• Aerospace Engineering and Technology
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• v.2 no.2
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• pp.45-49
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• 2003

A Bake-Out test for STSAT-1 FM(Flight Model) was performed in a Bake-Out Chamber at SITC(Satellite Integration & Test Center) in KARI(Korea Aerospace Research Institute). The purpose of this test is to measure and analyze the outgassing rate to affect the optical equipment(FIMS) and to eliminate contaminants through the high temperature bake-out. This Bake-Out test is composed of three parts which are honeycomb panels & harnesses(Batch 1), an assembled satellite(Batch 2), and a disassembled satellite(Batch 3). For each test, quantitative and qualitative measurements and analysis were performed using TQCM(Thermoelectric Quartz Crystal Microbalance) and RGA(Residual Gas Analyzer.)

• Korean Journal of Materials Research
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• v.30 no.6
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• pp.315-320
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• 2020

This study deals with the yielding behavior and strain aging properties of three bake hardening steels with dual-phase microstructure, fabricated by varying the annealing temperature. Bake hardening and aging tests are performed to examine the correlation of martensite volume fraction with yielding behavior and strain aging properties of the bake hardening steels with dual-phase microstructure. The volume fraction of martensite increases with increasing annealing temperature. Room-temperature tensile test results show that the yielding behavior changes from discontinuous-type to continuous-type with increasing volume fraction of martensite due to higher mobile dislocation density. According to the bake hardening and aging tests, the specimen with the highest fraction of martensite exhibited high bake hardening with low aging index because solute carbon atoms in ferrite and martensite effectively diffuse to dislocations during the bake hardening test, while in the aging test they diffuse at only ferrite due to lower aging temperature.

• Journal of the Korean Vacuum Society
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• v.11 no.2
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• pp.87-96
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• 2002

Outgassing from such sources as paints, coatings, adhesives and other non-metallic surfaces can contaminate satellites, especially second surface mirror and optical lens, it cause satellite to fail in own missions. The vacuum bake-out test using high temperature(more than $85 ^{\circ}C$)and high vacuum(less than $5.0{\times}1-^{-3}$ Pa) certify that the components of satellite work properly and can survive and operate in space environment like high vacuum. In the bake-out chamber installed at SITC of KARI, Rotary vacuum pump and Booster pump produce low vacuum of 5.0 Pa, and then two cryopumps produce high vacuum of below $5.0{\times}10^{-3}$ Pa. Also 48 ceramic heaters were provided to simulate high temperature. During the vacuum bake-out test, we detected contaminants using RGA(Residual Gas Analyzer) and measure the outgassing rate of the contaminant using the TQCM(Thermoelectric Quartz Crystal Microbalance). Also, IR/UV Spectrometer and witness plate be used to certify that the components were suitable for the spacecraft. This paper includes the preparation and procedures of the bake-out test for SAR(Solar Array Regulator) and MLI(Multi Layer Insulator), which were the components of the spacecraft. Especially, we discussed the methods and results of the contamination measurement. In the bake-out for SAR, the contamination was measured continuously although it was on the decrease from TQCM results. And RCA established that it is a highly polymerized compound. In the MLI bake-out using RGA and witness plate, we didn't detect any contamination materials.

• Korean Journal of Metals and Materials
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• v.49 no.6
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• pp.448-453
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• 2011

Pre-aging heat treatment after solution heat treatment (SHT) of Al-0.4 wt%Mg-1.2 wt%Si-0.1 wt%Mn alloy sheets for auto-bodies was carried out to investigate the effect of pre-aging and its conditions on the bake-hardening response. Mechanical properties were evaluated by a tensile and Vickers hardness test. Microstructural observation was also performed using a transmission electron microscope (TEM). It was revealed that pre-aging treatments play a great role in the bake-hardening response. In addition, it was found that the sphere-shaped nanosized clusters that can directly transit to the needle-shaped ${\beta}$" phase during the paint-bake process, not being dissolved into the matrix, are formed at 343 K. The result, reveals that the dominant factor of the bake-hardening response is the pre-aging temperature rather than the pre-aging time.

• Journal of Korea Foundry Society
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• v.24 no.4
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• pp.231-237
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• 2004

Bake hardenable steel utilizes the phenomenon of strain aging to provide an increase in the yield strength of formed components. An increase of the carbon content will improve the bake hardening response: more solutes are available to pin mobile dislocations and to form the clusters more rapidly. But aging resistance decrease as increasing solute carbon. In order to under-stand the compatibility between bake hardenability and aging resistance. The optimum solute carbon control methods during manufacture should be determined. In this paper, the effect of continuous heat cycle conditions such as soaking temperature, rapid cooling start temperature, cooling rate on BH(Bake Hardenability), AI(Aging Index), YP-El(Yield Point Elongation) and other mechanical properties have been investigated. and following results were obtained. In the case of soaking temperature, BH increases with higher soaking temperature because of NbC $dissolution(830^{\circ}C)$, Therefore the solute carbon and BH at $850^{\circ}C$ and $870^{\circ}C$ are higher than these at $810^{\circ}C$. But BH at $870^{\circ}C$ is a little lower than that at $850^{\circ}C$ owing to the ferrite grain size. The measurement of amount of dissolution C using IFT(Internal Friction Test) can explain the relation of solute carbon and BH.

• Journal of the Semiconductor & Display Technology
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• v.5 no.2 s.15
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• pp.33-36
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• 2006

Many issues arose to use the Pb-free solder as adhesive materials in MEMS ICs and packaging. Then this study for easy and simple sealing method using adhesive materials was carried out to maintain hermetic characteristic in MEMS Package. In this study, Hermetic characteristic using negative PR (XP SU-8 3050 NO-2) as adhesive at the interface of Si test coupon/glass substrate and Si test coupon/LTCC substrate was examined. For experiment, the dispenser pressure was 4 MPa and the $200\;{\mu}m{\Phi}$ syringe nozzle was used. 3.0 mm/sec as speed of dispensing and 0.13 mm as the gap between Si test coupon and nozzle was selected to machine condition. 1 min at $65^{\circ}C$ and 15 min at $95^{\circ}C$ as Soft bake, $200\;mj/cm^2$ expose in 365 nm wavelength as UV expose, 1 min at $65^{\circ}C$ and 6 min at $95^{\circ}C$ as Post expose bake, 60 min at $150^{\circ}C$ as hard bake were selected to activation condition of negative PR. Hermetic sealing was achieved at the Si test coupon/ glass substrate and Si test coupon/LTCC substrate. The leak rate of Si test coupon/glass substrate was $5.9{\times}10^{-8}mbar-l/sec$, and there was no effect by adhesive method. The leak rate of Si test coupon/LTCC substrate was $4.9{\times}10^{-8}mbar-l/sec$, and there was no effect by dispensing cycle. Better leak rate value could be achieved to use modified substrate which prevent PR flow, to increase UV expose energy and to use system that controls gap automatically with vision.

• Journal of the Korean Society for Heat Treatment
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• v.33 no.4
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• pp.161-172
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• 2020

The tensile property of A5082 and A6060 aluminium wrought alloys was investigated, in terms of the strain rate sensitivity on alloy conditions by heat treatment and bake hardenability on pre-strain prior to strain ageing. The tensile test was carried out in a range of strain rate of 4.17 × 10^-5 s^-1 ~ 4.17 × 10^-5 s^-1 in room temperature and the nominal range of pre-strain was 3.0 ~ 10.5%. The tensile deformation of A5082 alloys is characterized as typical case of dynamic strain ageing with negative strain rate sensitivity for all conditions, and the tensile strength indicates a similar level regardless of alloy conditions, except only in full annealed condition. The stress-relief annealing on A6060 alloys can induce practical decrease in strength level of over approximately 100 MPa without any ductility loss, compared to as-rolled condition, while a full annealed and aged condition leads remarkable strengthening effect with the decrease of tensile elongation. Additionally, the bake hardenability of A5082 alloy by strain ageing indicates a negative dependence upon the increase of pre-strain, while A6060 alloy exhibits a positive sign even in low level relatively compared with conventional SPCC.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.2024-2027
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• 2005

This study was aimed to prove the safety of rubber-tired AGT light rail vehicle, which was designed to have the redundant equipment for safety, so the experiment of this paper was operated in condition of malfunction which we made such as bake sequence test and momentary interruption test. The result can bes handled by Labview 7.0 and showed as the graph.

• Aerospace Engineering and Technology
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• v.4 no.1
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• pp.150-161
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• 2005

A test was performed to collect the data to validate an analytic method for vent hole sizing on the nose fairing of a launch vehicle. The bake-out chamber at KARI was used to simulate the ambient pressure drop, and pressure difference data were collected for a model with various kinds of vent holes which was installed in the chamber. The characteristics of the test facility and measurement equipments were evaluated for the measurement of the transient behaviors. The measured data were processed in consideration of the characteristics of the facility and equipments, and the effects of vent hole size and configuration on the pressure variation in the model were analyzed based on the data.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.48 no.8
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• pp.598-604
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• 1999

This paper describes the research to minimize the film stress and maximize the aspect ratio of photoresist structure, especially about SU-8 for electroplating mold. UV LIGA process using SU-8 allows fabricating high aspect ratio polymer structures. However, it is hard to get fine patterns in the high aspect ratio structures because of high internal stress and difficulty of removing SU-8. The purpose of this paper is to setup the process condition for the obtainment of both low film stress and high aspect ratio and to find design rules that make the pattern be less dependent on stress problem. Firstly, the process of heat treatment and exposure of SU-8 are proposed. These two conditions control the amount of cross-linkage in polymer structure, which is the most important parameter of both pattern generation and remaining stress. Heat treatment is dealed with soft bake and post-exposure-bake. Temperature and time duration of each step are varied with heat treatment condition. Some test patterns are fabricated to evaluate the proposed process. Nickel electroplating is performed with the mold fabricated through the proposed process to confirm the SU-8 as a good electroplating mold.