• 한국분말야금학회:학술대회논문집
• /
• 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part 1
• /
• pp.158-159
• /
• 2006

Ultrafine Au-Pb particles prepared by two method, (1) simultaneous evaporation of Au and Pb in inert gas and (2) subsequent vapor condensation of Pb in a differentially evacuated tube onto flying Au nanoparticles prepared by gasevaporation technique, were observed by electron microscopy. In the method (1), the particles that grew at the region where the two smoke masses converged, consisted of alloy phases. In the method (2), the particles consisted of two or three phases of Au, $Au_2Pb$, $AuPb_2$ and Pb phases in turn from the inner part, Pb-rich particles being composed of only two phases of $AuPb_2$ and Pb.

• 한국마이크로전자및패키징학회:학술대회논문집
• /
• 한국마이크로전자및패키징학회 2002년도 춘계 기술심포지움 논문집
• /
• pp.183-188
• /
• 2002

With the contact pad consisted of $0.5{\mu}{\textrm}{m}$ $Au/5{\mu}{\textrm}{m}$ Ni/Cu layers on a conventional ball grid array(BGA) substrate, metallurgical reaction properties between the pad and In-15(wt.%)Pb-5Ag solder alloy were studied after reflow and solid aging. In as-reflow condition, thin AuIn$_2$or Ni$_{28}$In$_{72}$ intermetallic layer was formed at the solder/pad interface according to reflow time. Dissolution of the Au layer into the molten solder was remarkably limited in comparison with eutectic Sn-37Pb alloy. After solid aging of 300 hrs, thickness of In-Ni layer increased to about $2{\mu}{\textrm}{m}$ in the both as-reflow case. It was observed that In atoms diffuse through the AuIn$_2$phase to react with underlaying Ni layer. The metallurgical reaction properties between In-l5Pb-7Ag alloy and Au/Ni surface finish were analysed to result in suppression of Au-embrittlement in the solder joints.

• 한국산학기술학회논문지
• /
• 제18권4호
• /
• pp.608-613
• /
• 2017

본 연구에서는 저품위인 35wt% 금합금에 대해 80.0wt% 이상의 Au를 얻기 위한 건식 정련 공정을 제안하였다. Au35wt%-Ag5wt%-Cu60wt%의 조성을 가진 금합금에 대해 PbO/(PbO+CaO)의 혼합비를 각각 0~1로 변화시키고 플럭스/금합금의 무게비는 1/2로 하여 $1200^{\circ}C$-5시간의 열처리를 진행하였다. 이때 공정 전, 후 시료의 조성 변화는 energy dispersive X-ray spectroscopy(EDS)로 확인하고, 공정이 완료된 후 분리된 플럭스 금속 원소 성분은 time of flight secondary ion mass spectromerty(ToF-SIMS)로 확인하였다. EDS분석 결과 플럭스의 비율이 1(PbO 단일)인 경우 Au의 함량이 35.0wt%에서 86.7wt%로 가장 크게 향상되었고, 다른 플럭스 조성의 경우도 84wt% 이상으로 정련이 가능하였다. 또한 2/3 혼합비의 플럭스에서 Ag가 플럭스부로 빠져나가는 손실이 가장 적었다. 플럭스부의 ToF-SIMS 분석 결과 플럭스의 비율이 1, 0 일 때 $Au^+$의 특성 피크의 강도가 각각 349, 37로 측정되었다. Au의 손실을 고려하였을 때 CaO 단일 플럭스의 사용이 더 유리할 수 있었으나, 이 정도의 신호강도는 무시할 수 있는 정도로 판단되었다. 따라서 혼합플럭스를 이용한 건식 열처리를 통해 효과적인 금의 정련이 가능하여 경제적인 습식제련의 전처리 공정으로 사용될 수 있음을 확인하였다.

• 마이크로전자및패키징학회지
• /
• 제9권4호
• /
• pp.1-9
• /
• 2002

Ball grid array (BGA) substrate 상의 0.5 $\mu\textrm{m}$Au/5 $\mu\textrm{m}$Ni/Cu 층으로 구성된 접촉 패드(pad)와 In-15(wt.%)Pb-5Ag 솔더 볼 사이에서 리플로우 및 고상 시효동안 일어나는 금속학적 반응 특성이 조사되었다. 1-5 분의 리플로우 시간에 따라 솔더/패드 계면에서 $AuIn_2$ 또는 Ni-In 금속간 화합물층이 형성됨이 관찰되었다. 리플로우 동안 용융 In-l5Pb-5Ag 솔더 내로의 Au 층의 용해 속도는 $2\times 10^{-3}$ $\mu\textrm{m}$/sec 정도로 측정되어 공정 Sn-37Pb와 비교하여 매우 느린 것으로 관찰되었다. $130^{\circ}C$에서 500시간의 고상 시효 후에는 초기 리플로우 시간에 관계없이 $Ni_{28}In_{72}$ 금속간 화합물층이 약 3 $\mu\textrm{m}$까지 성장하였다. 이를 통하여 솔더 합금에서의 In 원자들은 아래의 Ni 층과 반응하기 위하여 리플로우 동안 형성된 $AuIn_2$상을 통하여 확산하는 것으로 관찰되었다. 미세구조 관찰과 전단 시험을 통하여 In-l5Pb-5Ag합금의 경우는 Sn-37Pb 조성과는 달리 Au/Ni surface finish 상에 사용시에도 솔더 접합부에서의 Au-embrittlement를 야기 시키지 않는 것으로 분석되었다.

• 한국생산제조학회지
• /
• 제20권2호
• /
• pp.187-192
• /
• 2011

UBM(Under Bump Metallurgy) is very important for successful realization of Flip-Chip technology. In this study, it is investigated the interfacial reactions between various Sn-Ag solder alloys and Ni-P/Au UBM and Cu plate finish. It is also evaluated the shear strength by using the micro shear-punch test method for Sn-37Pb alloy, binary and ternary alloys of environment-friendly Pb-free solder alloys which are applied in the electronic packages. In terms of interfacial microstructure, the Pb-free solder joints have thicker IMCs than the Sn-Pb solder joints. The thickness of IMC is related to Reflow time. The IMC has been observed to grow with the increase in Reflow time. As a result of the shear test, in case of Max. shear strength, Pb-free solder showed the highest strength value and Sn-37Pb showed the lowest strength value 10 be generally condition of Reflow time.

• 한국초전도ㆍ저온공학회논문지
• /
• 제18권4호
• /
• pp.5-8
• /
• 2016

We report on the fabrication and measurement results of the electrical transport properties of superconductor-normal metal-superconductor (SNS) weak links, made of PbIn superconductor and Au metal. The maximum supercurrent reaches up to ${\sim}6{\mu}A$ at T = 2.3 K and the supercurrent persists even at T = 4.7 K. Magnetic field dependence of the critical current is consistent with a theoretical fit using the narrow junction model. The superconducting quantum interference device (SQUID) was also fabricated using two PbIn-Au-PbIn junctions connected in parallel. Under perpendicular magnetic field, we clearly observed periodic oscillations of dV/dI with a period of magnetic flux quantum threading into the supercurrent loop of the SQUID. Our fabrication methods would provide an easy and simple way to explore the superconducting proximity effects without ultra-low-temperature cryostats.

• 마이크로전자및패키징학회지
• /
• 제14권2호
• /
• pp.49-57
• /
• 2007

본 연구에서는 Au 와 Sn을 rf-magnetron sputter를 이용하여 다층막(multilayer)과 동시증착(Co-sputter)방법으로 스퍼터링하여 기판위에 AuSn 솔더를 형성하였고, 솔더의 조성제어와 특성 분석을 통해 Sn rich AuSn 솔더의 형성 기술에 대하여 연구하였다. AuSn 솔더를 형성하기 앞서 Au와 Sn에 대하여 단일 금속 증착을 하였다. 이를 토대로 AuSn솔더를 증착하기 위한 실험 조건을 확보하였다. 증착변수로는 기판의 온도, rf 전력과 두께 비를 이용하였다. 다층막의 경우, 고온의 기판에서 솔더 합금의 표면거칠기와 조성이 보다 정확하게 제어되었다. 이에 비해 동시증착 솔더는 기판의 온도에 의한 조성의 변화가 거의 없었으나, rf전력에 의해서 조성이 보다 쉽게 제어할 수 있었다. 여기에 더해, 동시 증착 솔더 박막의 대부분은 증착동안에 금속간 화합물로 변화한 것을 알 수 있었다. 화합물의 종류는 XRD로 분석하였다. 형성된 솔더 박막을 플럭스를 이용하지 않고 리드프레임에 접합하여 접합강도를 측정하였다. 다층형의 경우 Au 10wt%의 조건에서 최대 $33(N/mm^2)$ 전단응력을 나타내었으며, 동시증착형은 Au 5wt%에서 $460(N/mm^2)$ 전단응력을 나타내었다.

• 한국마이크로전자및패키징학회:학술대회논문집
• /
• 한국마이크로전자및패키징학회 2007년도 SMT/PCB 기술세미나
• /
• pp.37-47
• /
• 2007

Factor : Structure Metal pad & SMO size Board level TC test : - Large SMO size better Board level Drop test : - Large SMO size better Factor : Structure Substrate thickness Board level TC test : - Thick substrate better Board level Drop test : - Substrate thickness is not a significant factor for drop test Factor : Material Solder alloy Board level TC test : - Not so big differences over Pb-free solder and NiAu, OSP finish Board level Drop test : - Ni/Au+SAC105, CuOSP+LF35 are better Factor : Material Pad finish Board level TC test : - NiAu/NiAu is best Board livel Drop test : - CuOSP is best Factor : Material Underfill Board level TC test - Several underfills (reworkable) are passed TCG x500 cycles Board level Drop test : - Underfill lots have better performance than non-underfill lots Factor : Process Multiple reflow Board level TC test : - Multiple reflow is not a significant actor for TC test Board level Drop test : N/A Factor : Process Peak temp Board level TC test : - Higher peak temperature is worse than STD Board level Drop test : N/A Factor : Process Stack method Board level TC test : - No big difference between pre-stack and SMT stack Board level Drop test : - Flux dipping is better than paste dipping but failure rate is more faster

• Transactions on Electrical and Electronic Materials
• /
• 제1권2호
• /
• pp.32-37
• /
• 2000

Effect of alloying element additions to Ag on thermal conductivity and electrical conductivity of sheath materials for Bi-Pb-Sr-Ca-Cu-O(BSCCO) tapes has been characterized. The thermal conductivity at low temperature range (10~300K) of Ag and Ag alloys were evaluated by both direct and indirect measurement techniqueas and compared with each other, It was observed that the thermal conductivity decreases with increasing the content of alloying element such as Au, Pd and Mg. Thermal conductivity of pure Ag at 3 0K was measured to be 994.0 W(m.K) on the other hand, the corresponding values of $Ag_{0.9995}Mg_{0.0005}$, $Ag_{0.974}$, $Au_{0.025}$, $Mg_{0.001}$, $Ab_{0.973}$, $Au_{0.025}$, $Mg_{0.002}$ and $Ag_{0.92}$, $Pb_{0.06}$, $Mg_{0.02}$ were 342.6, 62.1, 59.2 and 28.9 W(m.K), respectively, indicating 3 to 30 times lower than that of pure Ag. In addition, the thermal conductivity of pure Ag measured by direct and indirect measurement techniques was 303.2 and 363.8 W(m.K) The difference in this study is considered to be within an acceptable error range compared to the reference data.

• 대한용접접합학회:학술대회논문집
• /
• 대한용접접합학회 2002년도 Proceedings of the International Welding/Joining Conference-Korea
• /
• pp.439-449
• /
• 2002

This paper reviews our recent research works on the interconnection technologies in electronic packaging and assembly. At the aspect of advanced joining methods, laser-ultrasonic fluxless soldering technology was proposed. The characteristic of this technology is that the oxide film was removed through the vibration excitated by high frequency laser change in the molten solder droplet. Application researches of laser soldering technology on solder bumping of BGA packages were carried out. Furthermore, interfacial reaction between SnPb eutectic solder and Au/Ni/Cu pad during laser reflow was analyzed. At the aspect of soldered joints' reliability, the system for predicting and analyzing SMT solder joint shape and reliability(PSAR) has been designed. Optimization design method of soldered joints' structure was brought forward after the investigation of fatigue failure of RC chip devices and BGA packages under temperature cyclic conditions with FEM analysis and experimental study. At the aspect of solder alloy design, alloy design method based on quantum was proposed. The macroproperties such as melting point, wettability and strength were described by the electron parameters. In this way, a great deal of the experimental investigations was replaced, so as to realize the design and research of any kinds of solder alloys with low cost and high efficiency.