• Design & Manufacturing
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• 제14권4호
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• pp.58-64
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• 2020

Lately, the development of the semiconductor industry has led to the miniaturization of electronic devices. Therefore, semiconductor wafers of very thin thickness that can be used in Multi-Chip Packages are required. There is active research on the backgrinding process to reduce the thickness of the wafer. The backgrinding process polishes the backside of the wafer, reducing the thickness of the wafer to tens of ㎛. The equipment that performs the backgrinding process requires ultra-precision. Currently, there is no full auto backgrinding equipment in Korea. Therefore, in this study, ultra-precision backgrinding equipment was designed. In addition, finite element analysis was conducted to verify the equipment design validity. The deflection and structural stability of the backgrinding equipment were analyzed using finite element analysis.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2010년도 춘계학술대회 논문집
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• pp.653-654
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• 2010

• 반도체디스플레이기술학회지
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• 제22권3호
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• pp.1-7
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• 2023

Recently, in the semiconductor industry, memory device market is focusing on producing ultra-thin wafers for high integration. In the wafer manufacturing process, wafers after backgrinding and CMP process must be picked up as individual dies and subjected to be peeled off from the dicing tape. However, ultra-thin dies are vulnerable to the possibility of breakage and failure in their thickness and size. This research studies the mechanism of peeling a die with a high-aspect ratio using a thermopneumatic method instead of a die ejector with physical pins. Setting compressed air and the temperature as main factors, we determine the success of the digester using thermopneumatic system and analyze the good die to find the possibility of making mass-production equipment.

• Membrane and Water Treatment
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• 제3권4호
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• pp.221-230
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• 2012

This study employed the modified fouling index (MFI) to determine the performance of a two-step recycling system - a membrane filtration integrated laminar flow water storage (LFWS) tank followed by an ion exchange process to reclaim ultrapure water (UPW) from the wastewater generated from semiconductor wafer backgrinding and sawing processes. The first step consisted of the utilization of either ultrafiltration (UF) or nanofiltration (NF) membranes to remove solids in the wastewater where the second step consisted of an ion exchanger to further purify the filtrate. The system was able to produce high purity water in a continuous operating mode. However, higher recycling cost could be incurred due to membrane fouling. The feed wastewater used for this study contained high concentration of fine particles with low organic and ionic contents, hence membrane fouling was mainly attributed to particulate deposition and cake formation. Based on the MFI results, a LFWS tank that was equipped with a turbulence reducer with a pair of auto-valves was developed and found effective in minimizing fouling by discharging concentrated wastewater prior to any membrane filtration. By comparing flux behaviors of the improved system with the conventional system, the former maintained a high flux than the latter at the end of the experiment.