• Title/Summary/Keyword: BEM 해석법

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A Complex Velocity Boundary Element Method for Nonlinear Free Surface Problems (복소 경계요소법에 의한 비선형 자유수면문제 연구)

  • Hong, Seok Won
    • Journal of Ocean Engineering and Technology
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    • v.4 no.1
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    • pp.62-70
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    • 1990
  • Cauchy의 적분공식을 복소속도(complex velocity)에 적용하여 포텐시얼 유동을 해석하는 복소경계요소법이 개발되었다. 이 결과로 얻어지는 적분방정식은 경계면에서의 접선속도(tangential velocity)와 법선속도(normal velocity)의 함수로 주어진다. 자유수면에서의 접선속도의 시간변화(evolution of tangential velocity)를 수식화하기 위하여 새로운 비선형 동역학적 자유수면경계조건(nonlinear dynamic free surface boundary condition)을 유도하였다. 복소포텐시얼 대신 복소속도를 이용하는 이 방법은 유장내의 특이점(field singularity)을 용이하게 고려할 수 있으며, 수치미분없이 직접 경계면에서의 유속을 해로서 구하게 된다. 그러나 자유수면이 존재하는 문제의 경우에는, 자유수면에서의 동역학적 경계조건을 만족 시키기 위한 계산과정에 접선 벡타의 변화량을 추정하는 것이 포함되게 되어, 계산과정이 다소 복잡하게 된다.

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Analyses of Stress Intensity Factors and Evaluation of Fracture Toughness in Adhesively Bonded DCB Joints (DCB 접착이음에 대한 응력세기계수의 해석 및 파괴인성의 평가)

  • Jeong, Nam-Yong;Lee, Myeong-Dae;Gang, Sam-Geun
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.24 no.6 s.177
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    • pp.1547-1556
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    • 2000
  • In this paper, an evaluation method of fracture toughness to apply interfacial fracture mechanics was investigated in adhesively bonded double-cantilever beam (DCB) joints. Four types of adhesively bonded DCB joints with an interface crack were prepared for analyses of the stress intensity factors using boundary element method(BEM) and the fracture toughness test. From the results of BEM analysis and fracture toughness experiments, it is found that the stress intensity factor, K1 is a parameter driving the fracture of adhesively bonded joints. Also, the evaluation method of fracture toughness by separated stress intensity factors of mixed mode cracks was proposed and the influences of mode components for its fracture toughness are investigated in adhesively bonded DCB joints.

Car Interior and Exterior Multi-domain Noise Analysis using Power Flow Boundary Element Method (PFBEM을 이용한 자동차 실내외 다영역 공간의 소음해석)

  • Kim, Jong-Do;Hong, Suk-Yun;Lee, Ho-Won;Kwon, Hyun-Wung
    • Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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    • 2007.05a
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    • pp.489-493
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    • 2007
  • Mmulti-domain noise analysis method using Power Flow Boundary Element Method(PFBEM) has been developed successfully. Some applications are introduced. several examples. PFBEM is a numerical analysis method formulated by applying Boundary Element Method(BEM) to Power Flow Analysis(PFA). PFBEM is very powerful in predicting noise level in medium-to-high frequency ranges. However there are restrictions in analyzing the coupled structures and multi-media. In this paper, an analysis method for multi-domain acoustic problems in the diverse acoustic fields is suggested. And the developed method is applied to the car interior and exterior multi-domain noise analysis.

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Electric Field Distribution and AC Dielectric Breakdown Properties according to Needle Electrode in EHV Insulators of XLPE (초고압 절연체 XLPE의 침전극에 따른 전계분포와 AC 절연파괴특성)

  • An, Byung-Chul;Hong, Jin-Woong
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • 2006.05a
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    • pp.136-139
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    • 2006
  • 최근 전력수요의 급증과 더불어 기기의 소형화와 경랑화를 위해 고분자절연재료의 사용이 증가하였으며, 근래 들어 환경성의 문제가 거론되면서 반영구적인 절연재료의 요구가 급증하였다. 그로 인하여 초고압 케이블의 절연재료로서 가교폴리에틸렌이 사용되어지고 있다. 이에 본 논문에서는 초고압전력용 케이블에서 절연재료로 사용되고 있는 가교폴리에틸렌 (XLPE) 내부전계분포 및 파괴전압과의 상관관계를 알아보기 위해 케이블에 칩 전극을 삽입하여 두께를 0.5, 1, l.5 [mm] 변화시켜 파괴전계를 검출하였으며, 또한 와이블 해석을 통한 파괴전압의 척도파라미터룰 검출하여, 시뮬레이션 인가전압으로 사용하였다. 시뮬레이션 경계요소법 (BEM)을 이용한 3 차원 전계해석 프로그램으로 조사하였다.

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Boundary Element Analysis for Edge Cracks at the Bonding Interface of Semiconductor Chip (반도체 칩 접착계면의 모서리 균열에 대한 경계요소 해석)

  • 이상순
    • Journal of the Microelectronics and Packaging Society
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    • v.8 no.3
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    • pp.25-30
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    • 2001
  • The stress intensity factors for edge cracks located at the bonding interface between the semiconductor chip and the adhesive layer subjected to a uniform transverse tensile strain are investigated. Such cracks might be generated due to a stress singularity in the vicinity of the free surface. The boundary element method (BEM) is employed to investigate the behavior of interface stresses. The amplitude of complex stress intensity factor depends on the crack length, but it has a constant value at large crack lengths. The rapid propagation of interface crack is expected if the transverse tensile strain reaches a critical value.

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Prediction of the radiated noise generated by fuel tank of LPG vehicle (LPG 차량에 장착된 연료탱크의 방사소음 예측에 관한 연구)

  • Lee, Sang-Kwon;Kim, Sung-Jong;Lee, Dae-Yup;Kim, Tae-Yong
    • Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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    • 2006.11a
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    • pp.869-874
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    • 2006
  • Fuel tank noise of the LPG vehicle is getting more important for reduction of vehicle noise, because major noise of the vehicle was reduced. Therefore, in this paper, Fuel tank noise and vibration are measured, then the modal analysis is applied for prediction of fuel tank noise. To predict fuel tank noise, various methods are applied by using FEM and BEM techniques

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Prediction of Crack Propagation Path Using Boundary Element Method in IC Packages (반도체 패키지의 경계요소법에 의한 균열진전경로의 예측)

  • Chung, Nam-Yong
    • Transactions of the Korean Society of Automotive Engineers
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    • v.16 no.3
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    • pp.15-22
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    • 2008
  • Applications of bonded dissimilar materials such as integrated circuit(IC) packages, ceramics/metal and resin/metal bonded joints, are very increasing in various industry fields. It is very important to analyze the thermal stress and stress singularity at interface edge in bonded joints of dissimilar materials. In order to investigate the IC package crack propagating from the edge of die pad and resin, the fracture parameters of bonded dissimilar materials and material properties are obtained. In this paper, the thermal stress and its singularity index for the IC package were analyzed using 2-dimensional elastic boundary element method(BEM). From these results, crack propagation direction and path by thermal stress in the IC package were numerically simulated with boundary element method.

An Analysis of Acoustic Field for Turbo Chiller Discharge Duct by Using Boundary Element Method (경계요소법을 이용한 터보냉동기 덕트의 내부 음향장 해석)

  • 전완호;이준근;정필중
    • Journal of KSNVE
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    • v.10 no.6
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    • pp.963-970
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    • 2000
  • The turbo chiller uses centrifugal compressor, which operates at about 14,500 rpm. Due to the high rpm of the impeller, the noise of chiller males one of the serious problems. The possibility of the sound reduction by using absorbing material is studied in this paper. The generated sound propagates through the duct and then radiates to the outer field. So, the use of sound absorption material inside the duct is one of the effective methods. To study the effect of location of the material, we use Boundary Element Method to analyze the sound field inside the duct system. Numerical study shows the highest sound pressure region is near the elbow of curved duct. From the numerical study, it is also shown that appropriate use of sound absorbing material at this region makes 8dB reduction of the highest noise level.

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A Study on the Prediction of the Radial Noise Generated by Structural Vibration of the Fuel Tank in LPG Vehicle (LPG차량에 장착된 연료탱크의 구조 진동으로 인한 방사소음 예측에 관한 연구)

  • Kim, Tae-Yong;Kim, Sung-Jong;Lee, Dae-Yup;Lee, Sang-Kwon
    • Transactions of the Korean Society for Noise and Vibration Engineering
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    • v.17 no.2 s.119
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    • pp.136-142
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    • 2007
  • Fuel tank noise of the LPG vehicle is getting more important for reduction of vehicle noise, because major noise of the vehicle was reduced. Therefore, in this paper, Fuel tank noise and vibration are measured, then the modal analysis is applied for prediction of fuel tank noise. To predict fuel tank noise, various methods are applied by using FEM and BEM techniques.

Analysis of Residual Stresses Induced during Adhesion Process of Chip and Leadframe (칩과 리드페임의 접착과정에서 발생하는 잔류 응력 해석)

  • 이상순
    • Journal of the Computational Structural Engineering Institute of Korea
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    • v.13 no.1
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    • pp.97-103
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    • 2000
  • This paper deals with residual stresses induced at the viscoelastic adhesive layer between the semiconductor chip and the leadframe during adhesion process. The adhesive layer has been assumed to be“thermorheologically simple”. The time-domain boundary element method(BEM) has been employed to investigate the behavior of interface stresses. Numerical results show that very large stress gradients are present at the interface corner and such singularity might lead to local yielding or edge delamination.

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