBP section in the each pitching motion. However, it was shown that knee joint angle was flexed much more in the LFC, MCP and BRP section in the pitching for curve ball. 6. Right shoulder joint angle did not show significant difference in the ST, LKU and HSP section. However, when pitches threw a curve ball in the LKU section. In the LFC section, the right shoulder joint angle was extended much more in the pitching for curve ball, and the angle was extended much in the MCP and BRP section in the pitching for curve ball than straight ball. 7. Right elbow joint angle did not show significant difference in the ST, LKU and HRP section in the two pitching motion. The angle had more flexion in the LFC and MCP section in the pitching for curve ball than the pitching for straight ball. The angle in the each pitching motion for straight ball and curve ball were extended by a narrow margin in the BRP section. 8. Right wrist joint angle was extended much more in the LFC and MCP section in the pitching for curve ball. In the BRP section, the angle was extended much more in the pitching for straight ball than curve ball.

• Journal of Power System Engineering
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• v.22 no.6
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• pp.44-50
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• 2018

As a type of bolt with a spherical head, the ball stud is widely used as a part of a ball joint in steering or suspension systems in automobiles. Balls and studs are subjected to heat treatment suitable for each material; in particular, the shear strength of the ball stud must meet the specifications of the production company. This study evaluated the shear strength of joints according to the cooling method of ball studs subject to resistance welding. The shear stress of water cooling was higher than that of air cooling (as-received material). Note, however, th at oil cooling showed lower stress than that of as-received. When judged by standard deviation, mean, and coefficient of variation according to the arithmetic statistics and shape parameter as well as scale parameter, oil cooling is suitable.

• Journal of Welding and Joining
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• v.33 no.3
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• pp.19-24
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• 2015

Joint properties of electric control unit (ECU) module using Sn-Cu-(X)Al(Si) lead-free solder alloy were investigated for automotive electronics module. In this study, Sn-0.5Cu-0.01Al(Si) and Sn-0.5Cu-0.03Al(Si) (wt.%) lead-free alloys were fabricated as bar type by doped various weight percentages (0.01 and 0.03 wt.%) of Al(Si) alloy to Sn-0.5Cu. After fabrications of lead-free alloys, the ball-type solder alloys with a diameter of 450 um were made by rolling and punching. The melting temperatures of 0.01Al(Si) and 0.03Al(Si) were 230.2 and $230.8^{\circ}C$, respectively. To evaluation of properties of solder joint, test printed circuit board (PCB) finished with organic solderability perseveration (OSP) on Cu pad. The ball-type solders were attached to test PCB with flux and reflowed for formation of solder joint. The maximum temperature of reflow was $260^{\circ}C$ for 50s above melting temperature. And then, we measured spreadability and shear strength of two Al(Si) solder materials compared to Sn-0.7Cu solder material used in industry. And also, microstructures in solder and intermetallic compounds (IMCs) were observed. Moreover, thickness and grain size of $Cu_6Sn_5$ IMC were measured and then compared with Sn-0.7Cu. With increasing the amounts of Al(Si), the $Cu_6Sn_5$ thickness was decreased. These results show the addition of Al(Si) could suppress IMC growth and improve the reliability of solder joint.

• Journal of Welding and Joining
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• v.31 no.5
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• pp.54-58
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• 2013

Joint properties of vehicle ECU (Electric Control Unit) module which was manufactured by using Sn-Cu-Cr-Ca alloy were investigated. A new solder which has a middle melting temperature about $231^{\circ}C$ was fabricated as the type of 300um solder ball and paste type. The prototype modules were made by reflow process and measured spreadability, wettability shear strength and estimated interface reaction. The spreadability of the alloy was about 84% from the measurement of contact angle of the solder ball and the wetting force was measured 2mN. The average shear strength of the module which was manufactured by using the solder paste, was 1.9 $kg/mm^2$. Also, the thickness of IMC(intermetallic compound) was evaluated with various aging temperature and time in order to understand Cr effect on Sn-0.7Cu solder. $Cu_6Sn_5$ IMC was formed between Cu pad and the solder alloy and the average thickness of the $Cu_6Sn_5$ IMC was measured about 4um and it was about 50% of thickness of $Cu_6Sn_5$ IMC in Sn-0.7Cu. It is expected to have a positive effect on reliability of the solder joint.

• The Journal of Korea Robotics Society
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• v.8 no.1
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• pp.8-19
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• 2013

One of the important issues for structural and electrical specifications in developing a robot is to determine lengths of links and motor specifications, which need to be appropriate to the purpose of robot. These issues become more critical for a gait rehabilitation robot, since a patient wears the robot. Prior to developing an entire gait rehabilitation robot, designing of a 1DOF assistive knee joint of the robot is considered in this paper. Human gait motions were used to determine an allowable range of knee joint that was rotated with a linear type actuator (ball-screw type) and links. The lengths of each link were determined by using an optimization process, minimizing the stroke of actuator and the total energy (kinetic and potential energy). Kinetic analysis was performed in order to determine maximum rotational speed and maximum torque of the motor for tracking gait trajectory properly. The prototype of 1 DOF assistive knee joint was built and examined with a impedance controller.

• Journal of the Microelectronics and Packaging Society
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• v.22 no.1
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• pp.69-74
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• 2015

With difficulties during the cleaning of reflow flux residues due to the decrease of the part size and interconnection pitch in the advanced electronic devices, the need for the no-clean solder paste is increasing. In this study, an epoxy curable solder paste was made with SAC305 solder powder and the curable flux of which the main ingredient is epoxy resin and its reflow solderability, flux residue corrosivity and solder joint mechanical properties was investigated with comparison to the commercial rosin type solder paste. The fillet shape of the cured product around the reflowed solder joint revealed that the curing reaction occurred following the fluxing reaction and solder joint formation. The copper plate solderability test result also revealed that the wettability of the epoxy curable solder paste was comparable to those of the commercial rosin type solder pastes. In the highly accelerated temperature and humidity test, the cured product residue of the curable solder paste showed no corrosion of copper plate. From FT-IR analysis, it was considered to be resulted from the formation of tight bond through epoxy curing reaction. Ball shear, ball pull and die shear tests revealed that the adhesive bonding was formed with the solder surface and the increase of die shear strength of about 15~40% was achieved. It was considered that the epoxy curable solder paste could contribute to the improvement of the package reliability as well as the removal of the flux residue cleaning process.

• Korean Journal of Materials Research
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• v.21 no.12
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• pp.650-654
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• 2011

In this paper, the effects of conventional and newly developed elastomer modified underfill materials on the mechanical shock reliability of BGA board assembly were studied for application in mobile electronics. The mechanical shock reliability was evaluated through a three point dynamic bending test proposed by Motorola. The thermal properties of the underfills were measured by a DSC machine. Through the DSC results, the curing condition of the underfills was selected. Two types of underfills showed similar curing behavior. During the dynamic bending reliability test, the strain of the PCB was step increased from 0.2% to 1.5% until the failure circuit was detected at a 50 kHz sampling rate. The dynamic bending reliability of BGA board assembly using elastomer modified underfill was found to be superior to that of conventional underfill. From mechanical and microstructure analyses, the disturbance of crack propagation by the presence of submicron elastomer particles was considered to be mainly responsible for that result rather than the shear strength or elastic modulus of underfill joint.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.12 no.4
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• pp.47-54
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• 2013

The main cause of die failure in hot forging is wear. Die wear directly generates the gradual loss of part tolerances, thereby causing deterioration in the dimensional accuracy of a forged part. It is very important to estimate forging cycles, called as die life, at which the die should be repaired or replaced. In this study, in order to estimate the hot forging die life, the finite element simulation of wear on an asymmetric part like a ball joint socket used in vehicle was carried out based on Archard's model. Finite element simulation results were compared with wear amounts of a used die that were measured using a contact stylus profilometer. The simulation results were in relatively good agreement with measurements obtained from the virtual die which was used by 7,000 forging cycles in a forging industry. Consequently, the die life in the hot forging of the ball joint socket was estimated by 10,500 forging cycles on the finisher die.

• The Journal of Korean Academy of Orthopedic Manual Physical Therapy
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• v.12 no.1
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• pp.16-26
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• 2006

The purpose of this study was to investigate the influence of the various knee angles and ground state on the muscular activities and fatigue of the ankle muscles by integrated electromyograms (iEMG) and median frequency of tibialis anterior (TA), peroneus longus (PL), flexor digitorum longus (FDL) and gastrocnemius (GC). Ten healthy male subjects were participated into stable and balance ball sessions at four angles of knee joint. The surface electromyograms (sEMG) were recorded from the TA, PL, FDL and GC on stable and balance ball with full weight bearing at four knee angles of $0^{\circ}$, $15^{\circ}$, $30^{\circ}$ and $45^{\circ}$. The time serial data of the surface electromyographic signals were transformed into integrated and frequency serial data by fast fourier transformation. On the stable ground, the iEMG signals of the TA, PL, FDL and GC were significantly higher at $45^{\circ}$ and $30^{\circ}$ of knee angles than $0^{\circ}$ and $15^{\circ}$ of knee flexion (p<0.05). On the balance ball, the iEMG of the TA, PL, FDL and GC were significantly higher at $45^{\circ}$ and $30^{\circ}$ of knee angles than $0^{\circ}$ and $15^{\circ}$ of knee flexion (p<0.05). The median frequency of the TA, PL, FDL and GC were significantly lower at $45^{\circ}$ and $30^{\circ}$ of knee angles than $0^{\circ}$ and $15^{\circ}$ of knee on the stable ground (p<0.05). On the balance ball, also the median frequency of the TA, PL, FDL and GC were significantly lower at $45^{\circ}$ and $30^{\circ}$ of knee angles than $0^{\circ}$ and $15^{\circ}$ of knee flexion (p<0.05). The iEMG of the TA, PL, FDL and GC were significantly higher on the balance ball at $0^{\circ}$, $15^{\circ}$, $30^{\circ}$ and $45^{\circ}$ of knee angles compared with stable ground. The median frequency of the TA, PL, FDL and GC were significantly lower on the balance ball at $0^{\circ}$, $15^{\circ}$, $30^{\circ}$ and $45^{\circ}$ of knee angles compared with stable ground. These results indicate that the ground conditions and angles of the knee joint involved to muscular activities and fatigue of ankles muscles, may performed at first on stable ground and then balance ball in order to $0^{\circ}$, $15^{\circ}$, $30^{\circ}$ and $45^{\circ}$ of knee flexion.