• 제목/요약/키워드: Baking Temperature

검색결과 160건 처리시간 0.024초

소프트 베이킹 온도가 용액기반 Zn-Sn-O 박막 트랜지스터의 전기적 특성에 미치는 영향 (Effects of Soft Baking Temperature on the Properties of Solution Processed Zn-Sn-O Thin-Film Transistors)

  • 이재원;조원주
    • 한국전기전자재료학회논문지
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    • 제29권1호
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    • pp.6-10
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    • 2016
  • In this study, the effects of soft baking temperature on the solution derived ZTO (Zn-Sn-O) TFTs (thin-film transistors) as a In-free oxide semiconductor were investigated. In spite of the same hard baking at high temperature($600^{\circ}C$), the electrical properties of ZTO TFT was greatly changed by a small difference in soft baking temperature($180{\sim}250^{\circ}C$). The performance of TFT was deteriorated as the soft baking temperature increased. Therefore, it is important to remove the water-related defects well as organic impurities from the ZTO films during soft baking for fabrication of solution-derived high performance of TFTs.

소성 조건 변화에 따른 수직 폴리이미드 표면에서 이용한 네마틱 액정의 틸트 제어 (Control of Tilt Angle in the Nematic Liquid Crystal on the Homeotropic Polyimide Surface as a Function of the Baking Condition)

  • 황정연;이경준;김강우;서대식
    • 한국전기전자재료학회논문지
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    • 제17권6호
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    • pp.661-667
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    • 2004
  • The control of tilt angle for nematic liquid crystal (NLC) with negative and positive dielectric anisotropy on the rubbed homeotropic polyimide (PI) using baking method by hot plate equipment was investigated. LC tilt angle decreased with increasing baking temperature and time. Especially, the low LC tilt angle of positive type NLC (Δ$\varepsilon$>0) on the rubbed homeotropic PI surface by increasing temperature and time was measured. The tilt angle of positive type NLC(Δ$\varepsilon$>0) is smaller than that of the negative type (Δ$\varepsilon$>0) on rubbed PI with increasing baking temperature and time. We consider that the tilt angle of NLC is decreased due to increasing the steric interaction between horizon component of permittivity $\varepsilon$ = of NLC and the stress of polymer side chain by high temperature. As the increase of baking temperature, we obtain that AFM (atomic force microscope) image of rubbed PI surface using Hot-plate method has formed better solid micro-groove structure than oven method.

Effects of Onion Powder and Baking Temperature on the Physicochemical Properties of Cookies

  • Kim, Hye-Ran;Seog, Eun-Ju;Lee, Jun-Ho
    • Preventive Nutrition and Food Science
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    • 제12권3호
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    • pp.160-166
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    • 2007
  • Response surface methodology (RSM) was used for the optimization of the baking process of cookies made with onion powders (onion cookie). Experiments were carried out according to a central composite design, selecting onion powder content $(1.15{\sim}8.86%)$ and baking temperature $(155.9{\sim}184.1^{\circ}C)$ as independent variables and pH, titratable acidity, moisture content, density, spread factor, CIE color parameters $(L^{\ast}-$, $a^{\ast}-$, and $b^{\ast}-values)$, and hardness as response variables. pH decreased with increasing amount of onion powder and baking temperature. Moisture content also decreased as the baking temperature increased. $L^{\ast}-$ and $b^{\ast}-values$ decreased but $a^{\ast}-values$ increased with increasing onion content and baking temperature. Most polynomial models developed by RSM were highly effective to describe the relationships between the studied factors and the responses. Overall optimization, conducted by overlaying the contour plots under investigation, was able to point out the optimal range of the independent variables within which the six responses were simultaneously optimized. The point chosen as representative of this optimal region corresponded to 4.01% onion powder content and $161.84^{\circ}C$ baking temperature. The predicted dependent or response values in the optimal region were: pH=6.87, moisture content=2.77%, $L^{\ast}-value=68.45$, $a^{\ast}-value=1.98$, $b^{\ast}-value=34.64$, and spread factor=9.41.

소성 온도 변화를 이용한 네마틱 액정의 틸트 제어 (Control of tilt angle in the Nematic Liquid Crystal as a Function of the Baking Temperature)

  • 이경준;황정연;김강우;서대식
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2003년도 추계학술대회 논문집 Vol.16
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    • pp.67-70
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    • 2003
  • The control of tilt angle for nematic liquid crystal (NLC) with negative and positive dielectric anisotropy on the rubbed homeotropic polyimide (PI) using baking method by hot plate equipment was investigated. LC tilt angle decreased with increasing baking temperature and time. Especially, the low LC tilt angle of positive type NLC ($\Delta\varepsilon$ >0) on the rubbed homeotropic PI surface by increasing temperature and time was measured. The tilt angle of positive type NLC ($\Delta\varepsilon$ >0) is smaller than that of the negative type ($\Delta\varepsilon$ >0) on rubbed PI with increasing baking temperature and time. We consider that the tilt angle of NLC is decreased due to increasing the steric interaction between horizon component of permittivity $\varepsilon$ = of NLC and the stress of polymer side chain by high temperature.

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KSTAR PFC와 진공용기의 가열탈리 단계에서의 온도특성에 관한 연구 (A Study on Temperature Characteristics of KSTAR PFC and Vacuum Vessel at Baking Phase)

  • 유성연;김영진;정남용;김경민;이제묘
    • 설비공학논문집
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    • 제27권3호
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    • pp.158-168
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    • 2015
  • To create an ultra-high vacuum state at the KSTAR, the temperature of plasma facing component and vacuum vessel should be maintained at $300^{\circ}C$ and $110^{\circ}C$ respectively at a baking phase. The purpose of this research is obtaining the target baking temperatures. Experiments were performed to investigate the temperature characteristics of PFC and VV at the baking phase. Thermal network analysis was used to find heat transfer rates among PFC, VV and other components, and this analysis was verified by using the experimental data. The required heating energy of the PFC and the heating and cooling energy of the VV for the target baking temperatures were found to be 346 kW, 28 kW, and 136 kW, respectively.

Soft-Baking 처리를 통한 용액 공정형 In-Zn-O 박막 트랜지스터의 전기적 특성 향상 (Improvement in Electrical Characteristics of Solution-Processed In-Zn-O Thin-Film Transistors Using a Soft Baking Process)

  • 김한상;김성진
    • 한국전기전자재료학회논문지
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    • 제30권9호
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    • pp.566-571
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    • 2017
  • A soft baking process was used to enhance the electrical characteristics of solution-processed indium-zincoxide (IZO) thin-film transistors (TFTs). We demonstrate a stable soft baking process using a hot plate in air to maintain the electrical stability and improve the electrical performance of IZO TFTs. These oxide transistors exhibited good electrical performance; a field-effect mobility of $7.9cm^2/Vs$, threshold voltage of 1.4 V, sub-threshold slope of 0.5 V/dec, and a current on/off ratio of $2.9{\times}10^7$ were measured. To investigate the static response of our solutionprocessed IZO TFTs, simple resistor load type inverters were fabricated by connecting a resistor (5 or $10M{\Omega}$). Our IZO TFTs, which were manufactured using the soft baking process at a baking temperature of $120^{\circ}C$, performed well at the operating voltage, and are therefore a good candidate for use in advanced logic circuits and transparent display backplanes.

KSTAR 진공용기 및 플라즈마 대향 부품에 대한 베이킹 해석 (Baking analysis of the KSTAR vacuum vessel and plasma facing components)

  • 이강희;임기학;허남일;인상렬;조승연
    • 한국진공학회지
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    • 제8권4A호
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    • pp.397-402
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    • 1999
  • The base pressure of the vacuum vessel of KSTAR tokamak is to be ultra high vacuum, $10^{-6}\sim10^{-7}Pa$, to produce a clean plasma with low impurity concentrations. For this purpose, vessel and plasma facing components need to be baked up to $250^{\circ}C$, $350^{\circ}C$ respectively to remove impurities from the plasma-material interaction surfaces. Here the required heating power to be supplied for baking has been calculated according to pre-assumed different temperature profiles (baking scenario and proper baking plan for KSTAR tokamak has been proposed. Mass flow rate and temperature of nitrogen gas for baking has also been calculated.

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Extreme baking effect of interlayer on PLED's performance

  • Kim, Mu-Gyeom;Kim, Sang-Yeol;Lee, Tae-Woo;Park, Sang-Hun;Park, Jong-Jin;Pu, Lyong-Sun
    • 한국정보디스플레이학회:학술대회논문집
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    • 한국정보디스플레이학회 2006년도 6th International Meeting on Information Display
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    • pp.1775-1778
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    • 2006
  • Through baking process on an interlayer, known as hole transporting layer, varying baking temperature up to 300 degree, which is considered as extremely high for polymer light emitting device (PLED) system, we found interesting relationship between packing density and morphology affecting device performance. Granular morphology shows that as temperature increases, grain size is getting smaller to pack closely and make interlayer harden. Such denser interlayer has temperature dependency of its own mobility, even without clear evidence of degradation of material itself. Its fact proven in a single film also reflects on multilayered PLED's performance like IVL, efficiency, lifetime. It's found that, especially, to enhance lifetime is related with thermal stability of interlayer and its mobility dependency to meet better charge balance. Therefore, it gives us understanding not only baking effect of interlayer, but also material & device designing guide to enhance lifetime.

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이스트 첨가 수준, 발효 시간 및 오븐 온도에 따른 쌀빵 품질 특성 (Effects of the Percentages of Yeast, Fermentation Time and Oven Temperature on the Quality Characteristics of Rice Bread)

  • 김상숙;정혜영
    • 한국식품영양학회지
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    • 제32권4호
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    • pp.371-378
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    • 2019
  • This paper investigated the effects of the percentages of yeast and fermentation time as well as the top and bottom temperature of oven on the baking properties of rice bread. The specific volume of the dough decreased as the amount of added yeast and fermentation time increased. When 1.5% yeast was added at 60 min of fermentation time, the shape of the rice bread showed the largest volume, high appearance and a round shape. The top and bottom temperature of the oven on the baking characteristics of rice bread were affected by the baking time. When the top and bottom temperature of the oven at 200 and $140^{\circ}C$, and 200 and $170^{\circ}C$, the baking time was 20 min. When the top and bottom temperature of oven at 140 and $170^{\circ}C$, the baking time was 40 min. When the top and bottom temperature of the oven were 170 and $170^{\circ}C$, the shape of the rice bread indicated the largest volume, high appearance and a round shape. The results of this study revealed that the replacement of rice flour with 1.5% yeast, 60 min of fermentation time, and the top and bottom temperature of oven at $170-170^{\circ}C$ are effective for rice bread.

Evaluation of Deodorization Capabilities, Morphologies, and Thermal Stabilities of Baking Soda, Charcoal, Coffee, and Green Tea for Kimchi Packaging Application

  • Jeong, Suyeon;Yoo, Seung Ran
    • 한국포장학회지
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    • 제26권1호
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    • pp.1-9
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    • 2020
  • We evaluated the applicability of baking soda, charco'al, coffee, and green tea as a natural deodorant in Kimchi packaging. Moreover, to evaluate the potential usage of these deodorants in packaging materials and confirm their applicability in high-temperature melt-extrusion processing, the thermal stabilities of the deodorants were investigated, and heat-treated deodorants were evaluated in terms of the deodorizing function compared with non-treated deodorants. Aroma patterns were decreased after deodorizing treatment with all-natural deodorants. Dimethyl disulfide, methyl trisulfide, and diallyl disulfide, the most significant odorous Volatile organic compounds (VOCs) of Kimchi, decreased after treatment with the deodorants. In particular, baking soda and charcoal showed the highest efficiency in removing odorous compounds and VOCs from Kimchi, even after high-temperature processing. The acetic acid removal rates for both baking soda and charcoal were 99.9±0.0%. The heating process increases the deodorizing effects of baking soda. Sensory evaluation results showed that there is a significant increase (p < 0.05) in the overall preference for Kimchi samples packaged with charcoal and baking soda. This study provides useful information for the deodorization effects of natural deodorants for Kimchi smell and their applicability for packaging materials.