• 비파괴검사학회지
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• 제19권6호
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• pp.439-447
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• 1999

복합재료-금속 접착접합부가 사용 중 반복하중을 받을 때 발생하는 피로손상을 실시간에 평가할 수 있는 기법으로 음향초음파(acousto-ultrasonics; AU)법을 채택하였으며, 피로시험 중의 단일겹치기(single-lap) 및 이중겹치기 (double-lap) 평판형 시험편에서 취득한 신호로부터 계산된 음향초음파변수(acousto-ultrasonic parameters: AUP)와 피로손상도 사이의 상관관계를 나타내는 곡선을 얻을 수 있었다. 곡선은 피로손상에 의한 고분자기지 복합재료의 강성율 저하($E/E_o$)를 나타내는 곡선과 매우 유사하며, 이를 바탕으로 피로손상도의 실시간 예측이 가능하다. 다만 단일겹치기 시험편의 경우에는 Amplitude와 AUP2를, 이중겹치기 시험편의 경우에는 Amplitude와 AUP1을 기준 변수로 채택할 때 보다 일관성 있는 결과를 얻고 있는 점으로부터 실제 구조물에 적용함에 있어서는 각각의 형상에 따른 최적변수를 선택하여 활용해야 할 것으로 사료된다.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2005년도 춘계학술발표대회 개요집
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• pp.54-56
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• 2005

Ultrasonic soldering using of Si-wafer to FR-4 PCB atroom temperature was investigated. Sn3.5Ag foil rolled $100{\mu}m$ was used for solder. The UBM of Si-die was Cu/ Ni/ Al from top to bottom and its thickness was $0.4{\mu}m$, $0.4{\mu}m$, $0.3{\mu}m$ respectively. Pad on FR-4 PCB comprised of Au/ Ni/ Cu from top to bottom and its thickness was $0.05{\mu}m$, $5{\mu}m$, $18{\mu}m$ respectively. The ultrasonic soldering time was changed from 0.5sec to 3.0sec and its power 1400W. As experimental result, reliable bond joint by ultrasonic at room temperature was obtained. The shear strength increased with soldering time up to 2.5 sec. That means at 2.5sec, the shear strength showed maximum rate of 65.23N. The strength decreased to 33.90N at 3.0 sec because the cracks generated along the intermetallic compound between Si-wafer and Sn-3.5mass%Ag solder. intermetallic compound produced by ultrasonic between the solder and the Si-die was $(Cu, Ni)_{6}Sn_{5}$ and the intermetallic compound between solder and pad on FR-4 was $(Ni, Cu)_{3}Sn_{4}$.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
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• pp.221-221
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• 2013

Striving to replace the well known silicon nanocrystals embedded in oxides with solution-processable charge-trapping materials has been debated because of large scale and cost effective demands. Herein, a silicon quantum dot-polystyrene nanocomposite (SiQD-PS NC) was synthesized by postfunctionalization of hydrogen-terminated silicon quantum dots (H-SiQDs) with styrene using a thermally induced surface-initiated polymerization approach. The NC contains two miscible components: PS and SiQD@PS, which respectively are polystyrene and polystyrene chains-capped SiQDs. Spin-coated films of the nanocomposite on various substrate were thermally annealed at different temperatures and subsequently used to construct metal-insulator-semiconductor (MIS) devices and thin film field effect transistors (TFTs) having a structure p-$S^{++}$/$SiO_2$/NC/pentacene/Au source-drain. C-V curves obtained from the MIS devices exhibit a well-defined counterclockwise hysteresis with negative fat band shifts, which was stable over a wide range of curing temperature ($50{\sim}250^{\circ}C$. The positive charge trapping capability of the NC originates from the spherical potential well structure of the SiQD@PS component while the strong chemical bonding between SiQDs and polystyrene chains accounts for the thermal stability of the charge trapping property. The transfer curve of the transistor was controllably shifted to the negative direction by chaining applied gate voltage. Thereby, this newly synthesized and solution processable SiQD-PS nanocomposite is applicable as charge trapping materials for TFT based memory devices.

• 대한금속재료학회지
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• 제49권5호
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• pp.411-418
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• 2011

The current study investigates the electroplating characteristics of Sn-Cu eutectic micro-bumps electroplated on a Si chip for flip chip application. Under bump metallization (UBM) layers consisting of Cr, Cu, Ni and Au sequentially from bottom to top with the aim of achieving Sn-Cu bumps $10\times10\times6$ ${\mu}m$ in size, with 20${\mu}m$ pitch. In order to determine optimal plating parameters, the polarization curve, current density and plating time were analyzed. Experimental results showed the equilibrium potential from the Sn-Cu polarization curve is -0.465 V, which is attained when Sn-Cu electro-deposition occurred. The thickness of the electroplated bumps increased with rising current density and plating time up to 20 mA/$cm^2$ and 30 min respectively. The near eutectic composition of the Sn-0.72wt%Cu bump was obtained by plating at 10 mA/$cm^2$ for 20 min, and the bump size at these conditions was $10\times10\times6$ ${\mu}m$. The shear strength of the eutectic Sn-Cu bump was 9.0 gf when the shearing tip height was 50% of the bump height.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
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• pp.130-131
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• 2013

Nanostructured oxides are widely used in heterogeneous catalysis where their catalytic properties are closely associated with the size and morphology at nanometer level. The effect of particle size has been well decumented in the past two decades, but the shape of the nanoparticles has rarely been concerned. Here we illustrate that the redox and acidic-basic properties of oxides are largely dependent on their shapes by taking $Co_3O_4$, $Fe_2O_3$, $CeO_2$ and $La_2O_3$ nanorods as typical examples. The catalytic activities of these rod-shaped oxides are mainly governed by the nature of the exposed crystal planes. For instance, the predominant presence of {110} planes which are rich in active $Co^{3+}$ on $Co_3O_4$ nanorods led to a much higher activity for CO oxidation than the nanoparticles that mainly exposed the {111} planes. The simultaneous exposure of iron and oxygen ions on the surface of $Fe_2O_3$ nanorods have significantly enhanced the adsorption and activation of NO and thereby promoted the efficiency of DeNOx process. Moreover, the exposed surface planes of these rod-shaped oxides mediated the reaction performance of the integrated metal-oxide catalysts. Au/$CeO_2$ catalysts exhibited outstanding stability under water-gas shift conditions owing to the strong bonding of gold particle on the $CeO_2$ nanorods where the formed gold-ceria interface was resistant towards sintering. Cu nanoparticles dispersed on $La_2O_3$ nanorods efficiently catalyzed transfer dehydrogenation of primary aliphatic alcohols based on the uniue role of the exposed {110} planes on the support. Morphology control at nanometer level allows preferential exposure of the catalytically active sites, providing a new stragegy for the design of highly efficient nanostructured catalysts.

• 센서학회지
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• 제17권5호
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• pp.369-374
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• 2008

A novel fiber optic surface plasmon resonance (SPR) sensor using cyclic olefin copolymer (COC) prism with the spectral modulation is presented. The SPR sensor chip is fabricated using the SU-8 photolithography, Ni-electroplating and COC injection molding process. The sidewall of the COC prism is partially deposited with Au/Cr (45/2.nm thickness) by e-beam evaporator, and the thermal bonding process is conducted for micro fluidic channels and optical fibers alignment. The SPR spectrum for a phosphate buffered saline (0.1.M PBS, pH.7.2) solution shows a distinctive dip at 1300.nm wavelength, which shifts toward longer wavelength with respect to the bovine serum albumin (BSA)concentrations. The sensitivity of the wavelength shift is $1.16\;nm{\cdot}{\mu}g^{-1}{\cdot}{\mu}l^{-1}$. From the wavelength of SPR dips, the refractive indices (RI) of the BSA solutions can be theoretically calculated using Kretchmann configuration, and the change rate of the RI was found to be $2.3{\times}10^{-5}RI{\cdot}{\mu}g^{-1}{\cdot}l^{-1}$. The realized fiber optic SPR sensor with a COC prism has clearly shown the feasibility of a new disposable, low cost and miniaturized SPR biosensor for biochemical molecular analyses.

• 대한전자공학회논문지SD
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• 제37권6호
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• pp.34-42
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• 2000

우수한 성능을 가지며 소형${\cdot}$경량인 무선통신기기를 구현하기 위해서는 GHz 대의 고주파수에서 동작하는 소형 RF chip 인덕터의 개발은 중요한 연구분야가 되어왔다. 또한 최근 많이 사용되는 자성 ferrite core 재료는 300MHz 이상의 주파수영역에서 자화율이 급속하게 감소하여 고성능 RF chip 인덕터 개발에 큰 장애가 되고 있다. 따라서 본 논문에서는 비정질 $Al_2O_3$ 코아 재료를 응용한 단순 solenoid 형태의 소형${\cdot}$고성능 RF chip 인덕터를 연구하였다. Cu를 코일 (직경=40${\mu}m$)로 사용하였고 인덕터 크기는 $2.1mm{\times}1.5mm{\times}1.0mm$였다. 외부 전류원은 코일의 양단을 코아 가장자리에 적층된 Au 막에 본딩시킨 후 인가되었다. 코아의 성분은 EDX를 사용하여 분석하였다 개발된 인덕터의 인덕턴스 (L), quality factor (Q), 인피던스(Z)등의 주파수 특성은 RF impedance/Material Analyzer (HP16193A test fixture가 장착된 HP4291B)로 측정되었다. 인덕터들의 인덕턴스 값은 22 nH ~ 150 nH 범위를 가지며, 이들의 자기공진주파수 (SRF)는 1~3.5GHz 영역을 나타낸다. 또한 자기공진주파수가 증가함에 따라 인덕턴스 값이 감소하는 경향을 보이고 있다. 임피던스는 공진주파수에서 최대 값을 가지며 Q-factor의 값은 500 MHz ~ 1.5 GHz 주파수 범위에서 최대 70~97까지 얻어졌다.

• 구강회복응용과학지
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• 제22권2호
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• pp.125-136
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• 2006

Statement of problem. The success of the bonding between electroforming gold and resin is dependent on the surface-conditioning technique but its effective technique has net been studied widely. Purpose. The purpose of the study was to evaluate the bond strength between the electroforming gold and resin with varying the surface-conditioning technique. Materials and methods. Sixty rectangular shaped metal specimens were made and one side of each specimen were gold hard plated. The sand-blasted specimens were divided into four experimental groups with fifteen specimens in each group and were treated as follows. Group 1: Silicoating (Rocatec, 3M ESPE)+ Sinfony (3M ESPE), Group 2: SR Link+ SR Adoro (Ivoclar Vivadent), Group 3: Tin plating (Microtin, Danville Engineering)+ SR Link+ SR Adoro, Group 4: Tin plating (Micro tin, Danville Engineering)+ Silicoating (Rocatec)+ Sinfony. Shear bond strength at metal-resin interface were measured using universal testing machine. Energy Dispersive x-ray analysis was done and scanning electron microscope images were taken and observed. Results and Conclusion. The following conclusions were drawn. 1. The mean shear bond strength values in order were 11.69MPa (Group 2), 22.35MPa (Group 3), 22.40MPa (Group 1) and 27.71MPa (Group 4). There was no significant difference in Group 1, Group 3 and Group 4(P>0.05). 2. In the EDX line analysis, the Au was detected on the surface of all specimen. $SnO_2$ showed on the surface of Group 2 and $SiO_2$ was detected on the surface of Group 1. 3. Increasing of roughness by sandblasting(Group 2), formation of micro-irregularities and tin crystals by electrolytic tin plating(Group 3) and formation of surface irregularities and $SiO_2$ layer(Group 1,4) were observed in SEM photo. 4. Tin plating(Group 3) and Rocatec treatment(Group 1) showed clinically effective shear bond strength(>20MPa), but when the two surface conditioning method were used together higher bond strength were achieved.

• Bulletin of the Korean Chemical Society
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• 제31권6호
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• pp.1519-1526
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• 2010

The behavior of peptide or protein solutes in saline aqueous solution is a fundamental topic in physical chemistry. Addition of ions can strongly alter the thermodynamic and physical properties of peptide molecules in solution. In order to study the effects of added ionic salts on protein conformation and dynamics, we have used the molecular dynamics (MD) simulations to investigate the behavior of Staphylococcus aureus Hfq protein under two different ionic concentrations: 0.1 M NaCl and 1.0 M NaCl in presence and absence of RNA (a hepta-oligoribonucleotide AU5G). Hfq, a global regulator of gene expression is highly conserved and abundant RNA-binding protein. It is already reported that in vivo the increase of ionic strength results in a drastic reduction of Hfq affinity for $Q{\beta}$ RNA and reduces the tendency of aggregation of Escherichia coli host factor hexamers. Our results revealed the crucial role of 0.1 M NaCl Hfq system on the bases with strong hydrogen bonding interactions and by stabilizing the aromatic stacking of Tyr42 residue of the adjacent subunits/monomers with the adenine and uridine nucleobases. An increase in RNA pore diameter and weakened compactness of the Hfq-RNA complex was clearly observed in 1.0 M NaCl Hfq system with bound RNA. Aggregation of monomers in Hfq and the interaction of Hfq with RNA are greatly affected due to the presence of high ionic strength. Higher the ionic concentration, weaker is the aggregation and interaction. Our results were compatible with the experimental data and this is the first theoretical report for the experimental study done in 1980 by Uhlenbeck group for the present system.

• 보존과학회지
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• 제28권2호
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• pp.175-184
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• 2012

본 연구는 몽골 도르릭나르스 유적 2호, 3호 및 4호분에서 출토된 청동제 및 금제 유물에 대한 과학적 분석 결과로부터 각 유적 출토품의 특징을 알아보는데 그 목적이 있다. 몽골의 흉노무덤인 도르릭나르스 유적 2호, 3호 및 4호분은 비교적 소형이고, 도굴 된 상태였음에도 불구하고 많은 유물이 다양하게 출토되었다. 특히 출토 유물에는 중국계 유물과 북방계 유물이 공존하고 있어 매우 중요한 유적으로 평가되고 있다. 먼저 청동 용기류의 경우 중국제인 한경이나 일산살 꼭지의 성분 조성과는 달리 주석에 비하여 납의 함유량이 높은 특징을 보였는데, 특히 2호의 청동쟁반, 청동등잔 그리고 4호의 청동솥의 경우는 주석이 1wt% 정도로 적게 함유되어 있어 Cu-Pb의 2원계 합금 조성을 보였다. 금제품의 경우는 2호분 장식품의 제작에 비교적 높은 순도의 금이 사용된 것으로 조사되었으며, 금제 누금 장식의 금 알갱이의 접합에는 금과 구리를 합금한 금땜이 사용되었거나 확산접합(말라카이트나 산화구리 화합물 가루를 사용함)에 의하여 접합했을 가능성이 높았다. 향후 몽골지역 뿐만 아니라 다른 지역의 흉노 무덤 출토품에 대한 과학적 조사 및 분석이 더 많이 진행된다면 흉노 문화에 대한 더 많은 문제들을 해결할 수 있는 실마리를 제공하게 될 것이다.