• Economic and Environmental Geology
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• v.23 no.1
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• pp.1-9
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• 1990

A couple of Au-Ag-bearing epithermal quartz veins of Cretaceous(87.9Ma) in age are developed in the Cretaceous(112Ma) granodiorite batholith which was emplaced in Mesozoic Baegyari sedimentary formation. Au minerals consist mostly of electrum with a 54.2-61.9 wt% Au and are closely associated with sulfide minerals including pyrite, chalcopyrite, pyrrhotite, galena and sphalerite. Homogenization temperatures of fluid inclusions in quartz, fluorite and calcite are $196-368^{\circ}C$ (avg. $240^{\circ}C$), $74-176^{\circ}C$ (avg. $115^{\circ}C$) and $75-200^{\circ}C$ (avg. $119^{\circ}C$) respectively. Sulfur isotopic compositions( +5- +8‰) of ore sulfides indicate a deep-seated sulfur origin. Oxygen isotope compositions of different stages of quartz vary from +5.6 to +9.3‰ and calculated ${\delta}^{18}O$ values of ore fluid at $250^{\circ}C$ range from -3.2 to +0.4‰, reflecting an isotopically evolved ore fluid mixed with a $^{18}O$ depleted meteoric water under the variable mixing ratios between hydrothermal and meteoric waters. Isotopic data of calcite minerals support the above conclusions.

• Corrosion Science and Technology
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• v.4 no.1
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• pp.19-22
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• 2005

Two Au-Ag-Cu-Pd dental casting alloys (Au:12% and 20%) used. The test solutions used 0.9 % NaCl solution (isotonic sodium chloride solution), 0.9 % NaCl solution containing 1 % lactic acid, and 0.9 % NaCl solution containing 1 % lactic acid and 0.1 mol $dm^{-3}$ $Na_2S$. The surface of two samples in three sample solutions was not natural discoloration during one year. The alloy containing 12 % gold was easily alloyed and the composition was uniform comparing with the alloy containing 20 % gold. The rest potentials have not a little effect after three months. The kinds of metals could not definitely from the oxidation and reduction waves of metal on the cyclic voltammograms. The dissolutions of gold and palladium were 12 % Au sample in the 0.9 % NaCl solution containing 1 % lactic acid and 0.1 mol $dm^{-3}$ $Na_{2}S$. The pH of solution had an affect on dissolution of copper, and sulfur ion had an affect on dissolution of silver. The copper dissolved amount from 20 % gold sample was about 26 times comparing with that of 12 % gold sample in the 0.9 % solution containing 1 % lactic acid. Corrosion products were silver chloride and copper chloride in NaCl solution, and silver sulfide and copper sulfide in NaCl solution containing $Na_{2}S$.

• Advances in materials Research
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• v.1 no.1
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• pp.1-12
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• 2012

There have been many efforts on the generating metal nanocrystals enclosed by high-index facets for the use as highly active catalysts. This paper describes a facile synthesis of Au trisoctahedra with high-index facets. In brief, the Au trisoctahdra were prepared by reduction of $HAuCl_4$ in N,N-dimethylformamide (DMF) containing poly (vinyl pyrrolidone) (PVP) and trace amount of $AgNO_3$. The Ag ions in the reaction solution played a critical role in controlling the trisoctahedral shape of the final product by underpotential deposition (UPD) on the Au surfaces. The as-prepared Au trisoctahedra were single crystal and enclosed by high-index {441}, {773} and {331} facets.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.348-348
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• 2011

We present the interfacial electronic structures of electrodeposited Cu and Fe on bare and 1,4-phenylene diisocyanide (PDI)-functionalized Au nanoisland templates (NITs), and Au and Ag nanoparticles on transition metal oxide supports. Our discussion is based on the depth-profiling X-ray photoelectron spectroscopy (XPS) and scanning electron microscopy (SEM).

• Journal of the Korean institute of surface engineering
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• v.35 no.1
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• pp.11-16
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• 2002

As environmental concerns increasing, the electronics industry is focusing more attention on lead free solder alternatives. In this research, we have researched wettability of intermediate solder of Sn3Ag9Bi5In, which include In and Bi and has similar melting temperature to Sn37Pb eutectic solder. We investigated the wetting property of Sn3Ag9Bi5In. To estimate wettability of Sn3Ag9Bi5In solder on various substrates, the wettability of Sn3Ag9Bi5In solder on high-pure Cu-coupon was measured. Cu-coupon that plated Sn, Ni and Au/Ni and Si-wafer adsorbed Ni/Cu under bump metallurgy on one side. As a result, the wetting property of Sn3Ag9Bi5In solder is a little better than that of Sn37Pb and Sn3.5Ag.

• Journal of the Korean Vacuum Society
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• v.13 no.3
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• pp.127-131
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• 2004

Package reliability test was conducted to investigate the effect of solder composition on the ball fatigue strength for BGA (Ball Grid Array) packaging. The test pieces are assembled using eutectic composition 63Sn/37Pb, 62Sn/36Pb/2Ag, and 63Sn/34.4Pb/2Ag/0.5Sb solder after pre-conditioning at MRT Lv 3 (Moisture Resistance Test Level) and then conducted under T/C (Temperature Cycle test). For each case, the ball shear strength was obtained and micro structure photos were taken. SEM (scanning electron microscope) and EDX (Energy Dispersive X-ray) were used to the analyze failure mechanism. The growth rate of Au-Sn intermetallic compound in Sn63Pb34.5Ag2Sb0.5 solder was slow when compared to 63Sn/37Pb solder and 62Sn/36Pb/2Ag solder. The degradation of shear strength of solder balls caused by solder composition was discussed.

• Journal of Welding and Joining
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• v.29 no.5
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• pp.90-94
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• 2011

Ag metallic particles from nano-scale to submicron-scale are combined with organic solvent to provide fine circuits and interconnection. Ink-jet printing with Ag nano particle inks demonstrated the potentials of the new printed electronics technology. The bonding at the interface between the Ag wiring layer and the various substrates is very important. In this study, the details of interfaces in Ag wiring are investigated primarily by microstructure observation. By adjusting the materials and sintering conditions, nicely formed interfaces between Ag wiring and Cu, Au or organic substrates are achieved. In contrast, transmission electron microscope (TEM) image clearly shows interface debonding between Ag wiring and Sn substrate. Sn oxides are formed on the surface of the Sn plating. The formation of these is a root cause of the interface debonding.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.08a
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• pp.126-126
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• 2011

수직으로 정렬된 1차원 ZnO nanorod arrays (NRAs)는 효율적인 반사방지 특성의 기하학적 구조를 갖고 있어, 크기와 모양 그리고 정렬형태의 다양한 설계를 통해 빛의 흡수율과 광 추출효율을 증가시켜 광전소자 및 태양광 소자의 성능을 향상시킬 수 있으며, 최근 이러한 연구에 대한 관심이 집중되고 있다. 본 연구에서는 ZnO NRAs의 넓은 표면적과 불연속적인 독특한 표면을 활용하여 광학적 특성을 효과적으로 개선하였다. 실험을 위해, thermal evaporator를 사용하여 Au와 Ag 그리고 e-beam evaporator를 사용하여 $SiO_2$를 ZnO NRAs 표면에 여러 가지 조건으로 증착하여, 독특한 계층 나노구조의 형성과 광학적 특성을 관찰하였다. 표면 roughness가 큰 FTO/glass 위에 수열합성법을 통해 끝이 뾰족하고, 비스듬히 정렬된 ZnO nano-tip array에 Au를 증착할 경우 ZnO/Au core/shell 구조가 형성되며, Au의 광 흡수율이 매우 크게 증가함을 관찰할 수 있었다. 반면 flat한 표면위에 빽빽하게 수직으로 정렬된 ZnO NRAs를 성장시켜 그 위에 Ag를 증착할 경우, evaporated Ag flux가 ZnO nanorod의 사이에 scattered 되어 ZnO nanorod 기둥의 측면에 직경이 50 nm 이하인 nanoparticles이 decorated 되어 국소표면플라즈몬 현상이 관찰되었으며, 이러한 효과를 통해 입사되는 빛의 흡수율을 효과적으로 증가시킬 수 있었다. 또한, ZnO NRAs의 표면에 $SiO_2$를 e-beam evaporator를 이용하여 증착할 경우, 자연적으로 vapor flux와 ZnO nanorod 사이에 oblique angle이 $80^{\circ}$ 이상으로 증가하여 $SiO_2$ nanorods가 자발적으로 형성되어 ZnO/$SiO_2$ branch 계층형태의 나노구조를 제작할 수 있었다. 이러한 구조는 유효 graded refractive index profile로 인해 기존의 ZnO NRAs보다 개선된 반사방지 특성을 나타냈다. 이러한 계층 나노구조의 광학적 특성을 시뮬레이션을 통해 이론적으로 분석을 통해 광전자 소자의 성능의 개선에 대한 적용 가능성을 조사하였다.

• Korean Journal of Dental Materials
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• v.43 no.4
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• pp.317-322
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• 2016

The effect of ice-quenching after degassing on the hardness change during simulated porcelain firing in a metal-ceramic Pd-Au-Ag alloy was investigated by means of hardness test, field emission scanning electron microscopic observations, and X-ray diffraction analysis. The hardness decreased by ice-quenching after degassing, which was induced by the homogenization of the ice-quenched specimen. The decreased hardness by ice-quenching after degassing was recovered from the 1st opaque stage which was the first stage of the remaining firing process for bonding porcelain. The microstructural change showed that the increase in hardness during the remaining firing process was caused by precipitation. The ice-quenching after degassing did not affect the hardness change during the subsequent porcelain firing process.

• Proceedings of the Korean Vacuum Society Conference
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• 1994.02a
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• pp.55-56
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• 1994