• 전기화학회지
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• 제18권3호
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• pp.107-114
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• 2015

전기화학적인 방법으로 나노구조를 지니는 금 표면을 형성하는 방법에 관한 연구는 최근 많은 연구자들의 관심을 끌고 있다. 첨가된 금 전구체를 전기화학 석출에 의해 나노구조 금 표면을 형성하는 기존 연구와는 달리, 본 연구에서는 전구체를 외부에서 첨가하지 않고 금 표면을 전기 화학적으로 변형하여 표면에 나노구조체를 형성하는 방법을 제시하였다. $Br^-$이 존재하는 인산 완충용액 전해질 하에서 금 전극에 산화전위를 가해 주면 산화 용해된 금은 $Br^-$과 결합하여 전극 표면에 전구체를 형성하는데, 이렇게 형성된 표면상의 전구체를 연이어 환원시켜 주면 실시간으로 나노구조 금 표면을 형성하는 것이 가능함을 보였다. 전극에 가해주는 전위와 시간의 조절이 전극 표면에 형성되는 금 나노구조의 모양에 미치는 영향을 체계적으로 관찰한 결과 독특한 척추 모양의 금 나노구조가 형성이 되었다. 척추 모양의 금 나노구조는 표면증강 라만 분광 활성이 높은 것으로 나타났다. 본 연구에서 제시된 방법은 전구체 없이 전기화학적으로 금 전극 표면을 변형시키는 새로운 방법으로 금 나노구조 형성에 관한 연구에 도움이 될 것으로 기대한다.

• 자원리싸이클링
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• 제10권1호
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• pp.49-55
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• 2001

The strategy of recovering metals from scrap is in general much different from primary sources. One of the main differences between the treatment of scrap and that of primary sources lies with the fact that metals are frequently associated with other met-als to form alloys in scrap, while metals occur in primary sources as oxides or sulfides. In this paper, factors affecting the dis-solution behavior of metals from various alloy systems have been reviewed and discussed. Specific examples have been drawn from Au/Ag, Au/cu and Ag/cu systems. Results of the dissolution behavior of various metals from these alloys have been reviewed and compared to the dissolution behavior of single metal systems in various lixiviants such as acids, cyanide and ammonia. It has been observed that the presence of other metals in alloys would significantly affect the dissolution rate of the metal in question. The leaching behavior of metals from homogeneous alloys relies on the chemical interaction between atoms in the lattice of the alloys, while that from heterogeneous alloys is affected by galvanic interaction established in the solution The manner in which the dissolution of a certain metal is influenced by surrounding metals has been discussed in terms of pas-sive and noble nature of the metal in relation to the neighboring metals. The role of the standard electrochemical Potential of these metals on the selective dissolution for a given lixiviant has also been discussed.

• 약학회지
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• 제33권4호
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• pp.229-236
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• 1989

Even though two different preparations are chemically equivalent, the variance of bioavailability differenciates the clinical effect of preparations, so that the preparations need to be evaluated by comparing bioavailability in vivo as well as chemical equivalence. In this study, bioequivalence tests of commercially available isoniazid tablets A, B, C and D (standard) were performed to give some guidelines to bioequivalence test. The bioavailability parameters obtained by drug administeration were statistically analyzed. Statistical evaluation of the data involved an analysis of variance for a cross over design. Cross over design was employed with 8 healthy volunteers. The results were within 20% difference of mean value in the AUC, Cmax, Tmax and amount of urinary excretion (Au) between standard and isoniazid tablets. The results of ANOVA showed no significant differences for 'group or sequence', but almost not for 'between subjects'. The tablet. A, B and D were within 20 min, but tablet C was within 50 min. Tablet A was biologically equivalent in the Au. tablet B biologically equivalent in the Au and AUC. Tablet C was biologically equivalent in the Au. The relationship between the dissolution rate and Au was significant.

• Corrosion Science and Technology
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• 제4권1호
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• pp.19-22
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• 2005

Two Au-Ag-Cu-Pd dental casting alloys (Au:12% and 20%) used. The test solutions used 0.9 % NaCl solution (isotonic sodium chloride solution), 0.9 % NaCl solution containing 1 % lactic acid, and 0.9 % NaCl solution containing 1 % lactic acid and 0.1 mol $dm^{-3}$ $Na_2S$. The surface of two samples in three sample solutions was not natural discoloration during one year. The alloy containing 12 % gold was easily alloyed and the composition was uniform comparing with the alloy containing 20 % gold. The rest potentials have not a little effect after three months. The kinds of metals could not definitely from the oxidation and reduction waves of metal on the cyclic voltammograms. The dissolutions of gold and palladium were 12 % Au sample in the 0.9 % NaCl solution containing 1 % lactic acid and 0.1 mol $dm^{-3}$ $Na_{2}S$. The pH of solution had an affect on dissolution of copper, and sulfur ion had an affect on dissolution of silver. The copper dissolved amount from 20 % gold sample was about 26 times comparing with that of 12 % gold sample in the 0.9 % solution containing 1 % lactic acid. Corrosion products were silver chloride and copper chloride in NaCl solution, and silver sulfide and copper sulfide in NaCl solution containing $Na_{2}S$.

• 마이크로전자및패키징학회지
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• 제9권4호
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• pp.1-9
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• 2002

Ball grid array (BGA) substrate 상의 0.5 $\mu\textrm{m}$Au/5 $\mu\textrm{m}$Ni/Cu 층으로 구성된 접촉 패드(pad)와 In-15(wt.%)Pb-5Ag 솔더 볼 사이에서 리플로우 및 고상 시효동안 일어나는 금속학적 반응 특성이 조사되었다. 1-5 분의 리플로우 시간에 따라 솔더/패드 계면에서 $AuIn_2$ 또는 Ni-In 금속간 화합물층이 형성됨이 관찰되었다. 리플로우 동안 용융 In-l5Pb-5Ag 솔더 내로의 Au 층의 용해 속도는 $2\times 10^{-3}$ $\mu\textrm{m}$/sec 정도로 측정되어 공정 Sn-37Pb와 비교하여 매우 느린 것으로 관찰되었다. $130^{\circ}C$에서 500시간의 고상 시효 후에는 초기 리플로우 시간에 관계없이 $Ni_{28}In_{72}$ 금속간 화합물층이 약 3 $\mu\textrm{m}$까지 성장하였다. 이를 통하여 솔더 합금에서의 In 원자들은 아래의 Ni 층과 반응하기 위하여 리플로우 동안 형성된 $AuIn_2$상을 통하여 확산하는 것으로 관찰되었다. 미세구조 관찰과 전단 시험을 통하여 In-l5Pb-5Ag합금의 경우는 Sn-37Pb 조성과는 달리 Au/Ni surface finish 상에 사용시에도 솔더 접합부에서의 Au-embrittlement를 야기 시키지 않는 것으로 분석되었다.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2002년도 춘계 기술심포지움 논문집
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• pp.183-188
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• 2002

With the contact pad consisted of $0.5{\mu}{\textrm}{m}$ $Au/5{\mu}{\textrm}{m}$ Ni/Cu layers on a conventional ball grid array(BGA) substrate, metallurgical reaction properties between the pad and In-15(wt.%)Pb-5Ag solder alloy were studied after reflow and solid aging. In as-reflow condition, thin AuIn$_2$or Ni$_{28}$In$_{72}$ intermetallic layer was formed at the solder/pad interface according to reflow time. Dissolution of the Au layer into the molten solder was remarkably limited in comparison with eutectic Sn-37Pb alloy. After solid aging of 300 hrs, thickness of In-Ni layer increased to about $2{\mu}{\textrm}{m}$ in the both as-reflow case. It was observed that In atoms diffuse through the AuIn$_2$phase to react with underlaying Ni layer. The metallurgical reaction properties between In-l5Pb-7Ag alloy and Au/Ni surface finish were analysed to result in suppression of Au-embrittlement in the solder joints.

• 광물과 암석
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• 제33권3호
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• pp.243-250
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• 2020

본 연구의 목적은 선상에서 열수광물 내 Au를 효과적으로 용출하기 위한 마이크로웨이브-차아염소산 용출의 적용 가능성을 파악하는 것이다. 비교용출실험은 마이크로웨이브 질산용출의 유(T1)/무(T2)에 따른 Au 용출율의 영향을 확인하였다. 또한, 기계적 교반에 의한 전통적인 용출(T3)과 마이크로웨이브 용출에 따른 Au 용출율을 비교하였다. 마이크로웨이브 질산용출결과(고액비; 10%, 용출온도; 90℃, 용출시간; 20분), 금속의 용출율은 As>Pb>Cu>Fe>Zn 순으로 높게 나타났으며, 용출잔사 내 Au의 함량은 33.77 g/ton에서 60.02 g/ton으로 증가하였다. 염화물 용매제를 이용한 비교용출실험 결과, Au의 용출율은 T1(61.10%)>T3(53.30%)>T2(17.30%)순으로 높게 나타났다. 따라서, 해수를 이용하여 제조 가능하고 용출과정에서 발생되는 염소 가스를 포집하여 재이용 가능한 염화물은 Au용출을 위한 최적의 용매제로 예상된다. 또한 마이크로웨이브를 적용함으로써 시간, 효율 및 에너지 측면에서 효과적일 것으로 판단되어진다.

• 한국표면공학회지
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• 제54권1호
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• pp.1-11
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• 2021

Porous dendrite structure AuCu alloy was formed using a hydrogen bubble template (HBT) technique by electroplating to improve the catalytic performance of gold, known as an excellent oxygen reduction reaction (ORR) catalyst in alkaline medium. The rich Au surface was maximized by selectively electrochemical etching Cu on the AuCu dendrite surface well formed in a leaf shape. The catalytic activity is mainly due to the synergistic effect of Au and Cu existing on the surface and inside of the particle. Au helps desorption of OH- and Cu contributes to the activation of O2 molecule. Therefore, the porous AuCu dendrite alloy catalyst showed markedly improved catalytic activity compared to the monometallic system. The porous structure AuCu formed by the hydrogen bubble template was able to control the size of the pores according to the formation time and applied current. In addition, the Au-rich surface area increased by selectively removing Cu through electrochemical etching was measured using an electrochemical calculation method (ECSA). The results of this study suggest that the alloying of porous AuCu dendrites and selective Cu dissolution treatment induces an internal alloying effect and a large specific surface area to improve catalyst performance.

• 대한화학회지
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• 제51권1호
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• pp.14-20
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• 2007

금(Au) 전극 위에 전해 석출한 철족 원소(Fe, Co, Ni)를 전극으로 phthalate 완충 용액에서 철족 원소의 부식과정을 조사하였다. Phthalate 완충용액의 pH의 변화에 대한 부식전위와 부식전류를 측정하여 각 원소(Fe, Co, Ni)전극의 산화반응과 환원반응에 대한 Tafel 기울기를 구하였으며 Tafel 기울기를 포함한 정량적인 전기화학 인자를 측정하여 전극의 산화반응과 환원반응에 대한 반응 메커니즘을 제안하였다. Phthalate 완충 용액에 존재하는 화학 종의 흡착은 철족 원소 전극의 산화반응에 영향을 미치는 것으로 보인다.

• 한국소음진동공학회:학술대회논문집
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• 한국소음진동공학회 2007년도 추계학술대회논문집
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• pp.77-81
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• 2007

Pentacene was dissolved in N-methyspyrrolidone (NMP) and mixed with poly(3,4-ethylenedioxythiophene), poly(styrenesulfonate) (PEDOT:PSS). The solution color changed from deep purple to intense yellow. As the dissolution time increased, visible absorption decreased and ultraviolet (UV) absorption increased. PEDOT:PSS or Pentacene-PEDOT:PSS was spin-coated to control the layer thickness. Three-layered Schottky diodes consisting of Al, PEDOT:PSS or PEDOT:PSS-pentacene, and Au with thickness of 300nm, respectively, were fabricated. The current densities of $4.8{\mu}A/cm^2$ at 2.5MV/m and $660{\mu}A/cm^2$ at 1.9MV/m were obtained for the Au/PEDOT:PSS/Al and Au/Pentacene-PEDOT:PSS/Al Schottky diodes, respectively. The current density of the Schottky diode was enhanced by about two orders of magnitude by doping pentacene to PEDOT:PSS.