• 한국표면공학회지
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• 제47권6호
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• pp.303-310
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• 2014

In this study, the average in-situ stress in metallic thin film was measured during deposition of the Cu thin films on the Si(111) wafer and then the phenomenon of stress shift by the interruption of deposition was measured using Cu thin films. We have observed the stress shift in accordance with changing amount of atom's movement between the surface and grain boundary through altering the grain size of the Cu thin film with variety of parameters. The grain size is known to be affected on the deposition rate, film thickness and deposition temperature. As a experimental results, the these parameters was not adequate to explain stress shift because these parameters affect directly on the amount of atom's movement between the surface and grain boundary as well as the grain size. Thus, we have observed the stress shift toward tensile side in accordance with the grain size changing through the interlayer deposition. From an experiment with inserting interlayer before deposit Cu, in thin film which has big grain size with high roughness, amount of stress movement is higher along direction of tensile stress after deposition that means, after deposition process, driving force of atoms moving in grain boundary and on the surface of the film is relatively higher than before.

• 소성∙가공
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• 제21권5호
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• pp.324-329
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• 2012

Mg-(9-x)Sn-xAl-1Zn (x=1, 2, 3 and 4 wt.%) alloys were subjected to indirect extrusion, and the microstructure and mechanical properties of the as-extruded Mg-Sn-Al-Zn (TAZ) alloys were investigated. The TAZ 811 alloy exhibited a finer grain structure than the TAZ 541 alloy due to a larger number of Mg2Sn particles, which pinned the grain boundaries and prevented growth of recrystallized grains. The TAZ alloys showed an unusual yield asymmetry behavior. The tension-compression yield asymmetry increased with decreasing average grain size. The TAZ 811 alloy with a small grain size exhibited a larger yield asymmetry than that of the TAZ 541 alloy having a relatively large grain size, which is mainly attributed to the low Al content and large number of second phase particles in the TAZ 811 alloy.

• 한국지하수토양환경학회:학술대회논문집
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• 한국지하수토양환경학회 2005년도 총회 및 춘계학술발표회
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• pp.446-450
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• 2005

Hydraulic conductivity of unconsolidated media can be determined by aquifer tests, laboratory tests and empirical equations based on grain size analysis. Commonly, the different methods give different hydraulic conductivities. Grain size measurements were done to determine hydraulic conductivity, using 184 soil samples collected from eight boreholes in a riverbank filtration area, Daesan-Myeon, Changwon City, Korea, Pumping tests were conducted at the riverbank filtration area. The average hydraulic conductivity by the empirical relations from grain size measurements comes out around $10^{-2}m/s$, 22 to 55 times higher than by the pumping test analyses. The hydraulic conductivity obtained from the empirical equations is interpreted to have a relationship with steady-state condition while that obtained from the pumping tests is interpreted to have a relationship with unsteady-state condition. Thus, hydraulic conductivity obtained from various methods should be critically analyzed for reasonable management of groundwater development.

• 대한전자공학회논문지
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• 제26권11호
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• pp.1691-1698
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• 1989

Gas sensing effects produced by adsorptive reaction between specimen surface and gases are expected to be influenced greatly by the state of the speimen surface. In this study, Co1-xMgxO ceramics oxygen sensors were prepared by pressing at 0.3-1.5ton/cm\ulcornerwith or without binder, intending to change porosity and average grain size on the surface purposely. The composition ratio of CoO to MgO was fixed at 1:1(mol.%). Microstructure of prepared Co0.5Mg0.5O ceramics were observed, the electrical properties and the sensitivity characteristics for oxygen gas were investigated in the device temperature range of 700-1000\ulcorner and for oxygen partical pressure range of 1-10**-4 atm. Temperature dependence of the resistivity of the specimen showed NTC behavior, average grain size increased and porosity decreased with increasing compaction pressure. The slope of the resistivity of the specimen on the oxygen partial pressure decreased with increasing average grain size and with decreasing porosity. Particularly, specimen pressed by 0.3 and 0.5 ton/cm\ulcornershowed the highest sensitivity to oxygen gas.

• 한국재료학회지
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• 제24권10호
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• pp.515-519
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• 2014

The aim of this paper is to consider the effect of annealing on the coefficient of thermal expansion (CTE) of electroplated Invar Fe-Ni alloy. The CTE of the as-electroplated alloy is lower than those of alloys annealed at $400^{\circ}C$ and $800^{\circ}C$. XRD peaks become sharper as the as-electroplated alloy is annealed, which means the grain growth. The average grain sizes of as-electroplated and as-annealed alloys at $400^{\circ}C$ and $800^{\circ}C$ are 10 nm, 70 nm, and $2{\mu}m$, respectively, as determined by TEM and EBSD analyses. The CTE variation for the various grain sizes after annealing may come from the magnetostriction effect, which generates strain due to changes in the magnetization state of the alloys. The thermal expansion coefficient is considered to be affected by nano grain size in electroplated Fe-Ni Invar alloys. As grain size decreases, ferromagnetic forces might change to paramagnetic forces. The effect of lattice vibration damping of nano grain boundaries could lead to the decrease of CTE.

• 소성∙가공
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• 제20권7호
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• pp.491-497
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• 2011

This work describes a method for determining material parameters included in recrystallization and grain growth models of metallic materials. The focus is on the recrystallization and grain growth models of Ni-Fe based superalloy, Alloy 718. High temperature compression test data at different strain, strain rate and temperature conditions were chosen to determine the material parameters of the model. The critical strain and dynamically recrystallized grain size and fraction at various process conditions were generated from the microstructural analysis and strain-stress relationships of the compression tests. Also, isothermal heat treatments were utilized to fit the material constants included in the grain growth model. Verification of the determined material parameters is carried out by comparing the average grain size data obtained from other compression tests of the Alloy 718 specimens with the initial grain size of $59.5{\mu}m$.

• 한국세라믹학회지
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• 제28권5호
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• pp.347-352
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• 1991

The effects of Ta2O3 doping on the microstructure, electrical properties and thermal expansion in Pb(Zr0.525Ti0.475)O3 ceramics were studied. Density, average grain size, electromechanical coupling factor kp and thermal expansion coefficient of unpoled and poled samples were measured as a function of Ta2O5 content. Average grain size was decreased and density increased above 0.6 mol% Ta2O5 addition. In case of 0.2 mol% addition, density showed minimum according to grain growth. Dielectric constant and electromechanical coupling factor kp were the lowest in 0.2 mol% addition increased with Ta2O5 addition.

• 대한기계학회논문집A
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• 제25권11호
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• pp.1844-1853
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• 2001

In the present investigation, it was attempted to design the rolling pass schedule fur a clean steel of 0.1C-1.5Mn-0.25Si with the objective of the austenite grain refinement. As the method of approach, a coupled mathematical modeling technique was proposed which consists of a recrystallization model and a flow stress modes. The validity of the coupled model was examined through comparison with results of continuous and discontinuous compression tests at various temperatures, strains and strain rates. The coupled model was incorporated with the finite element method to set up a systematic design methodology far the rolling path schedule for austenite grain refinement. Two path schedules were obtained and discussed in the paper with regard to rolling path time, average grain size, grain size deviation in thickness, etc.

• 열처리공학회지
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• 제17권1호
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• pp.17-22
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• 2004

In the present study, newly developed spark plasma sintering(SPS) technique was introduced to refine the grain size of ${\gamma}$-based TiAl intermetallic compounds. Ti-46Al-1.5Mo and Ti-46Al-1.5Mo-0.2C(at%) prealloyed powders were produced by mechanical milling(MM) in high-energy attritor. The mechanically milled powders were characterized by XRD and SEM for the microstructural evolution as a function of milling time. And then, the MMed powders were sintered by both spark plasma sintering and hot pressing in vacuum (HP). After the sintering process, MM-SPSed specimens were heat-treated in a vacuum furnace (SPS-VHT) and in the SPS equipment(MM-SPS) for microstructural control. It was found from microstrutural observation that the microstructure consisting of equiaxed ${\gamma}$-TiAl with a few hundred nanometer in average size and ${\alpha}_2-Ti_3Al$ particles were formed after both sintering processes. It was also revealed from hardness test and three-point bending test that the effect of grain refinement on the hardness and bending strength is much higher than that of carbon addition. The fully lamellar microstructures, which is less than $80{\mu}m$ in average grain size was obtained by SPS-VHT process, and the fully lamellar microstructure which is less than $100{\mu}m$ in average grain size was obtained by MM-SPS for a relatively shorter heat-treatment time.

• 방사선산업학회지
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• 제8권3호
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• pp.141-146
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• 2014

Nickel (Ni) electroplating was implemented by using a metal Ni powder in order to establish a $^{63}Ni$ plating condition on the PN junction semiconductor needed for production of beta-voltaic battery. PN junction semiconductors with a Ni seed layer of 500 and $1000{\AA}$ were coated with Ni at current density from 10 to $50mA\;cm^{-2}$. The surface roughness and average grain size of Ni deposits were investigated by XRD and SEM techniques. The roughness of Ni deposit was increased as the current density was increased, and decreased as the thickness of Ni seed layer was increased. The results showed that the optimum surface shape was obtained at a current density of $10mA\;cm^{-2}$ in seed layer with thickness of $500{\AA}$, $20mA\;cm^{-2}$ of $1000{\AA}$. Also, pure Ni deposit was well coated on a PN junction semiconductor without any oxide forms. Using the line width of (111) in XRD peak, the average grain size of the Ni thick firm was measured. The results showed that the average grain size was increased as the thickness of seed layer was increased.