• Journal of international Conference on Electrical Machines and Systems
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• 제3권3호
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• pp.248-251
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• 2014

As more vehicles become equipped with advanced electronic control systems, more consideration is needed with regards to automotive safety issues related to the effects of electromagnetic waves. Unwanted electromagnetic waves from the antenna, electricity and other electronic devices cause the performance and safety problem of automotive components. In general, Power Integrity and Signal Integrity analysis have been widely used, but these analyses have stayed PCB level. PCB base analysis is different from radiated emission TEST condition so its results are used just for reference. This paper proposes EMC optimization technology using module level 3-dimensional radiation simulation process closed to fundamental test conditions. If module level EMC analysis, which is proposed in this study, is applied to all automotive electronics systems, unexpected EMC noise will be prevented.

• International Journal of Automotive Technology
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• 제8권2호
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• pp.203-209
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• 2007

As the vehicle electronic control technology quickly grows and becomes more sophisticated, a more efficient means than the traditional in-vehicle driving test is required for the design, testing, and tuning of electronic control units (ECU). For this purpose, the hardware-in-the-loop simulation (HILS) scheme is very promising, since significant portions of actual driving test procedures can be replaced by HIL simulation. The HILS incorporates hardware components in the numerical simulation environment, and this yields results with better credibility than pure numerical simulations can offer. In this study, a HILS system has been developed for ESP (Electronic Stability Program) ECUs. The system consists of the hardware component, which that includes the hydraulic brake mechanism and an ESP ECU, the software component, which virtually implements vehicle dynamics with visualization, and the interface component, which links these two parts together. The validity of HIL simulation is largely contingent upon the accuracy of the vehicle model. To account for this, the HILS system in this research used the commercial software CarSim to generate a detailed full vehicle model, and its parameters were set by using design data, SPMD (Suspension Parameter Measurement Device) data, and data from actual vehicle tests. Using the developed HILS system, performance of a commercial ESP ECU was evaluated for a virtual vehicle under various driving conditions. This HILS system, with its reliability, will be used in various applications that include durability testing, benchmarking and comparison of commercial ECUs, and detection of fault and malfunction of ESP ECUs.

• 한국소음진동공학회:학술대회논문집
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• 한국소음진동공학회 2005년도 추계학술대회논문집
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• pp.143-146
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• 2005

In modern automotive control modules, mechanical failures of surface mounted electronic components such as microprocessors, crystals, capacitors, transformers, inductors, and ball grid array packages, etc., are mai or roadblocks to design cycle time and product reliability. This paper presents a general methodology of failure analysis and fatigue prediction of these electronic components under automotive vibration environments. Mechanical performance of these packages is studied through finite element modeling approach fur given vibration environments in automotive application. Using the results of vibration simulation, fatigue lift is predicted based on cumulative damage analysis and material durability information. Detailed model of solder/lead joints is built to correlate the system level model and obtain solder strains/stresses. The primary focus in this paper is on surface-mount interconnect fatigue failures and the critical component selected for this analysis is 80 pin plastic leaded microprocessor.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2010년도 춘계학술대회 논문집
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• pp.419-420
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• 2010

• 반도체디스플레이기술학회지
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• 제23권2호
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• pp.1-5
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• 2024

In the electronics industry, a lot of research and development is being conducted on electronic component supply, component alignment and insertion, and automation of soldering on the back side of the PCB for automatic PCB assembly. Additionally, as the use of electronic components increases in the automotive component field, there is a growing need to automate the alignment and insertion of components with leads such as transistors, coils, and fuses on PCB. In response to these demands, the types of PCB and parts used have been more various, and as this industrial trend, the quantity and placement of automation equipment that supplies, aligns, inserts, and solders components has become important in PCB manufacturing plants. It is also necessary to reduce the pre-setting time before using each automation equipment. In this study, we propose a method in which a vision system recognizes the type of component and simultaneously corrects alignment errors during the process of aligning and inserting various types of electronic components. The proposed method is effective in manufacturing various types of PCBs by minimizing the amount of automatic equipment inserted after alignment with the component supply device and omitting the preset process depending on the type of component supplied. Also the advantage of the proposed method is that the structure of the existing automatic insertion machine can be easily modified and utilized without major changes.

• 한국자동차공학회논문집
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• 제22권3호
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• pp.97-104
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• 2014

Automobile trunk latches enable trunks to be opened and closed by a latch mechanism, which can be selectively positioned between a locked condition and an open condition. To maintain structural and electronic performance of the trunk latch, the latch needs to endure impact load that occurs in its open and close motion, and a dynamic mechanism needs to be electronically controled by a contact switch connected with a small DC motor. A base plate, which is the most important component relating to the structural safety, commonly uses a high stiffness material SAPH440-P with high manufacturing cost. In this paper, through structural analysis and optimization, production cost is significantly reduced by replacing SAPH440-P used in some region of the base plate with engineering plastic PBT GF 20%. The optimized contact switch reduces difference between distributed pressures of its two legs, which leads to improve the electronic performance of the trunk latch.

• 한국전기전자재료학회논문지
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• 제23권8호
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• pp.611-616
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• 2010

This study investigated the characteristics of fracture behavior and mode on solder joints before and after thermal shock test for automotive application component using Sn-3.0Ag-0.5Cu solder, which has a outstanding property as lead-free solder. The shear strength was decreased with thermal cycle number, after 432 cycles of thermal shock test. In addition, fracture mode was verified to ductile, brittle fracture and base materials fracture such as different kind fractured mode using SEM and EDS. Before the thermal shock, the fractured mode was found to typical ductile fracture in solder layer. After thermal shock test, especially, Ag was found on fractured portion as roughest surface. Moreover, it occurred delamination between a PCB and a Cu land. Before thermal shock test, most of fractured mode in solder layer has dimples by ductile fracture. However, after thermal shock test, the fractured mode became a combination of ductile and brittle fracture, and it also could find that the fracture behavior varied including delamination between substrate and Cu land.

• 한국전기전자재료학회논문지
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• 제24권12호
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• pp.949-954
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• 2011

In this study, the characteristics and error ranges of the mechanical bonding strength were analyzed according to before and after thermal shock test for various chips of automotive application component using Sn-3.0Ag-0.5Cu solder. In the after thermal shock test, the mechanical bonding strengths tend to decrease, meanwhile decreasing rates of mechanical strengths were less then 12% at specimen's bonding area below 3.5$mm^2$, and were from 17 to 21% at specimen's bonding area above 12 $mm^2$. On the other hand, Specimen's mean deviation rates were about 5% at specimen's bonding area more than 12 $mm^2$. Inversely, at specimen's bonding area is less then 3.5 $mm^2$, mean deviation rates were increased to about 8%. It means that the smaller device size is, the larger mean deviation rate. In addition, error ranges and deviation rates of the mechanical bonding strengths may differ slightly depending on their bonding area. Furthermore, process conditions as well as method of mechanical reliability evaluation should be established to reduce the error ranges of bonding strength.

• Journal of Power Electronics
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• 제14권5호
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• pp.957-966
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• 2014

Some of DC actuators used in home automation, office automation, medical equipment and automotive systems require a position sensor. In low power applications, the introduction of such a transducer remarkably increases the whole system cost, which justifies the development of sensorless position estimation techniques. The well-known AC motor drive sensorless techniques exploiting the fundamental component of the back electromotive force cannot be used on DC motor drives. In addition, the sophisticated approaches based on current or voltage signal injection cannot be used. Therefore, an effective and inexpensive sensorless position estimation technique suitable for DC motors is presented in this paper. This technique exploits the periodic pulses of the armature current caused by commutation. It is based on a simple pulse counting algorithm, suitable for coping with the rather large variability of the pulse frequency and it leads to the realization of a sensorless position control system for low cost, medium performance systems, like those in the field of automotive applications.

• 한국전자통신학회논문지
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• 제14권3호
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• pp.513-518
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• 2019

와전류를 이용한 비파괴검사장비가 자동차 변속기 부품의 결함유무를 판단하기 위해 개발되었다. 본 탐상기에서는 부품에서 발생하는 결함을 패턴별로 검사하기 위한 결함 마스터 샘플을 만들고, 결함의 형태별로 탐상 가능한 와전류 탐상기를 제작하여 시험을 하였다. 또한 실제 결함이 있는 불량품을 대상으로 결함발생 원인 및 결함발생 형태를 조사하며, 탐상시험을 통해 결과를 비교 분석하였다. 본 연구에서 개발된 와전류 탐상기는 비전문가도 모니터에 나타난 탐상기 결과로부터 부품의 결함여부를 쉽게 판단할 수 있도록 시스템 소프트웨어를 개발하였다.