• Current Optics and Photonics
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• v.6 no.1
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• pp.15-22
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• 2022

This paper describes the construction of a phase shifter with low loss and small volume. To construct it, we use the two graphene layers that are separated by a hexagonal boron nitride (hBN) and embedded in a silicon waveguide. The refractive index of the waveguide is adjusted by applying a bias voltage to the graphene sheet to create an optical phase shift. This waveguide is a compact device that only has a radius of 5 ㎛. It has a phase shift of 6π. In addition, the extinction ratio (ER) is 11.6 dB and the insertion loss (IL) is 0.031 dB. Due to its unique characteristics, this device has great potential in silicon on-chip optical interconnection and all-optical multiple-input multiple-output processing.

• Korean Journal of Materials Research
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• v.3 no.2
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• pp.131-139
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• 1993

Abstract Alloying elements such as AI, Ti, Nb and B in the extra low carbon AI-killed steel precipitate as nitrides or carbides and change the recrystallization texture structure of the steel during heattreatment with the result of strong effects on the deep drawability of the steel sheet. In this study the effects of fine precipitates such as nitrides and carbides on the texture of extra low carbon steels into which Ti, Nb, B, P, Si and Mn were added as alloying elements were investigated by means of TEM, SEM and optical microscopic analyses. Fine N$b_2$C and T$i_2$AIN precipitates are mainly observed in the steel containing both Nb and Ti, while fine AIN and coarse BN precipitates are observed in the Nb~containing steel and coarse T${i_4}{N_3}$ and ${N_10}{N_22}$/T$i_68$ precipitates are observed in the Ti-containing steel. The grain size of the Ti containing steel is larger than that of the Nb containing steel and that of the one containing both Nb and Ti.

• Textile Coloration and Finishing
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• v.28 no.1
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• pp.48-56
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• 2016

Improvement of heat sink technology related to the continuous implementation performance and extension of device-life in circumstance of easy heating and more compact space has been becoming more important issue as multi-functional integration and miniaturization trend of electronic gadgets and products has been generalized. In this study, it purposed to minimize of decline of the heat diffusivity by gluing polymer through compounding of inorganic particles which have thermal conductive properties. We used NH-9300 as base resin and used inorganic fillers such as silicon carbide(SiC), aluminum nitride(AlN), and boron nitride(BN) to improve heat diffusivity. After making film which was made from 100 part of acrylic resin mixed hardener(1.0 part more or less) with inorganic particles. The film was matured at $80^{\circ}C$ for 24h. Diffusivity were tested according to sorts of particles and density of particles as well as size and structure of particle to improve the effect of heat sink in view of morphology assessing diffusivity by LFA(Netzsch/LFA 447 Nano Flash) and adhesion strength by UTM(Universal Testing Machine). The correlation between diffusivity of pure inorganic particles and composite as well as the relation between density and morphology of inorganic particles has been studied. The study related morphology showed that globular type had superior diffusivity at low density of 25% but on the contarary globular type was inferior to non-globular type at high density of 80%.