• Proceedings of KOSOMES biannual meeting
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• 2007.11a
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• pp.43-49
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• 2007

The metals we are familiar with(Al, Ag, Au, Cu, Cd, Co, Fe, Ni, Pb, Zn, etc) are common elements and conservative pollutants. Although metals are often vital constituents of the metabolism of living organisms(trace elements}, a number of them are toxic if their concentration exceeds a certain threshold. It has long been recognized that measurements of trace metals in natural waters are often subject to large errors in terms of precision and accuracy. Since 1975 in US and European countries, seawater concentration of many trace metals have been shown to be factors of 10-1,000 lower than those previously accepted. Vertical profiles have been found to be consistent with known biological, physical and/or geochemical processes. These are resulted from major advances in analytical instrumentation and methodology for trace elements, and greater attention has been given to assuring the elimination of contamination during sampling, storage, and analysis.

• 한국지구물리탐사학회:학술대회논문집
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• 2003.11a
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• pp.544-547
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• 2003

The objective of this study is to investigate the contamination levels and dispersion patterns of arsenic and heavy metals and to estimate the bioaccessible fraction of the metals in soil and plant samples in the vicinity of the abandoned Songcheon Au-Ag mine. Tailings, soils, plants (Chinese cabbage, red pepper, soybean, radish, sesame leaves, green onion, lettuce, potato leaves, angelica and groundsel) and waters were collected around the mine site. After appropriate preparation, all samples were analyzed for As, Cd, Cu, Pb and Zn by ICP-AES and ICP-MS. Elevated levels of As and heavy metals were found in tailings. Mean concentrations of As in agricultural soils were higher than the permissible level. Especially, maximum level of As in farmland soil was 513 mg/kg. The highest concentrations of As and Zn were found in Chinese cabbage (6.7 mg/kg and 359 mg/kg, respectively). Concentrations of As, Cd, and Zn in most stream waters which are used for drinking water around this mine area were higher than the permissible levels regulated in Korea. Maximum levels of As, Cd and Zn in stream waters were 0.78 mg/L, 0.19 mg/L and 5.4 mg/L, respectively. These results indicate that mine tailings can be the main contamination sources of As and heavy metals in the soil-water system in the mine area. The average of estimated bioaccessible fraction of As in farmland soils were $3.7\%$ (in simulated stomach) and $10.8\%$ (in simulated small intestine). The highest value of bioaccessible fraction of metal in farmland soils was $46.5\%$ for Cd.

• Journal of the Mineralogical Society of Korea
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• v.29 no.3
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• pp.113-122
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• 2016

This study aims to improve the recovery of gold and silver by removing hematite from gold ore of an oxidation zone with ammonia solution. Quartz, hematite and muscovite were present in the oxidation zone, while hematite was hydrogenous. As a result of performing an ammonia leaching test on variables, it is found that the maximum Fe leaching parameter was $-45{\mu}m$ particle size, 1.0 M sulfuric acid concentration, 5.0 g/l ammonium sulfate concentration and 2.0 M hydrogen peroxide concentration. It is also confirmed that goethite was precipitated and formed from that ammonia elution. As the amount of Fe-removal was increased in a solid-residue, the recovery of Au and Ag were increased, too.

• 한국신재생에너지학회:학술대회논문집
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• 2009.11a
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• pp.394-394
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• 2009

Water solubility of conjugated polymers may offer many applications. Potential applications of water-soluble conjugated polymers include the polymer light-emitting diode and new materials for nano and micro hollow-capsules, and bio- or chemo-sensors. We synthesized neutral polyfluorenes containing bromo-alkyl groups by the palladium catalyzed Suzuki coupling reaction. Bromo-alkyl side groups in neutral polyfluorenes were quaternized by tri-methyl amine solution. The electrochemical and optical properties of water-soluble conjugated polymers are discussed. This novel synthesized water-soluble conjugated polymers were used as a interfacial dipole layer between active layer and metal cathode in polymer solar cell for enhancement of open-circuit voltage (Voc), which is one of the most critical factors in determining device characteristics. We also investigated the device performance of polymer solar cell with different metal cathode such as Al, Ag, Au and Cu. In polymer solar cell, novel cationic water-soluble conjugated polymers were inserted between active layer and high-work function cathode (Al, Ag, Au and Cu).

• Proceedings of the Korean Vacuum Society Conference
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• 2011.08a
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• pp.76-76
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• 2011

Polymer-fullerene based bulk heterojunction (BHJ) solar cells can be fabricated in large area using low-cost roll-to-roll manufacturing methods. However, because of the low mobility of the BHJ materials, there is competition between the sweep-out of the photogenerated carriers by the built-in potential and recombination within the thin BHJ film [12-15]. Useful film thicknesses are limited by recombination. Thus, there is a need to increase the absorption by the BHJ film without increasing film thickness. Metal nanoparticles exhibit localized surface plasmon resonances (LSPR) which couple strongly to the incident light. In addition, relatively large metallic nanoparticles can reflect and scatter the light and thereby increase the optical path length within the BHJ film. Thus, the addition of metal nanoparticles into BHJ films offers the possibility of enhanced absorption and correspondingly enhanced photo-generation of mobile carriers. In this work, we have demonstrated several positive effects of shape controlled Au and Ag nanoparticles in organic P3HT/PC70BM, PCDTBT/PC70BM, Si-PCPDTBT/PC70BM BHJ-based PV devices. The use of an optimized concentration of Au and Ag nanomaterials in the BHJ film increases Jsc, FF, and the IPCE. These improvements result from a combination of enhanced light absorption caused by the light scattering of the nanomaterials in an active layer. Some of the metals induce the plasmon light concentration at specific wavelength. Moreover, improved charge transport results in low series resistance.

• Applied Chemistry for Engineering
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• v.23 no.4
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• pp.367-371
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• 2012

Waste printed circuit boards (WPCBs) contain valuable metals such as Cu, Ni, Au, Ag, and Pd. For an effective recycling of WPCBs, it is essential to recover the valuable metals. In recent years, recycling processes have come to be necessary for separating noble metals from WPCBs due to an increasing amount of electronic device wastes. However, it is well known that glass reinforced epoxy resins in the WPCBs are difficult materials to separate into elemental components, namely metals, glass fibers and epoxy resins in the chemical recycling process. $K_3PO_4$ as a catalyst in dimethylformamide (DMF) and N-Methyl-2-pyrrolidone (NMP) was used to depolymerize epoxy resins for recovering metallic and non-metallic components from WPCBs. Reactions of WPCBs were carried out at temperatures $160{\sim}200^{\circ}C$ for 2~12 h. The recycled glass fiber from WPCBs was analyzed by thermogravimetric analyzer (TGA) and evaluated the degree of solubility of the epoxy resin for separation efficiencies of the WPCBs.

• Journal of the Korean institute of surface engineering
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• v.36 no.5
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• pp.373-378
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• 2003

With increasing environmental concerns, application of lead-free solder and fluxless soldering process have been taken attention from the electronic packaging industry. Plasma treatment is one of the soldering methods for the fluxless soldering, and it can prevent environmental pollution cased by flux. On this study fluxless soldering process under $Ar-H_2$plasma using lead free solders such as Sn-3.5 wt%Ag, Sn-3.5 wt%Ag-0.7 wt%Cu and Sn-37%Pb for a reference was investigated. As the plasma reflow has higher soldering temperature than normal air reflow, the effects of UBM(Under Bump Metallization) thickness on the interfacial reaction and bonding strength can be critical. Experimental results showed in case of the thin UBM, Au(20 nm)/Cu(0.3 $\mu\textrm{m}$)/Ni(0.4 $\mu\textrm{m}$)/Al(0.4 $\mu\textrm{m}$), shear strength of the soldered joint was relatively low as 19-27㎫, and it's caused by the crack observed along the bonded interface. The crack was believed to be produced by the exhaustion of the thin UBM-layer due to the excessive reaction with solder under plasma. However, in case of thick UBM, Au(20 nm)/Cu(4 $\mu\textrm{m}$)/Ni(4 $\mu\textrm{m}$)/Al(0.4 $\mu\textrm{m}$), the bonded interface was sound without any crack and shear strength gives 32∼42㎫. Thus, by increasing UBM thickness in this study the shear strength can be improved to 50∼70%. Fluxed reflow soldering under hot air was also carried out for a reference, and the shear strength was 48∼52㎫. Consequently the fluxless soldering with plasma showed around 65∼80% as those of fluxed air reflow, and the possibility of the $Ar-H_2$ plasma reflow was evaluated.

• Journal of the Korean Chemical Society
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• v.54 no.4
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• pp.402-410
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• 2010

New complexes cis-[$Mo_2O_5(Hapdhba)_2$], trans-[$UO_2(Hapdhba)_2$], [Pd(Hapdhba)Cl($H_2O$)], [Pd(bpy)(Hapdhba)]Cl, [Ag(bpy)(Hapdhba)], [$Ru(Hapdhba)_2(H_2O)_2$], [$Rh(Hapdhba)_2Cl(H_2O)$] and [Au(Hapdhba)$Cl_2$] are reported, where $H_2$apdhba is the Schiff-base derived from 2-aminopyrimidine and 2,4-dihydroxy benzaldehyde. The complexes were characterized by IR, electronic, $^1H$ NMR and mass spectra, conductivity, magnetic and thermal measurements. The inhibitive effect of $H_2$apdhba for the corrosion of copper in 0.5 M HCl was also determined by potentiodynamic polarization measurements.

• Journal of Welding and Joining
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• v.23 no.4
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• pp.34-40
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• 2005

There have been numerous approaches to examine the bonding strengths of solder joints. However, despite the technical and practical limitations, the precedent test methods such as the ball shear and ball pull tests are being used in industrial applications. In this study, the optimum jaw pressure with the modified protrusion jaw was introduced in order to obtain higher successful rate f3r ball pull testing. Furthermore, the pull strengths and fracture modes of Sn-8Zn-3Bi, Sn-4Ag-0.7Cu, and Sn-37Pb eutectic solder after isothermal aging tests ($100^{\circ}C,\;150^{\circ}C$), were evaluated with the protrusion jaw. The pull strength-displacement hysteresis curves and fracture surfaces were carefully investigated to evaluate the correlation between the pull strengths and the fracture modes of each solder. In conclusion, it is verified that Au-Zn IMCs (Intermetallic Compounds) have a detrimental effect on the pull strengths and changed fracture modes of Sn-8Zn-3Bi solder. Meanwhile, the microstructure transformation influences the degradation of pull strengths of Sn-4Ag-0.7Cu and Sn-37Pb solders.

• Journal of the Korean Chemical Society
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• v.54 no.2
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• pp.228-233
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• 2010

Recently, nanoparticles of gold and silver has been applied to various fields due to antimicrobial property. This study added Ag and Au nanoparticles in HEMA (2-hydroxyethylmethacrylate), NVP (N-vinyl pyrrolidone) and MMA (methylmethacrylate) and copolymerized the solution by heating at $70^{\circ}C$ for 40 minutes, $80^{\circ}C$ for 40 minutes, and finally, $100^{\circ}C$ for 40 minutes. Using the polymer produced through the copolymerization process, and measured the physical characteristics which showed water content of 28.43% ~ 35.27%, refractive index of 1.429 ~ 1.440, visible transmittance of 79.2% ~ 86.5% and tensile strength of 0.125 kgf ~ 0.201 kgf. We judged that we made the copolymer with antimicrobial and physical properties which is suitable for conventional contact lens.