• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2016.11a
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• pp.196-196
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• 2016

치과나 기공소로부터 높은 원가로 인한 재료선택에 어려움을 겪고 있어 귀금속 금합금의 물성을 가질 수 있도록 하면서 가격급등으로 인한 문제 해결하기 위한 비귀금속 합금으로 대체가 필요하기에 이에 따른 연구가 이루어져 국산 제품의 상품화를 위해 파라듐을 이용하여 적합한 새로운 합금을 개발하는 것이 필요하다. 치과용 골드합금은 미국치과의사 협회의 구정에 의하면 1형부터 4형까지 분류하고 있으며 3형에 해당하는 강도와 기계적인 특성을 갖도록 파라듐으로 대체하는 연구가 진행중이거나 시판되고 있다. 따라서 본 연구에서는 2형, 3형 및 4형을 대체가능하도록 팔라듐을 기반으로 한 새로운 합금을 설계하고 합금의 성분원 소인 Au(1~5), Pd(20~25), Ag(70~75), In(1.5) 및 Zn(2)등으로 조성을 변화시켜 측량 후 합금을 제조하기 위하여 아르곤 분위기하의 진공아크용해로를 이용하여 용해하였다. 정량된 금속을 진공아크 용해로에 장입하고 용해는 균질한 합금이 되도록 최소한 6회 이상 용융을 실시하며 합금성분의 손실이 발행하지 않도록 보정을 하였다. 합금의 미세조직 관찰을 위하여 샘플을 고속 다이아몬드 정밀 절단기(Acculom-5, STRUERS, Denmark)를 이용하여 절단한 후 2000 grit의 Sic 연마지에서 단계적으로 $0.3{\mu}m$ 알루미나 분말까지 연마한 후 초음파 세척을 하였다. 준비한 시편은 KCN과 $(NH_4)_2S_2O_8$을 1:1로 혼합한 부식액으로 에칭한 후 OM과 SEM을 이용하여 조직을 관찰하였으며 각 샘플의 성분변화는 EDS 분석을 통해 확인하고 결정구조는 XRD를 사용하여 분석하였다. 경도시험은 비커스경도시험기를 이용하여 5kg의 하중을 30초간 작동시켜 압흔을 연결된 micron으로 평균값을 측정하였다. 각 시편의 부식거동은 POTENTIOSTAT(Model PARSTAT 2273, EG&G, USA)을 이용하여 구강 내환경화 유사한 $36.5{\pm}1^{\circ}C$의 0.9% NaCl에서 실시하였다. 인가전위는 -1500mV에서 1000mV까지 1.67 mV/min의 주사속도로 인가하여 시험을 수행하였으며 분극곡선으로부터 부식전위와 부식전류밀도 및 부동태영역의 전류밀도로 금속의 용출거동을 조사하였으며 부식이 끝난 시편은 FE-SEM과 EDS를 사용하여 조사하였다. 기계적인 특성은 Pd-Ag에 3wt%의 Au를 첨가한 합금이 Pd-Ag에 1.5wt%합금을 첨가한 경우에 비하여 기계적인 특성이 증가하고 내식성이 크게 증가하였다. 이들 합금에 Cu를 11wt%를 첨가한 경우는 비커스경도가 200이상으로 높게 나타났지만 내식성이 크게 감소하였다.

• Conservation Science in Museum
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• v.16
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• pp.4-13
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• 2015

In most gold objects crafted using the granulation technique that have been thus far discovered in the Korean Peninsula, granules were joined using a soldering alloy of gold and silver. However, it was recently revealed through SEM-EDS analysis performed on the ornamented dagger sheath from Gyerim-ro Tomb No.14 in Gyeongju that the gold granules were joined to the surface of this sheath using an entirely different technique. The gold granules on the Gyerim-ro dagger sheath are evenly sized and shaped, the surface has a dendritic texture. Dendritic textures are a characteristic feature of metal alloys, not observed in pure metals. As a matter of fact, the gold granules were made of a ternary alloy of 77wt% Au, 18wt% Ag and 4wt% Cu. Due to this component, the alloy has a melting point below 1000℃ (approximately 980℃), which is significantly lower than 1064℃, the melting temperature of pure gold. This makes it possible to join the gold granules directly to the surface of the sheath by briefly heating them to high temperature, without the use of soldering or any other media. When examined through SEM image, the surface of the sheath showed no traces of soldering, it suggests that the granules were joined through unaided fusion.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.02a
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• pp.37-59
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• 2004

In the case of Ni/Au finished pad on the package side, the solder joint of SnAgCu system can bring brittle fracture under impact load such as drop test. Therefore, it's difficult to prevent the brittle fracture of lead-free solder, by controlling Cu content. The failure locus existing on the interface between $(Ni,Cu)_3Sn_4\;and\;(Cu,Ni)_6Sn_5$ IMC layers must be changed to other site in order to avoid brittle fracture due to impact load. It was not found any clear evidence that there were two IMC layers exist. But it was strongly assumed these were two layers which have different Cu-Ni composition. From the above analysis it was assumed that Cu atom in the solder alloy or substrate seemed to affect IMC composition and cause to IMC brittle fracture.

• Proceedings of the KSME Conference
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• 2000.04b
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• pp.379-384
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• 2000

High-Tc superconducting current leads with multi-step and continually varied cross-sectional area are studied to reduce heat leak into cryostat and material use. Assuming conduction-cooled lead the cross-sectional area is reduced along the heat flow direction according to the increase of critical current density which increases with decreasing temperature. In this study, we also analyze the multi-step cross-sectional area High-Tc current leads. The multi-st데 current leads changes the cross-sectional area to have constant safety-factor at changed section. The heat leak into cryostat, total voume, safety-factor and the temperature profiles are compared to those of the constant safety-factor current leads. The developed methods are applied to the Bi-2223 superconductor sheathed with Ag-Au alloy.

• Journal of Technologic Dentistry
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• v.7 no.1
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• pp.13-18
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• 1985

Casting alloys, both precious and non-precious, were by heat in order to observe the change in HB and the results were : 1. The hard treatment showed 1.4 - 1.5 times as high as the soft treatment in HB. 2. The experiment shows that Au-Pt should be contained more than 75% to prevent color change. 3. Cu by hard teatment played the greatect part in creasing the solidity of Ag-Cu alloy. 4. Casting Co-Cr alloys showed little difference of HB in heat treatment.

• Korean Journal of Metals and Materials
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• v.48 no.11
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• pp.1041-1046
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• 2010

The reactions between a Sn-3.0Ag-0.5Cu solder alloy and electroless Ni/electroless Pd/immersion Au (ENEPIG) surface finishes with various Pd layer thicknesses (0, 0.05, 0.1, 0.2, $0.4{\mu}m$) were examined for the effect of the Pd layer on the massive spalling of the $(Cu,Ni)_6Sn_5$ layer during reflow at $235^{\circ}C$. The thin layer deposition of an electroless Pd (EP) between the electroless Ni ($7{\mu}m$) and immersion Au ($0.06{\mu}m$) plating on the Cu substrate significantly retarded the massive spalling of the $(Cu,Ni)_6Sn_5$ layer during reflow. Its retarding effect increased with an increasing EP layer thickness. When the EP layer was thin (${\leq}0.1{\mu}m$), the retardation of the massive spalling was attributed to a reduced growth rate of the $(Cu,Ni)_6Sn_5$ layer and thus to a lowered consumption rate of Cu in the bulk solder during reflow. However, when the EP layer was thick (${\geq}0.2{\mu}m$), the initially dissolved Pd atoms in the molten solder resettled as $(Pd,Ni)Sn_4$ precipitates near the solder/$(Cu,Ni)_6Sn_5$ interface with an increasing reflow time. Since the Pd resettlement requires a continuous Ni supply across the $(Cu,Ni)_6Sn_5$ layer from the Ni(P) substrate, it suppressed the formation of $(Ni,Cu)_3Sn_4$ at the $(Cu,Ni)_6Sn_5/Ni(P)$ interface and retarded the massive spalling of the $(Cu,Ni)_6Sn_5$ layer.

• Journal of Conservation Science
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• v.27 no.1
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• pp.1-11
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• 2011

For the silver artifacts in the Koryo Dynasty excavated from Neungnae-ri Ganghwa island, the metallographic section analysis and hardness and chemical analysis were conducted. After making samples in the similar ratio of the composition concentration, the changes of the microstructure were checked according to the working method and temperature. The results show that those silver artifacts are Au-Cu alloys with 2 to 6 % of Cu. From the results it is judged that Cu was artificially alloyed with them to keep the proper hardness and identified that they were gilded by the amalgamation process seeing that mercury was included at the guilt layer. Also the porous texture on the surface of them could be formed at over $400^{\circ}C$, therefore, it is assumed the hot working or heat treatment at over $400^{\circ}C$ were performed. In silver artifacts made by the relief and repousse, they have the similar composition analysis to other 7 artifacts but the hardness is lower than pure silver. Consequently from differences in the hardness, it can be inferred that the low hardness of silver artifacts is concerned with manufacturing techniques.

• Korean Journal of Heritage: History & Science
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• v.52 no.1
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• pp.4-21
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• 2019

In this paper, 23 Silla gold earrings from the sixth and seventhand centuries, excavated from the Yeongnam region, were analyzed. Based on the silver content of the gold plate, they were classified into three types. The classifications included type I(20-50wt%), type II(10-20wt%) and type III (less than 10wt%). In the analysis process, the composition and morphological differences were identified on the surface of the gold plate. In the case of type I and II earrings, it was observed that the fine holes were concentrated in a relatively higher part of the gold content. The causes of the difference in the surface composition of the gold plate were divided into four categories: 1) surface treatment, 2) thermal diffusivity in the manufacturing process, 3) differences in composition of alluvial gold, and 4) the refining method of gold. It is possible that depletion gilding was attempted to increase the gold content while intentionally removing the other metals from the surface of the gold alloy in the portion where the gold deposit is relatively concentrated on the surface of the gold plating. The highest copper content was detected in the earring with the highest gold content of the analyzed earrings, and it was assumed that thermal diffusion had occurred between the gold plate and the metal rod during the manufacturing process rather than intentional addition. Copper was detected only in the thin ring earring type, and copper was not detected in the thick ring earring type or pendant type. It also proves that this earring has a high degree of tightness at higher temperatures, as there was an invisible edge finish on other earrings and horizontal wrinkles on the gold plate surface. In terms of the material of the gold plate, we examined whether the silver content of the gold plate was natural gold or added by alloy through analyzing the alluvial gold collected in the region. As a result of the analysis, it was found that on average about 13wt% of silver is included. This suggests that type II is natural gold, type III is refined gold, and type I seems to have been alloyed with natural gold. Here, we investigated the refining method introduced in the ancient literature, both at home and abroad, about the possibility of alloying silver after the refining process of type III earrings and then making pure gold. It was found that from ancient refining methods, silver which had been present in the natural gold was removed by reacting and combining with silver chloride or silver sulfide, and long-term efforts and techniques were required to obtain pure gold through this method. Therefore, it was concluded that the possibility of adding a small amount of silver in order to increase strength after making pure gold through a refining process is low.