• 산업공학
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• 제13권3호
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• pp.539-547
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• 2000

An architecture of a Web-based Decision Support system for mathematical analysis is presented. Front-end modules provide web-client GUI environment for mathematical analysis. The networking architecture is built upon client/server system by Java socket and accesses database by JDBC in WWW. Back-end modules provide decision supporting service and data management for mathematical programming analysis. In the back-end any analysis tools, such as mathematical optimizer, simulation package, or statistics package can be used. As an application example for this implementation, optimal facility replacement decision problem is selected. In the implementation the optimal facility replacement decision problem is formulated as a shortest path problem. It uses Oracle DB and CPLEX package as the mathematical optimizer. While ORAWeb is designed and implemented on the optimal facility replacement problem, it can easily be extended to any decision supporting problems that would require mathematical optimization process.

• 한국차세대컴퓨팅학회논문지
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• 제15권4호
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• pp.18-29
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• 2019

동적 적응 스트리밍 서버는 일시에 많은 양의 트랜스코딩 연산을 처리하기 때문에 높은 프로세서 전력을 소모한다. 많은 연산량을 위하여 다중 프로세서 구조가 필요하고, 이에 대한 효과적인 트랜스코딩 태스크 분배가 필요하다. 본 논문에서는 2 티어 (프론트엔드 노드 (frontend node)와 백엔드 노드 (backend node)) 트랜스코딩 서버의 전력 상한을 보장하고 스트리밍 되는 비디오의 인기도 및 품질을 고려한 트랜스코딩 서버의 설계 및 구현 방법을 제안한다. 이를 위하여 1) 각 백엔드 노드에 트랜스코딩 태스크 분배, 2) 백엔드 노드에서의 태스크 스케줄링, 3) 프론트엔드와 백엔드 노드 통신 기법들을 구현하고, 테스트베드를 구축하였다. 실제 테스트베드에서의 예상 소모 전력과 실제 소모 전력을 비교하는 실험을 진행함으로써 본 시스템의 효용성을 확인했다. 또한 본 시스템이 각 노드의 부하를 감소시킴으로써 트랜스코딩에 사용되는 전력 및 시간 최적화가 가능함을 보였다.

• 전자공학회지
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• 제30권9호
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• pp.1002-1011
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• 2003

In this paper, we introduce an integrated SoC front-end design & verification environment which can be practically used in the embedded 32-bit processor-core SoC VLSI design. Our introduced SoC design & verification environment integrates two most important flows, such as the RTL power estimation and code coverage analysis, with the functional verification (chip validation) flow which is used in the conventional simulation-based design. For this, we developed two simulation-based inhouse tools, RTL power estimator and code coverage analyzer, and used them to adopt them to our RTL design and to increase the design quality of that. Our integrated design environment also includes basic design and verification flows such as the gate-level functional verification with back annotation information and test vector capture & replay environment.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2007년도 제38회 하계학술대회
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• pp.991-992
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• 2007

This paper presents high efficiency IPMSM design for compressor of refrigerator having main operation speed of 1800rpm and 3600rpm. The characteristics of IPMSM greatly vary according to back-EMF and inductance. Therefor the design is to estimate the range of back-EMF and inductance satisfying the requirements of IPMSM in the initial design. Thereafter the optimization is performed to consider magnetic saturation and reduce torque ripple. In the end the validity of the design process proposed in this paper is verified by test.

• 한국재료학회지
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• 제28권1호
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• pp.38-42
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• 2018

Continuous efforts are being made to improve the efficiency of Si solar cells, which is the prevailing technology at this time. As opposed to the standard front-lit solar cell design, the back-lit design suffers no shading loss because all the metal electrodes are placed on one side close to the pn junction, which is referred to as the front side, and the incoming light enters the denuded back side. In this study, a systematic comparison between the two designs was conducted by means of computer simulation. Medici, a two-dimensional semiconductor device simulation tool, was utilized for this purpose. The $0.6{\mu}m$ wavelength, the peak value for the AM-1.5 illumination, was chosen for the incident photons, and the minority-carrier recombination lifetime (${\tau}$), a key indicator of the Si substrate quality, was the main variable in the simulation on a p-type $150{\mu}m$ thick Si substrate. Qualitatively, minority-carrier recombination affected the short circuit current (Isc) but not the opencircuit voltage (Voc). The latter was most affected by series resistance associated with the electrode locations. Quantitatively, when ${\tau}{\leq}500{\mu}s$, the simulation yielded the solar cell power outputs of $20.7mW{\cdot}cm^{-2}$ and $18.6mW{\cdot}cm^{-2}$, respectively, for the front-lit and back-lit cells, a reasonable 10 % difference. However, when ${\tau}$ < $500{\mu}s$, the difference was 20 % or more, making the back-lit design less than competitive. We concluded that the back-lit design, despite its inherent benefits, is not suitable for a broad range of Si solar cells but may only be applicable in the high-end cells where float-zone (FZ) or magnetic Czochralski (MCZ) Si crystals of the highest quality are used as the substrate.

• 한국정보통신학회:학술대회논문집
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• 한국정보통신학회 2012년도 추계학술대회
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• pp.954-955
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• 2012

최근 모바일 통신장치의 사용이 증가함에 따라 사물에 부착된 태그를 인식하기 위한 이동형 리더기의 사용도 증가하고 있다. 이에 따라 그동안 RFID 시스템의 취약점으로 대두되었던 리더와 태그 사이의 보안 문제점 뿐만 아니라 리더와 백엔드 서버 사이의 보안 문제가 발생한다. 따라서 본 논문에서는 이동형 리더와 백엔드 서버 사이의 보안 취약점을 해결하기 위해 해쉬함수를 이용한 효율적인 인증 프로토콜을 제안한다.

• Design & Manufacturing
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• 제16권1호
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• pp.27-35
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• 2022

Thermoforming is a plastic manufacturing process that applies a force to stretch a film of heated thermoplastic material over an engineered mold to create a 3-dimensional shape. After forming, the shaped part can then be trimmed and finished to specification to meet an end-user's requirements. The process and thermoplastic materials are extremely versatile and can be utilized to manufacture parts for a very wide range of applications. In this study, based on K-BKZ nonlinear viscoelastic model, thermoforming process analysis was performed for an interior room-lamp. The predicted thickness was minimum at the corner of a molded film, and maximum at the center of the bottom. By using the Taguchi method of design of experiments, the effects of process conditions on residual stresses were investigated. The dominant factors were the liner thickness and the film heating time. As the thickness of the liner increased, the residual stress decreased. And it was found that the residual stress decreased significantly when the film heating temperature was higher than the glass transition temperature. A thermoforming mold and a trimming mold were manufactured, and the spring back was investigated through experiments. The dominant factors were film heating time, liner thickness, and lower mold temperature. As the film heating time and liner thickness increased, the spring back decreased. In addition, it was found that the spring back decreased as the lower mold temperature increased.

• 드라이브 ㆍ 컨트롤
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• 제13권4호
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• pp.1-6
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• 2016

Typically, the seat of an automotive vehicle generally includes a horizontal seat-cushion portion and a vertical seat-back portion that is operatively connected to the seat-cushion portion. The seat may include a recliner for the reclining of the seat-back portion relative to the seat-cushion portion by the seat occupant. An energy absorber or damper can also be provided for the seat-back portion. Because the recliner is configured to be released at a relatively high speed, and it results in an impact at the end of a folding stroke, the damper needs to dissipate energy as the seat back moves with respect to the seat cushion; therefore, the role of the seat damper in the automotive-seat design is important. In this paper, the mechanism of an hydraulic-type automotive-seat damper is investigated, and the torque characteristic is simulated according to the design-parameter variations such as the orifice area and the working-fluid properties.

• Journal of Information Processing Systems
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• 제2권3호
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• pp.137-142
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• 2006

A large portion of the embedded system development process involves the integration of hardware and software. Unfortunately, communication across the hardware/software boundary is tedious and error-prone to create. This paper presents an automatic hardware/software interface generation system. As the front-end of hardware/software co-design frameworks, a system designer defines XML specifications for hardware functions. Our system generates hardware/software interfaces including Device Driver, Driver API, and Device Controller from these specifications. Embedded software designers can easily use hardware just like system libraries. Our system reduces the mistakes and errors that can be occurred when a software programmer directly connects software to hardware, and supports balancing labors between hardware developers and software programmers. Moreover, this system can be used as the back-end for a hardware/software co-design framework.

• Journal of information and communication convergence engineering
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• 제7권4호
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• pp.570-575
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• 2009

This paper describes an implementation of project-based learning in routing design course. The total students who enrolled in the class were 48 and were divided into groups of 3~4 students. At the beginning of the course, a survey was conducted to check the student's level of back ground knowledge acquired from the prerequisite courses. At the end of the curse, we also conducted a survey to evaluate the effect of project-based learning. According to the end of course survey, the course was helpful to identify the problems to solve by themselves, to develop the problem solving ability, and to understand the global picture of the subject by integrating knowledge of each chapter into a project. The survey also shows that students recognized the importance of the teamwork skill throughout the project activity.