• Proceedings of the KWS Conference
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• 2006.10a
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• pp.181-183
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• 2006

This paper studies the mechanical behaviors of Sn-3.5Ag solder joint against substrate(such as Au/Ni/Cu, Au/cu, Ni/Cu and Cu pad) after induction heating, a new soldering method. It was found that the solder bump formation depends on the time and current of the induction heating system. Also the heating value of the solder bump were found to vary with respect to the thermal conductivity of the pads on the substrate. In case of Au/Ni/Cu pad and Au/Cu pad, solder bump's shear strength were high for the heating time of $1.5{\sim}2sec$. For Ni/Cu pad, solder bump's shear strength were found to increase with time increment.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.15 no.4
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• pp.308-313
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• 2002

Samples with the norminal composition, $Bi_{2-x}Au_xSr_2CaCu_2O_{8+\delta}$ (x = 0, 0.05. 0.1, 0.15) were prepared by the solid-state reaction method. The superconducting properties, x-ray powder diffraction patterns, critical temperature and microstructure of surface were measured the samples. x-ray patterns show the single phase(2212) nature of the samples. But, the peaks of 2201 at $2\theta=30^{\circ}$ and Au peak at $2\theta=38.31^{\circ}$ are observed in the Au additive samples. The grain sire are enlarged with the increase of x. As the result of enlargement the grain size, the onset and offset critical temperature($T_c^{on}$,$T_c^{zero}$) increased with increase of x.

• Korean Journal of Materials Research
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• v.7 no.8
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• pp.668-678
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• 1997

Si(100)기판상에 여러 가지 두께의 Au박막을 선행 증착(pre-deposition)한 후, 각각의 Au박막상에서의 Cu-MOCVD박막의 초기 핵생성과 성장 기구를 고찰하였고, 또한 각 계면에서의 상호 확산 거동을 여러가지의 분석 장비를 이용하여 조사하였다. 30$\AA$두께의 Au 박막은 수소 가스 분위기중의 열처리에 의하여 평탄한 표면 상태에서 불연속의 응집된 도상(island)형태로 변화(Si 전체 표면중 약 20%)하였다. 반면에 1500$\AA$두께의 Au박막상에서 성장한 Cu-MOCVD박막은 두께 증가에 따른 미세구조의 차이, 즉 Cu박막중으로 Au원자의 확산여부는 Au박막에 유기되는 열응력(thermal stress)을 완화하는 과정에서 일어난 결과이다.

• Journal of Technologic Dentistry
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• v.34 no.4
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• pp.345-352
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• 2012

Purpose: The age-hardening mechanism of an Au-Ag-Cu-Pt-Zn alloy for crown and bridge fabrication was investigated by means of hardness test, X-ray diffraction study and field emission scanning electron microscopic observation. Methods: Before hardness testing, the specimens were solution treated and then were rapidly quenched into ice brine, and were subsequently aged isothermally at $400-450^{\circ}C$ for various periods of time in a molten salt bath and then quenched into ice brain. Hardness measurements were made using a Vickers microhardness tester. The specimens were examined at 15 kV using a field emission scanning electron microscope. Results: By the isothermal aging of the solution-treated specimen at $450^{\circ}C$, the hardness increased rapidly in the early stage of aging process and reached a maximum hardness value. After that, the hardness decreased slowly with prolonged aging. However, the relatively high hardness value was obtained even with 20,000 min aging. By aging the solution-treated specimen, the f.c.c. Au-Ag-rich ${\alpha}_0$ phase was transformed into the Au-Ag-rich ${\alpha}_1$ phase and the AuCu I ordered phase. Conclusion: The hardness increase in the early stage of aging process was attributed to the formation of lattice strains by the precipitation of the Cu-rich phase and then subsequent ordering into the AuCu I-type phase. The decrease in hardness in the later stage of aging process was due to the release of coherency strains by the coarsening of tweed structure in the grain interior and by the growth and coarsening of the lamellar structure in the grain boundary. The increase of inter-lamellar space contributed slightly to the softening compared to the growth of lamellar structure toward the grain interior.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.3
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• pp.19-26
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• 2017

Stretchable deformation-resistance characteristics of Au, Pt, and Cu films were measured for the stretchable packaging structure where a parylene F was used as an intermediate layer between a PDMS substrate and a metal thin film. The 150 nm-thick Au and Pt films, sputtered on the parylene F-coated PDMS substrate, exhibited the initial resistances of $1.56{\Omega}$ and $5.53{\Omega}$, respectively. The resistance increase ratios at 30% tensile strain were measured as 7 and 18 for Au film and Pt film, respectively. The 150 nm-thick Cu film, sputtered on the parylene F-coated PDMS substrate, exhibited a very poor stretchability compared to Au and Pt films. Its resistance was initially $18.71{\Omega}$, rapidly increased with applying tensile deformation, and finally became open at 5% tensile strain.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2007.10a
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• pp.751-753
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• 2007

Organic field-effect transistors (OFETs) are of interest for use in widely area electronic applications. We fabricated a copper phthalocyanine (CuPc) based field-effect transistor with different metal electrode. The CuPc FET device was made a top-contact type and the substrate temperature was room temperature. The source and drain electrodes were used an Au and Al materials. The CuPc thickness was 40nm. and the channel length was $50{\mu}m$, channel width was 3mm. We observed a typical current-voltage (I-V) characteristics in CuPc FET with different electrode materials.

• Journal of Technologic Dentistry
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• v.21 no.1
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• pp.27-41
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• 1999

The Ag-Pd-Cu alloys containing a small amount of Au is commonly used for dental purposes, because this alloy cheaper than Au-base alloys for clinical use. However, the most important characteristic of this alloy is age-hardenability, which is not exhibited by other Ag-base dental alloys. The specimens used were Ag-30Pd-10Cu ternary alloy and Au addition alloy. These alloys were melted and casted by induction electric furnace and centrifugal casting machine in Ar atmosphere. These specimens were solution treated for 2hr at $800^{\circ}C$ and were then quenched into iced water, and aged at 350-$550^{\circ}C$ Age-hardening characteristic of the small Au-containing Ag-Pd-Cu dental alloys were investigated by means of hardness testing, X-ray diffraction and electron microscope observations, electrical resistance, differential scanning calorimetric, energy dispersed spectra and electron probe microanalysis. Principal results are as follows ; Maximum hardening occured in two co-phases of ${\alpha}_2$ + PdCu In stage II, decomposition of the $\alpha$ solid solution to a PdCu ordered phase($L1_o$ type) and an Ag-rich ${\alpha}_2$ phase occurred and a discontinuous precipitation occurred at the grain boundary. From the electron microscope study, it was concluded that the cause of age-hardening in this alloy is the precipitation of the PdCu redered phase, which has AuCu I type face-centered tetragonal structure. Precipitation procedure was ${\alpha}{\to}{\alpha}_1+PdCu{\to}{\alpha}_2+PdCu$ at Pd/Cu = 3 Pd element of Ag-Pd-Cu alloy is more effective dental alloy on anti-corrosion and is suitable to isothermal ageing at $450^{\circ}C$.

• Journal of Technologic Dentistry
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• v.19 no.1
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• pp.21-35
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• 1997

The Ag-Pd-Cu alloys containing a small amount of Au is commonly used for dental purposes, because this alloy is cheaper than Au-base alloys for clinical use. However, the most important characteristic of this alloy is age-hardenability, which is not exhibited by other Ag-base dental alloys. The specimens used were Ag-20Pd-20Cu ternary alloy and Au addition alloy. These alloys were melted and casted by induction electic furace and centrifugal casting machine in Ar atmoshpere. These specimens were solution treated for 2hr at $800^{\circ}C$ and were then quenched into iced water, and aged at $350{\sim}550^{\circ}C$ Age-hardening characteristics of the small Au-containing Ag-pPd-Cu dental alloys were investigated by means of hardness testing, X-ray diffraction and electron microscope observations, electrical resistance, differential scanning calorimetric, emergy dispersed spectra and electron probe microanalysis. Principal results are as follows : Hardening occured in two stages, I. e., stage I in low temperature and stage II in high temperature regions, during continuous aging. The case of hardening in stage I was due to the formation of the Llo type face centered tetragonal PdCu-ordered phase in the grain interior and hardening in stage I was affedted by the Cu concentration. In stage II, decomposition of the $\alpha$ solid solution to a PdCu ordered phase(L1o type) and an Agrich ${\alpha}2$ phase occurred and a discontiunous precipitation occurred at the grain boundary. Form the electron microscope study, it was concluded that the cause of age-hardening in this alloy is the precipitation of the PdCu ordered phase, which has AuCu I type face-centered tetragonal structure. Precipitation procedure was ${\alpha}\to{\alpha}+{\alpha}2+PdCu\to{\alpha}1+{\alpha}2+PdCu$ at Pd/Cu = 1 Ag-Pd-Cu alloy is more effective dental alloy as ageing treatment and is suitable to isothermal ageing at $450^{\circ}C$.

• Membrane Journal
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• v.13 no.1
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• pp.9-19
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• 2003

Membrane process was investigated to recover process water and valuable gold from washing water of electroless PCB plating processes. The filtration experiments were carried out using not only a RO membrane test cell to determine suitable membrane for washing water but also spiral wound membrane modules of nanofiltration and reverse osmosis for scale-up. At first, RO-TL(tap water, low pressure), RO-BL(brackish water, low pressure) and RO-normal(for water purifier) sheet membranes made by Saehan Co. were tested, and the performance of RO-TL membrane showed most suitable f3r recovery of soft etching, catalyst and Ni washing waters. As a result of RO test cell, the experiments for scale-up were carried out using RO-TL modules far water purifier at 7bar and $25^{\circ}C $The permeate flux fur Au washing water was about 30 LMH, but Au rejection was less than 80%. The permeate fluxes for Pd, Ni and soft etching washing water were about 22, 17 and 10 LMH, respectively. The Pd, Ni and Cu rejections showed more than 85, 97 and 98% respectively. The nanofiltration module for water purifier was introduced to recover Au selectively from Au, Ni and Cu ions in Au washing water. Most of Ni and Cu ions in the feed washing water were removed, and only Au ion was existed 81.9% in the permeate. Furthermore, Au ion in the permeate was concentrated and recovered by RO-TL membrane module. Finally, Au was also able to recover effectively by using 4 inch diameter spiral wound modules of NF and RO-TL membranes, in series.

• 한국정보디스플레이학회:학술대회논문집
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• 2006.08a
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• pp.1640-1644
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• 2006

The first issue that should be overcome in copper process is its poor adhesive strength between pure copper film and glass substrate. In this study, defining the adhesive strength of pure copper film on various substrates and clarifying the key deposition parameters are presented for the investigation of copper process. First, using different kinds of surface plasma treatments were studied and the results showed that the adhesive strength was not improved even though the roughness of glass substrate surface was increased. Second, adding an adhesive layer between glass substrate and pure copper film was used to enhance the adhesion. Based on the data in the present paper, adopting copper alloy film as an adhesive layer can have capability preventing peeling problem in copper process. Besides, Cu/Cu alloy structure could be etched with the same etchant with better taper angle than the one with single layer of Cu. Unlike Cu/Mo structure, there is no residual problem for Cu/Cu alloy structure during etching process. Finally, this structure was examined in electrical test without significant difference in comparison with the conventional metal process.