• Journal of Welding and Joining
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• v.29 no.5
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• pp.90-94
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• 2011

Ag metallic particles from nano-scale to submicron-scale are combined with organic solvent to provide fine circuits and interconnection. Ink-jet printing with Ag nano particle inks demonstrated the potentials of the new printed electronics technology. The bonding at the interface between the Ag wiring layer and the various substrates is very important. In this study, the details of interfaces in Ag wiring are investigated primarily by microstructure observation. By adjusting the materials and sintering conditions, nicely formed interfaces between Ag wiring and Cu, Au or organic substrates are achieved. In contrast, transmission electron microscope (TEM) image clearly shows interface debonding between Ag wiring and Sn substrate. Sn oxides are formed on the surface of the Sn plating. The formation of these is a root cause of the interface debonding.

• Proceedings of the Korean Vacuum Society Conference
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• 2007.08a
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• pp.154-154
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• 2007

• Journal of the Mineralogical Society of Korea
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• v.29 no.3
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• pp.113-122
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• 2016

This study aims to improve the recovery of gold and silver by removing hematite from gold ore of an oxidation zone with ammonia solution. Quartz, hematite and muscovite were present in the oxidation zone, while hematite was hydrogenous. As a result of performing an ammonia leaching test on variables, it is found that the maximum Fe leaching parameter was $-45{\mu}m$ particle size, 1.0 M sulfuric acid concentration, 5.0 g/l ammonium sulfate concentration and 2.0 M hydrogen peroxide concentration. It is also confirmed that goethite was precipitated and formed from that ammonia elution. As the amount of Fe-removal was increased in a solid-residue, the recovery of Au and Ag were increased, too.

• Korean Journal of Materials Research
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• v.5 no.8
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• pp.929-935
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• 1995

In order to develop COG (Chip On Glass) technology for LCD module interconnecting the driver IC to Al pad electrode on the glass substrate, Anisotropic Conductive Adhesive(ACA) process, the most promising one among COG technologies, was investigated. ACA process was carried out by two steps, dispensing of ACA resin in the bonding area and curing by W radiation. Load on the chip was ranged from 2.0 to 15kg and the chip was heated at about 12$0^{\circ}C$. In resin, the density of conductive particles coated with Au or Ni at the surface were 500, 1000, 2000 and 4000 particles/$\textrm{mm}^2$, and the diameter of particles were 5, 7 and 12${\mu}{\textrm}{m}$. As a result of the experiments, ACA process using ACA particle of diameter and density of 5${\mu}{\textrm}{m}$ and 4000 particles/$\textrm{mm}^2$ respectively shows optimum characteristic with the stabilzed bonding properties and contact resistance.

• Polymer(Korea)
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• v.31 no.5
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• pp.410-416
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• 2007

Monodisperse polymer particles were prepared via one- step seeded polymerization using PMMA as seed particles, and HDDA, triEGDMA or EGDMA as crosslinking monomer. For the study, the effects of 1) the ratio of the absorbed monomer to the seed polymer particles (swelling ratio), 2) the characteristics of crosslinking monomer, 3) electroless Ni plating, and 4) electroless Au Plating on the variation of mechanical properties of polymer particles, such as recovery rate, K-values, breaking strength and breaking displacement were investigated by using MCT (micro compression test). It was observed that swelling ratio of polymer particles influenced only on breaking strength of polymer Particles, while electroless plating did on recovery rate, K-values ($K_{10}\;and\;K_{20}$) and breaking strength of electroless plated polymer particles. However, breaking displacement and K-values ($K_{30}{\sim}K_{50}$) were more or less insensitive to electroless plating.

• Resources Recycling
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• v.3 no.1
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• pp.38-43
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• 1994

The separation of valuable metals from IC chip scrap generated by domestic electronic company was carried out using the mechanical beneficiation such as shredding, crushing, screening and magnetic separation. The distribution of metals in various sizes of crushed IC chip scrap was investigated and metals present in crushed products was separated with the magnetic separator. The particle size distribution of crushed IC chip scrap was 7.5% for +3mm, 17.0% for 3~1mm and 75.5% for -1mm. The weight loss of crushed IC chip scrap was 18% when roasted at $700^{\circ}C$. The content of metals was 96% for +3~1mm, 13% for 1~0.595mm, 3.7% for 0.95~0.5. Au of 99% was present in -1mm crushed IC chip scrap. Ni, Fe, Cu, Sn and Pb were separated from crushed IC chip scrap by the magnetic separator under 700 and 2, 500 Gauss.

• Korean Chemical Engineering Research
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• v.50 no.5
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• pp.795-801
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• 2012

Nanoparticles have received significant attention because of their unusual characteristics including high surface area to volume ratios. Thiol ligand have been used as stabilizers of metal nanoparticles since Brust et al. They reported the preparation method of ligand capped metal nanoparticles by protecting the nanoparticles with a self-assembled monolayer of dodecanethiolate. In this method, volatile organic compounds (VOCs) were used as sovents. This study was carried out to replace these VOCs with room temperature ionic liquids (RTILs). We used two type of ILs to prepare metal nanoparticles. One is a hydrophobic IL, [BMIM][[$PF_6$] (1-Butyl-3-methylimidazolium hexafluorophosphate) purchased from IL maker, C-Tri from Korea and the other one is a hydrophilic one, [BMIM][Cl] (1-Buthy-3-methylimdazolium chloride) sinthesized by us. In the case of preparing Ag and Au nanoparticles using [BMIM][Cl], we didn't use phase transition reagents and ethanol because it has hydrophilic property and preparing Au, Ag nanoparticles using [BMIM][[$PF_6$] the method is as same as Brust et al.'s except using [BMIM][[$PF_6$] instead of organic solvent because it has hydrophobic property. FT-IR and UV-vis, TEM, TGA analysis have been used in an attempt to determine the particle size and verify functional groups. The particle size obtained from TEM was very similar to those obtained by Brust et al. This is a clear example of ligand capped metal nanoparticles prepared using ionic liquids. And the experimental result demonstrated ionic liquids can act as a highly effective medium for the preparation and stabilization of gold and silver metal nanoparticles.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.130-131
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• 2013

Nanostructured oxides are widely used in heterogeneous catalysis where their catalytic properties are closely associated with the size and morphology at nanometer level. The effect of particle size has been well decumented in the past two decades, but the shape of the nanoparticles has rarely been concerned. Here we illustrate that the redox and acidic-basic properties of oxides are largely dependent on their shapes by taking $Co_3O_4$, $Fe_2O_3$, $CeO_2$ and $La_2O_3$ nanorods as typical examples. The catalytic activities of these rod-shaped oxides are mainly governed by the nature of the exposed crystal planes. For instance, the predominant presence of {110} planes which are rich in active $Co^{3+}$ on $Co_3O_4$ nanorods led to a much higher activity for CO oxidation than the nanoparticles that mainly exposed the {111} planes. The simultaneous exposure of iron and oxygen ions on the surface of $Fe_2O_3$ nanorods have significantly enhanced the adsorption and activation of NO and thereby promoted the efficiency of DeNOx process. Moreover, the exposed surface planes of these rod-shaped oxides mediated the reaction performance of the integrated metal-oxide catalysts. Au/$CeO_2$ catalysts exhibited outstanding stability under water-gas shift conditions owing to the strong bonding of gold particle on the $CeO_2$ nanorods where the formed gold-ceria interface was resistant towards sintering. Cu nanoparticles dispersed on $La_2O_3$ nanorods efficiently catalyzed transfer dehydrogenation of primary aliphatic alcohols based on the uniue role of the exposed {110} planes on the support. Morphology control at nanometer level allows preferential exposure of the catalytically active sites, providing a new stragegy for the design of highly efficient nanostructured catalysts.

• Korean Journal of Materials Research
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• v.23 no.1
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• pp.13-17
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• 2013

The alignments of polystyrene particles of $1{\mu}m$ and $5{\mu}m$ sizes in an aqueous colloidal system were observed by varying the electric field strength, the frequency and the water flow. Spherical mono-dispersed polystyrene particles dispersed in pure water were put into a perfusion chamber; an AC electric field was applied to the Au/Cr electrodes with a 4 mm gap on the glass substrate. The mixture of the $1{\mu}m$ and $5{\mu}m$ sized polystyrene particles at 0.5 vol% concentrations for each size was set in the dielectrophoresis conditions of 1 kHz and 150 V/cm. Large particles of $5{\mu}m$ size were aligned to form chains as the result of the dielectrophoresis force interaction. On the contrary, small particles of $1{\mu}m$ size did not form chains because the dielectrophoresis force was not sufficiently large. When the electric field increased to 250 V/cm, small particles were able to form chains. After the chains were formed from both large and small particles, they began to coalescence as time passed. Owing to the electroosmotic flow of water, wave patterns along the perpendicular direction of the applied electric field appeared at the conditions of 200 Hz and 50 V/cm, when the dielectrophoresis force was small. This wave pattern also appeared for small particles at 1 kHz and 150 V/cm conditions due to the flow of solvent when water was forced to circulate.

• Nuclear Engineering and Technology
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• v.53 no.9
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• pp.3026-3034
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• 2021

Multi-target X-ray tube is a new type X-ray source, and can be applied in many fields such as sensitive X-ray fluorescence analysis and medical imaging. In this work, we report an electric field modulation multi-target X-ray tube, which contains four targets (Cr, Ni, Au, Mo) coated on a Beryllium (Be) window. A four-valve electric field deflector was developed to deflect the electron beam to bombard the corresponding targets. Particle dynamics analysis software was employed to simulate the particle tracking of electron beam. The results show that the 30 keV electron beam could get a 6.7 mm displacement on the target plane by 10⁵ V/m electric field. The focus areas are about 2 mm × 5 mm and 4 mm × 2.5 mm after deflection in two directions. Thermal behavior calculated by ANSYS shows that the designed target assembly could withstand a 10 W continuous power. The optimum target thicknesses and emission spectra were obtained by Geant4 when the thickness of Be window was 300 mm and the electron beam incident angle was 0.141 rad. The results indicate that this multi-target X-ray tube could provide different X-ray sources effectively.