• The Transactions of the Korean Institute of Electrical Engineers A
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• v.48 no.10
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• pp.1303-1310
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• 1999

In this paper, the Timed Petri-Nets(TPN) modeling of Modular Cell Manufacturing Systems(MCMS) was investigated to overcome the limit of batch mode operation, which has been one of the most popular manufacturing types to produce an extensive industrial output and to be able to adopt to suitable and quickly changing manufacturing environments. A model of the MCMS was developed in reference to the actual TFT-LCD manufacturing system. TFT-LCD manufacturing system is not mass-productive in batch mode, but it operates in the form of MCMS which consists of a sequence of several cells with four processes of operation, including those of color filter(C/F), TFT, cell, and module. The cell process is further regrouped in those of Front-End and Back-End. For the Back-End cell process, it is reconstructed into a virtual model, consisting of three cells. The TPN modeling encompasses those properties, such as states and operations of machines, the number of buffers, and the processing time. The performance of the modeling was further examined in terms of scheduling system. The productivity in each cells was examined with respect to the change of failure rate of the cell machines and Automatic Guided Vehicles(AGV) using simulation by TPN.

• Journal of Institute of Control, Robotics and Systems
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• v.5 no.6
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• pp.724-733
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• 1999

An effective method of system modeling and dynamic scheduling for the back-end line of semiconductor manufacturing is proposed. The virtual factory, describing semiconductor manufacturing line, is designed in detail, and then a Petri net model simulator is developed for operation and control of the modular cells of the virtual factory. The petri net model is a colored timed Petri nets (CTPNs). The simulator will be utilized to analyze and evaluate various dynamic status and operatons of manufacturing environments. The dynamic schedulaer has a hierarchical structure with the higher for planning level and the lower for dynamic scheduling level. The genetic algorithm is applied to extract optimal conditions of the scheduling algorithm. The proposed dynamic scheduling is able to realize the semiconductor manufacturing environments for the diversity of products, the variety of orders by many customers, the flexibility of order change by changing market conditions, the complexity of manufacturing processes, and the uncertainty of manufacturing resources. The proposed method of dynamic scheduling is more effective and useful in dealing with such recent pressing requirements including on-time delivery, quick response, and flexibility.

• Proceedings of the Korean Society of Laser Processing Conference
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• 2002.11a
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• pp.65-67
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• 2002

• Journal of the Korean Society for Precision Engineering
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• v.13 no.8
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• pp.31-39
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• 1996

In this paper, the error and its sources in manufacturing of bourdon tube pressure gage was studied, and the method to reduce such errors was discussed. In more detail, the effects of parallelism of rollers, spring back, uniformity of radius curvature and the ratio of circumferential speeds of rollers were invesrti- gated. As a reselt, we could find out that the aprallelism of roller affected to the displacement error at the free end of gage and that the amount of spring back was closely related with the ratio of circumferential speeds of rollers. The uniformity of curvature radius was determined by the distance between bending rollers and it was comparatively uniform in the range above 30 .deg. C from the both sides of tube. Also, the ratio of circumfer-ential speeds of rollers was finded out as a very important factor giving severe influence on the creep or the hysteresis of bourdon tube.

• Transactions of Materials Processing
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• v.11 no.3
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• pp.238-245
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• 2002

The spring back taking place after the coiling process of steam generator tube leads to the dimensional inaccuracy. In order to reduce the spring back, tension force was applied to the one end of the tube during forming. In this work, parametric study using FEM was performed to find the appropriate magnitude of tension force. The force that induces minimum spring back was found by simultaneously taking account if spring back amount, cross-sectional ovality, and thickness of the tube wall after deformation. In addition, stress relieving by heat treatment was also simulated as an alternative to the former method. The latter was found to be more effective under the given constraints.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2001.04a
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• pp.1117-1120
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• 2001

Chemical mechanical planarization(CMP) has emerged as the planarization technique of choice in both front-end and back-end integrated circuit manufacturing. Conventional CMP process utilize a polyurethane polishing pad and liquid chemical slurry containing abrasive particles. There have been serious problems in CMP in terms of repeatability and defects in patterned wafers. Since IBM's official announcement on Copper Dual Damascene(Cu2D) technology, the semiconductor world has been engaged in a Cu2D race. Today, even after~3years of extensive R&D work, the End-of-Line(EOL) yields are still too low to allow the transition of technology to manufacturing. One of the reasons behind this is the myriad of defects associated with Cu technology. Especially, dishing and erosion defects increase the resistance because they decrease the interconnection section area, and ultimately reduce the lifetime of the semiconductor. Methods to reduce dishing & erosion have recently been interface hardness of the pad, optimization of the pattern structure as dummy patterns. Dishing & erosion are initially generated an uneven pressure distribution in the materials. These defects are accelerated by free abrasive and chemical etching. Therefore, it is known that dishing & erosion can be reduced by minimizing the abrasive concentration. Minimizing the abrasive concentration by using Ce$O_2$ is the best solution for reducing dishing & erosion and for removal rate. This paper introduce dishing & erosion generating mechanism and a method for developing a semi-rigid abrasive pad to minimize dishing & erosion during CMP.

• Design & Manufacturing
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• v.16 no.1
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• pp.27-35
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• 2022

Thermoforming is a plastic manufacturing process that applies a force to stretch a film of heated thermoplastic material over an engineered mold to create a 3-dimensional shape. After forming, the shaped part can then be trimmed and finished to specification to meet an end-user's requirements. The process and thermoplastic materials are extremely versatile and can be utilized to manufacture parts for a very wide range of applications. In this study, based on K-BKZ nonlinear viscoelastic model, thermoforming process analysis was performed for an interior room-lamp. The predicted thickness was minimum at the corner of a molded film, and maximum at the center of the bottom. By using the Taguchi method of design of experiments, the effects of process conditions on residual stresses were investigated. The dominant factors were the liner thickness and the film heating time. As the thickness of the liner increased, the residual stress decreased. And it was found that the residual stress decreased significantly when the film heating temperature was higher than the glass transition temperature. A thermoforming mold and a trimming mold were manufactured, and the spring back was investigated through experiments. The dominant factors were film heating time, liner thickness, and lower mold temperature. As the film heating time and liner thickness increased, the spring back decreased. In addition, it was found that the spring back decreased as the lower mold temperature increased.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.15 no.1
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• pp.70-75
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• 2006

This paper represents a study on disassembly sequence generation system for automobile parts. This system is practically very useful because proper disassembly sequence of end-of-life product becomes crucial as take-back obligations are imposed for environmental reasons. Therefore a disassembly sequence generation system is suggested to automatically derive all the feasible disassembly sequences from the assembly modeling files. As a result, in consideration of the all parts and subassemblies the optimum disassembly sequence is generated. And the optimum disassembly sequence for a certain part or subassembly can be also suggested.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.17 no.2
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• pp.58-64
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• 2008

The cutting process of materials is accompanied with the elastic and plastic deformation due to chucking forces in the boring process of thin holes on the turning. Upon removal of chucking forces at the end of process, the original shape is remained in the plastic deformation; on the other hand, it is modified in the elastic deformation due to spring back. Fixing materials by chucks on the turning has influence on roundness because the process is conducted with unbalanced distribution load induced from the fixing of three jaws. Moreover, the amount of spring back depends on the magnitude of fixing forces. We studied the change of roundness according to fixing forces as well as the method to reduce the influence of chucking forces.

• Journal of the Korean Society of Industry Convergence
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• v.25 no.2_2
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• pp.247-255
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• 2022

Robot Process Automation (RPA) is a computer technology called Robotic Process Automation, a form of business process automation based on the concept of software robots or artificial intelligence (AI) walkers. In general, in traditional workflow automation tools, software developers design software that creates a set of actions to automate tasks and interfaces for the back-end systems using internal APIs or dedicated script languages. However, in RPA software, automation can be implemented by configuring an operating processor as if the general user is directly performing the task of the application. In other words, it can be said that it is a suitable development method for automating simply repetitive tasks rather than developing specific programs in which all necessary functions are implemented, as in general software development. Thus, this is more appropriate for configuring and automating RPA software in traditional manufacturing companies that are not easy to develop and apply smart factories or high-end AI software. Therefore, this research aims to analyze the requirements required at the actual manufacturing companies, focusing on the manufacturer's case in Changwon, Gyeongsangnam-do, called SinceWin Co., Ltd., and to examine the possibility of RPA software in the manufacturing companies by implementing actual RPA software that supports office automation. Through the research, it was confirmed that the actually implemented RPA software met the requirements of the company and helped manufacturer practice significantly by automating the parts that were worked error-prone and manually periodically.