• Proceedings of the KIPE Conference
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• 2015.07a
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• pp.15-16
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• 2015

According to 2014 fire statistical yearbook in the National Fire Data System, a main cause of fire is electrical fire except carelessness fire. Joint/contact badness is the one of the main cause of electrical fire. Furthermore, power relays which are used in electric panel board, motor control center and automation controller, are main element of automation system in the industry field. Overload, voltage unbalance and open-phase due to joint/contact badness of terminal make electric accidents or electrical fires. In order to prevent joint/contact badness of terminal, this paper proposes a sensing circuit of chattering, tracking, arc current, voltage unbalance and open-phase etc. Some experimental tests of the proposed apparatus confirm practicality and validity of the theoretical results.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.23 no.4
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• pp.298-302
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• 2010

We investigated the resistance change behavior of SABiT (Samsung Advanced Bump interconnection Technology) technology-applied PCB (Printed Circuit Board) with the various bump sizes and fabrication conditions. Many testing samples with different bump size, prepreg thickness, number of print on the formation of Ag paste bump, were made. The resistance of Ag paste bump itself was calculated from the Ag paste resistivity and bump size, measured by using 4-point probe method and FE-SEM (Field Emission Scanning Electron Microscope), respectively. The contact resistance between Ag paste bump and conducting Cu line were obtained by subtracting the Cu line and bump resistances from the measured total resistance. It was found that the contact resistance drastically changed with the variation of Ag paste bump size and the contact resistance had the largest influence on total resistance. We found that the bump size and contact resistance obeyed the power law relationship. The resistance of a circuit in PCB can be estimated from this kind of relationship as the bump size and fabrication technique vary.

• Korean Journal of Applied Biomechanics
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• v.14 no.3
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• pp.135-147
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• 2004

This study was conducted to investigate the technical factors of Lu Yu Fu vault actually performed by three men gymnasts participated in artistic gymnastics competition of 2003 summer Universiade in Daegu through the DLT method of three dimensional cinematography. To analyze these vaults, the instant events of Lu Yu Fu were set in the board touchdown(BTD), the board takeoff(BTO), the horse touchdown(HTD), the horse takeoff(HTO), the peak height(PH), the mat touchdown(MTD) respectively and the phases of that vault were set in the board contact(BC), the preflight(PRF), the horse contact(HC), the postflight(POF), the grounding on mat(GM) respectively After calculating the performance times, the CG displacement velocity, the kinetic energy impulse reaction force moment arm torque at the horse, the released angle piked angle addressed angle, the angular momentum angular velocity of whole body in x axis, and the horizontal displacement between the feet and CG, the following conclusions were reached. To perform the better Lu Yu Fu vault, a gymnast must have the large horizontal velocity of whole body with fast run-up, decrease the duration time and the horizontal vertical displacement of whole body in PRF, have the enough time to judge the correct magnitude and direction of force to brake or push the horse so as to lengthen the HC duration time at any cost. Also it is desirable to increase the horizontal vertical displacement of whole body in POF if possible, maintain the adequate piked position to decrease the angular velocity of whole body in x axis, prepare the grounding on mat previously and delay the release of the hand from the body to keep the angular momentum.

• Journal of the Korean Wood Science and Technology
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• v.50 no.6
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• pp.392-403
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• 2022

Currently, composite board manufacturing using natural fibers has the potential to expand owing to environmental awareness. To produce a composite board, treatment is required to improve the mechanical and physical properties of the natural fibers. In this study, sodium chloride (NaCl) was used for the chemical treatment. However, studies on chemical treatments using NaCl are limited. This study aimed to investigate the characteristics of kenaf fibers after NaCl treatment. The NaCl treatment concentrations were 1, 3, and 5 wt.% at room temperature, with soaking durations of 1, 2, and 3 h. The tensile strength, strain, and Young's modulus were measured to evaluate the mechanical properties of the fibers. The fiber bundle diameter, weight change owing to treatment, and contact angle were determined to analyze the effect of NaCl treatment. The kenaf fiber bundle treated with 5 wt.% NaCl for 3 h exhibited the highest tensile strength, Young's modulus, reduction in fiber bundle diameter, weight change, and decrease in contact angle compared to those of untreated fiber bundles. The tensile properties of the fiber bundle exhibited a tendency to decrease with increasing fiber bundle diameter. Increasing the soaking duration from 1 to 2 h did not result in a significant decrease in the fiber bundle diameter or an increase in tensile strength. However, a further increase in the soaking duration from 2 to 3 h resulted in a considerable decrease in the fiber bundle diameter and an increase in the tensile strength.

• The korean journal of orthodontics
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• v.41 no.3
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• pp.154-163
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• 2011

Objective: The purpose of this study was to quantitatively evaluate relapse tendency after orthodontic treatment and determine the contributing factors by using the American Board of Orthodontics objective grading system (ABO-OGS). Methods: The subjects were 80 patients with more than 2 years of retention period after completing orthodontic treatment at the dental hospitals of Busan University, Kyunghee University, and Dankook University. The posttreatment (T2) and post-retention (T3) ABO-OGS measurements were analyzed in relation to age, gender, Angle's classification, extraction, retention period, and pretreatment condition (initial peer assessment rating (PAR) index, T1) by multiple regression analysis. Results: Among the 7 ABO-OGS criteria, alignment worsened but occlusal contact and interproximal contact improved in T3, but not in T2 ($p$ < 0.01). The 4 other criteria showed no significant differences. Multiple regression analysis showed that alignment, occlusal relationship, overjet, and interproximal contact were significant linear models, but with a low explanation power. Age, gender, Angle's classification, extraction, retention period, and pretreatment condition (initial PAR index, T1) had little influence on the ABO-OGS changes between T3 and T2. Conclusions: An orthodontist's understanding of posttreatment relapse tendency can be useful in diagnosis and during patient consultation.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.19 no.9
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• pp.825-831
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• 2006

As an increase of chip complexity and level of chip integration, chip input/output (I/O) pad pitches are also drastically reduced. With arrival of high complexity SoC (System on Chip) and SiP (System in Package) products, conventional horizontal type probe card showed its limitation on probing density for wafer level test. To enhance probing density, we proposed new vertical type probe card that has the $70{\mu}m$ probe needle with tungsten wire in $80{\mu}m$ micro-drilled hole in ceramic board. To minimize alignment error, micro-drilling conditions are optimized and epoxy-hardening conditions are also optimized to minimize planarity changes. To apply wafer level test for target devices (T5365 256M SDRAM), designed probe card was characterized by probe needle tension for test, contact resistance measurement, leakage current measurement and the planarity test. Compare to conventional probe card with minimum pitch of $50{\sim}125{\mu}m\;and\;2\;{\Omega}$ of average contact resistance, designed probe card showed only $22{\mu}$ of minimum pitch and $1.5{\Omega}$ of average contact resistance. And also, with the nature of vertical probing style, it showed comparably small contact scratch and it can be applied to bumping type chip test.

• Journal of Institute of Control, Robotics and Systems
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• v.3 no.3
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• pp.323-331
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• 1997

A new probing mechanism and an active compliance control algorithm have been developed for the in-circuit test of a PCB( printed circuit board ). Commercially available robotic probing devices are incapable of controlling contact force generated through rigid probe contacts with a solder joint, at high speed. The uncontrollable excessive contact force often brungs about some defects on the surface of the solder joint, which is plastically deformable over some limited contact force. This force also makes unstable contact motions resulting in unreliable test data. To overcome these problems, we propose that a serially connected macro and micro device with active compliance provide the best potential for a safe and reliable in-circuit test. This paper describes the design characteristics, modeling and control scheme of the newly proposed device. The experimental results clearly show the effectiveness of the proposed system.

• Fire Science and Engineering
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• v.23 no.2
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• pp.1-5
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• 2009

We studies wish to investigated establishment form of cabinet board, and confirm possibility of electrical disaster prevention through reappearance experiment of odor detection system. Established breaker consists of MCCB, RCD order in cabinet board for house, but industry is used together with. When imposed shock using shaker to terminal block that contact becomes in appropriate, flame was made sure. According to result that experiment attaching odor capsule in terminal block, capsule commissioned exactly by occurred heat. According to establishment position of sensor, difference of inspection time was about 10 seconds. Estimate odor inspection system by thing which electrical device accident prevention is available. When there is abnormal generated heat in connection of electric wire, accident prevention estimates that is possible by giving an alarm state of overheat to administrator.

• KIEE International Transactions on Electrophysics and Applications
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• v.2C no.6
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• pp.309-313
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• 2002

In this paper, we have studied minimization of the kerf-width and surface burning, which occurred after the conventional singulation process of the multi-layer BGA board with copper, polyethylene and epoxy glass fiber. The high thermal energy of a pulsed Nd:YAG laser is used to cut the multi-layer board. The most considerable matter in the laser cutting of the multi-layer BGA boards is their different absorption coefficient to the laser beam and their different heat conductivity. The cut mechanism of a multi-layer BGA board using a 2$^{nd}$ harmonic Nd:YAG laser is the thermal vaporization by high temperature rise based on the Gaussian profile and copper melting point. In this experiment, we found that the sacrifice layer and Na blowing are effective in minimizing the surface burning by the reaction between oxygen in the air and the laser beam. In addition, N2 blowing reduces laser energy loss by debris and suppresses surface oxidation. Also, the beam incidence on the epoxy layer compared to polyimide was much more suitable to reduce damage to polyimide with copper wire for the multi layer BGA singulation. When the polyester double-sided tape is used as a sacrifice layer, surface carbonization becomes less. The SEM, non-contact 3D inspector and high-resolution microscope are used to measure cut line-width and surface morphology.

• International Journal of Internet, Broadcasting and Communication
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• v.14 no.4
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• pp.198-205
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• 2022

Along with a variety of coding education, physical computing education for controlling various sensors is being actively conducted for elementary, middle, and high school students in line with the era of the fourth industrial revolution. A problem with physical computing education using Arduino is pin connection errors between Arduino and various sensors. Most of the students who come into contact with the Arduino for the first time often do not know the purpose of the Arduino pin and the connection position of the pin. Also, hardware built with incorrect pin connections to the Arduino board often does not work properly. If this case continues, students will lose interest in coding education. Therefore, in this paper, we implemented an augmented reality application that informs the connection process of the Arduino board and the sensor during physical computing coding education using Arduino, and designed and implemented educational content for the Arduino pin position and connection process. First, we explain the role of the Arduino board and the sensor and the location of the pins. After that, the students run the educational augmented reality educational content using their smartphones and check the correct pin connection process between the Arduino and the sensor. In the physical computing education, augmented reality content is used to increase the understanding and immersion of the class. It is expected that the educational effect will also increase by inducing fun and interest in physical computing coding education.