• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.21 no.10
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• pp.934-937
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• 2008

Organic field-effect transistors (OFETs) are of interest for use in widely area electronic applications. We fabricated a copper phthalocyanine (CuPc) based field-effect transistor with different metal electrode. So we need the effect of the substituent group attached to the phthalocyanine on the surface potential was investigated by Kelvin probe method with varying temperature of the substrate. We were obtained the positive shift of the surface potential for CuPc thin film. We observed the electron displacement at the interface between Au electrode and CuPc layer and we were confirmed by the surface potential measurement.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.11a
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• pp.492-493
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• 2007

Organic field-effect transistors (OFETs) are of interest for use in widely area electronic applications. We fabricated a copper phthalocyanine(CuPc) based field-effect transistor with different metal electrode. So we need the effect of the substituent group attached to the phthalocyanine on the surface potential was investigated by Kelvin probe method with varying temperature of the substrate. We were obtained the positive shift of the surface potential for CuPc thin film. We observed the electron displacement at the interface between Au electrode and CuPc layer and we were confirmed by the surface potential measurement.

• Journal of Magnetics
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• v.12 no.3
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• pp.118-123
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• 2007

We have studied the effect of Au-Cu back layer system ${\sim}10{\AA}$ thick on the properties of a spin valve. The back layers were Cu, Au, co-sputtered $Cu_xAu_{1-x}$, laminated $[Au/Cu]_n$. and bi-layer [Au/Cu]. When Au was added to the Cu, the resistance of the spin valve abruptly increased most likely due to impurity scattering. The GMR values were not increased significantly for all the structures. In the case of co-sputtered $Cu_xAu_{1-x}$, the changes in the resistance, ${\Delta}R$, was increased at a composition of ${\sim}Au_{0.5}Cu_{0.5}$. This increase in ${\Delta}R$ is due to increase in the resistance and not from the enhanced spin-dependent scattering. The structural analyses showed that the orthorhombic $Au_{0.5}Cu_{0.5}$ was formed in the back layer instead of the face-centered tetragonal $Au_{0.5}Cu_{0.5}$ as we expected. Thermal annealing over $400^{\circ}C$ may be required to have face-centered tetragonal in the $10{\AA}$ thick ultra-thin film. In the case of a laminated or bi-layered back layer, the properties of the spin valve were improved, which may be attributed to the increase in the mean free path of conduction electrons.

• Journal of the Korean Vacuum Society
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• v.20 no.5
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• pp.339-344
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• 2011

The Ohmic contact of Ti/Au metals on n-type ZnO thin film deposited on c-plane sapphire substrates by pulsed laser deposition was investigated by TLM (transfer length method) patterns. The Ti/Au metal films with thickness of 35 nm and 90 nm were deposited by electron-beam evaporator and thermal evaporator, respectively. By using the photo-lithography method, the $100{\times}100{\mu}m^2$ TLM patterns with $6{\sim}61{\mu}m$ gaps were formed. To improve the electrical properties as well as to decrease an interface states and stress between metal and semiconductor, the post-annelaing process was done in oxygen ambient by rapid thermal annealing system at temperature of $100{\sim}500^{\circ}C$ for 1 min. In this study, it appeared that the minimum specific contact resistivity shows about $1.1{\times}10^{-4}{\Omega}{\cdot}cm^2$ in $300^{\circ}C$ annealed sample, which may be originated from formation of oxygen vacancies of ZnO during an oxidation of Ti metal at the interface of Ohmic contacts.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.37 no.2
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• pp.5-12
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• 2000

Uncooled metallic thin-film thermopile infrared detectors have been fabricated, and the figures of merit for the detectors were examined. The hot junctions of a thermopile were prepared on a $Si_{3}N_{4}/SiO_{2}/Si_{3}N_{4}$-membrane which acts as a thermal isolation layer, the cold junctions on the membrane supported with the silicon rim which functions as a heat sink, and Au-black was used as an infrared absorber. Infrared absorbance of Au-black, which strongly depends on the chamber pressure during Au-evaporation and its mass per area, was found to be about 90 ％ in the wavelength range from 3${\mu}{\textrm}{m}$ to 14${\mu}{\textrm}{m}$. Voltage responsivity, noise equivalent power, and specific detectivity of Bi-Sb thermopile infrared detector at 5 Hz-chopping frequency were about 10.5V/W, 2.3 nW/Hz$^{1/2}$, 및 $1.9\times10^{7}$ cm.Hz$^{1/2}$/w at room temperature in air, respectively.

• Journal of the Korean Vacuum Society
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• v.20 no.5
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• pp.327-332
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• 2011

Plasma polymerized styrene (ppS) thin films were prepared on ITO coated glass substrates for a MIM (metal-insulator-metal) structure with thermally evaporated Au thin film as metal contact. Also the ppS thin films were applied as organic insulator to a MIS (metal-insulatorsemiconductor) device with thermally evaporated pentacene thin film as organic semiconductor layer. After the I-V and C-V measurements with MIM and MIS structures, the ppS revealed relatively higher dielectric constant of k=3.7 than those of the conventional poly styrene and very low leakage current density of $1{\times}10^{-8}Acm^{-2}$ at electric field strength of $1MVcm^{-1}$. The MIS structure with the ppS dielectric layer showed negligible hysteresis in C-V characteristics. It would be therefore expected that the proposed ppS could be applied as a promising dielectric/insulator to organic thin film transistors, organic memory devices, and flexible organic electronic devices.

• Proceedings of the Korean Vacuum Society Conference
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• 1995.02a
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• pp.057-58
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• 1995

극소전자 디바이스의 고집적화에 의해 박막배선의 선폭은 0.5$mu extrm{m}$ 이하로 축소되고 있고 상대적으로 높은 전류밀도가 흐르게 된다. 높은 전류밀도하에서는 현재 일반적으로 사용되고 있는 Al을 기본으로 하는 박막배선에서의 electromigration에 의한 결함 발생 그리고 비교적 낮은 전기전도도가 심각한 문제점으로 제기된다. 본 연구에서는 Al과 고전기전도도 물질인 Ag, Cu, 그리고 Au 박막배선에 대해 electromigration에 대한 저항성, 즉 activation energy를 측정 비교함으로써 차세대 극소전자 디바이스를 위한 박막배선재료로서의 가능성을 알아보고자 한다. Electromigration test 및 activation energy를 구하기 위해 순수 Ag, Cu, Al, Au 박막배선을 0.05$\mu\textrm{m}$ 두께, 100$\mu\textrm{m}$ 선폭, 그리고 5000$\mu\textrm{m}$ 길이로 SiO2 열산화막 처리된 pp-Si(100) 기판 위에 진공 증착시켰다. 가속화 실험을 위해 인가된 d.c. 전류밀도는 2$\times$106A/$ extrm{cm}^2$ 이었고, Al과 Au에서는 6$\times$106A/$\textrm{cm}^2$이었다. 실온에서 24$0^{\circ}C$까지의 온도범위에서 d.c.인가후의 저항변화를 측정하여 Median-Time-to-Failure(MTF)를 구한 후 Black 방정식을 이용하여 activation energy를 측정하였다. Activation energy는 Cu가 1.34eV로서 가장 높게 나타났고 Au가 1.01eV, Al이 0.66eV, Ag가 0.29eV의 순으로 측정되었다. 따라서 Cu와 Au 박막배선의 경우 Al보다 electromigration에 대한 저항력이 강한 고활성화에너지 특성을 갖는 고전기전도도 재료로서 차세대 극소전자 디바이스를 위한 대체 박막배선재료로서의 가능성을 보인다.

• 한국정보디스플레이학회:학술대회논문집
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• 2005.07b
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• pp.1361-1363
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• 2005

In this paper, we report on the performance stability of solution processible OTFT devices with Au/Ti and ITO source-drain (S/D) electrodes. It appears that the contact resistance of the S/D electrode strongly affects the stability of OTFT devices. Interestingly, the devices with the Au/Ti electrode showed lower mobility than those with the ITO (S/D) devices. The field effect mobilities of the devices with the Au/Ti and ITO electrodes were 0.06, and $0.44cm^2/Vs$, respectively. However, the mobility of the device with the Au/Ti electrode was increased up to $0.26cm^2/Vs$ after 2 weeks, while the mobility of the device with ITO electrode was slightly decreased down to $0.41cm^2/Vs$. The experimental data show us that ITO could be used as the S/D electrode for low-cost OTFT devices.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2004.07b
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• pp.861-864
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• 2004

본 연구에서는 Ta이 도핑된 $TiO_2$와 $Au/TiO_2$ nanocomposite 박막을 co-sputtering법으로 제작하였다. Ta-doped $TiO_2$ 박막은 금흥석(rutile)에서 아나타제 상으로 변하는 구조를 유도하는 고용체를 형성했다. $Au/TiO_2$ nanocomposite film의 경우에는, 지름이 약 15 nm인 Au particles들이 $TiO_2$ matrix에 균질하게 분포되었다. Ta가 도핑된 $TiO_2$ 전극과 $Au/TiO_2$ 나노 콤포사이트 전극의 anodic photocurrents가 UV뿐만 아니라 가시광선 영역에서도 관찰되었다. Ta이 도핑된 $TiO_2$ 전극과 $Au/TiO_2$ 나노 콤포사이트 사이의 가시광선 영역에서 photoresponse는 계면 상태로 부터의 bandgap의 감소와 전자의 photoexcitation 때문이다.

• Journal of the Korean Ceramic Society
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• v.43 no.2 s.285
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• pp.114-120
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• 2006

Nano-size Au particle doped $TiO_2$ films were prepared with $Ti(OC_3H_7^i)_4$, polyvinylpyrrolidone(PVP), $HAuCl_4$ and $C_3H_7OH$ etc. by sol-gel method. $TiO_2$ gel films were obtained by the dip-coating method on the $SiO_2$ glass substrates, and then heat-treated at $700^{\circ}C$ for 10 min. The thickness of $TiO_2$ films were $0.7\~1.8\;{\mu}m$. It was found that the thickness of films prepared from PVP containing solution was about $2\~8$ times higher values than that of thin films without PVP. The size of Au particles doped in the films were about $350\~750\;nm$. Nano-size Au particle dispersed $TiO_2$ films showed high absorption peak at visible region 450nm, which made them good candidates for non-linear optical materials and photo-catalytic materials. The contact angle of $TiO_2$ film for water was $12.5^{\circ}$, and therefore it is clear that $TiO_2$ films have very high hydrophilic properties and the self-cleaning effects.