• 제목/요약/키워드: BN sheet

검색결과 13건 처리시간 0.014초

An Optical Graphene-silicon Resonator Phase Shifter Suitable for Universal Linear Circuits

  • Liu, Changling;Wang, Jianping;Chen, Hongyao;Li, Zizheng
    • Current Optics and Photonics
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    • 제6권1호
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    • pp.15-22
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    • 2022
  • This paper describes the construction of a phase shifter with low loss and small volume. To construct it, we use the two graphene layers that are separated by a hexagonal boron nitride (hBN) and embedded in a silicon waveguide. The refractive index of the waveguide is adjusted by applying a bias voltage to the graphene sheet to create an optical phase shift. This waveguide is a compact device that only has a radius of 5 ㎛. It has a phase shift of 6π. In addition, the extinction ratio (ER) is 11.6 dB and the insertion loss (IL) is 0.031 dB. Due to its unique characteristics, this device has great potential in silicon on-chip optical interconnection and all-optical multiple-input multiple-output processing.

B, Nb및 Ti를 함유한 극저탄소강에서 탄화물 및 질화물의 석출이 집합조직에 미치는 영향(ll) (Effects of the Precipitation of Carbides and Nitrides on the Texture Structures in Extra Low Carbon Steel Sheets containing B, Nb and Ti(ll))

  • 이종무;윤국한;이도형
    • 한국재료학회지
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    • 제3권2호
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    • pp.131-139
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    • 1993
  • 극저탄소 알루미늄 킬드강내에 합금원소로 첨가된 Al, Ti, Nb, B등은 열처리 공정중 질화물이나 탄화물로 석출되어 강의 재결정집합조직을 변화시킴으로써 강판재의 디입드로잉 특성에 결정적인 영향을 미친다. 본 연구에서는 Ti및 Nb를 단독으로 또는 동시에 첨가한 데 이어, B, P, Si 및 Mn등을 추가로 첨가한 극저탄소 고강도 강판의 집삽조직에 미치는 질화물, 탄화물과 같은 미세 석출물의 영향을 TEM, SEM, 광학현미경분석에 의하여 조사하였다. Nb 및 Ti를 동시에 첨가한 강에서는 미세한 N$b_2$C 및 T$i_2$AIN가 주로 석출되는 반면, Nb를 단독으로 첨가한 강에서는 미세한 AIN 및 조대한 BN이 석출되고,Ti를 단독으로 첨가한 강에서는 비교적 조대한 T${i_4}{N_3}$및 조대한 ${N_10}{N_22}$/T$i_68$이 석출되는 것으로 관찰되었다. 또한 이러한 탄질화물들의 석출에 의하여 세 강이 서로 다른 결정입도를 나타내는데, 결정입도는 Nb 및 Ti동시첨가강과 Nb단독첨가강이 서로 비슷하고, Ti단독첨가강이 가장 큰 것으로 나타났다.

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열전도성 입자를 활용한 시트용 점착제의 점착 특성과 방열특성 연구 (Comparative Analysis of Heat Sink and Adhesion Properties of Thermal Conductive Particles for Sheet Adhesive)

  • 김영수;박상하;최정우;공이성;윤관한;민병길;이승한
    • 한국염색가공학회지
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    • 제28권1호
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    • pp.48-56
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    • 2016
  • Improvement of heat sink technology related to the continuous implementation performance and extension of device-life in circumstance of easy heating and more compact space has been becoming more important issue as multi-functional integration and miniaturization trend of electronic gadgets and products has been generalized. In this study, it purposed to minimize of decline of the heat diffusivity by gluing polymer through compounding of inorganic particles which have thermal conductive properties. We used NH-9300 as base resin and used inorganic fillers such as silicon carbide(SiC), aluminum nitride(AlN), and boron nitride(BN) to improve heat diffusivity. After making film which was made from 100 part of acrylic resin mixed hardener(1.0 part more or less) with inorganic particles. The film was matured at $80^{\circ}C$ for 24h. Diffusivity were tested according to sorts of particles and density of particles as well as size and structure of particle to improve the effect of heat sink in view of morphology assessing diffusivity by LFA(Netzsch/LFA 447 Nano Flash) and adhesion strength by UTM(Universal Testing Machine). The correlation between diffusivity of pure inorganic particles and composite as well as the relation between density and morphology of inorganic particles has been studied. The study related morphology showed that globular type had superior diffusivity at low density of 25% but on the contarary globular type was inferior to non-globular type at high density of 80%.