• Title/Summary/Keyword: Atomic layer deposition

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Epitaxial Growth of BSCCO Type Structure in Atomic Layer by Layer Deposition

  • Yang, Sung-Ho;Park, Yong-Pil;Jang, Kyung-Uk;Oh, Geum-Gon;Lee, Joon-Ung
    • Proceedings of the Korean Institute of Navigation and Port Research Conference
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    • 2000.11a
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    • pp.97-100
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    • 2000
  • Si$_2$Sr$_2$CuO$\sub$x/(Bi(2201)) thin films are fabricated by atomic layer by layer deposition using ion beam sputtering(IBS) method. During the deposition, 10 %-ozone/oxygen mixture gas of typical 5.0 ${\times}$ 10$\^$-5/ Torr is applied with ultraviolet light irradiation for oxidation. XRD and RHEED investigations reveal out that a buffer layer with some different compositions is formed at the early deposition stage of less than 10 units cell and then c-axis oriented Bi(2201) is grown.

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Epitaxial Growth of BSCCO Type Structure in Atomic Layer by Layer Deposition by Ion Beam Sputtering

  • Lee, Hee-Kab;Park, Yong-Pil;Kim, Jeong-Ho
    • Transactions on Electrical and Electronic Materials
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    • v.1 no.4
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    • pp.7-10
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    • 2000
  • Bi$_2$Sr$_2$CuI$\_$x/(Bi(2001)) thin films are fabricated by atomic layer by layer deposition using ion beam sputtering(IBS) method. During the deposition , 10 %-ozone/oxygen mixture gas of typical 25.0$\times$10$\^$-5/ Torr is applied with ultraviolet light irradiation for oxidation. XRD and RHEED investigations reveal out that a buffer layer with some different compositions is formed at the early deposition stage of less then 10 units cell and then c-axis oriented Bi(2201) is grown.

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Epitaxial Growth of BSCCO Type Structure in Atomic Layer by Layer Deposition

  • Yang, Sung-Ho;Park, Yong-Pil;Jang, Kyung-Uk;Oh, Geum-Gon;Lee, Joon-Ung
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
    • /
    • 2000.11a
    • /
    • pp.97-100
    • /
    • 2000
  • Bi$_2$Sr$_2$CuO$\sub$x/(Bi(2201)) thin films are fabricated by atomic layer by layer deposition using ion beam sputtering(IBS) method. During the deposition, 10 %-ozone/oxygen mixture gas of typical 5.0 ${\times}$ 10$\^$-5/. Torr is applied with ultraviolet light irradiation for oxidation. XRD and RHEED investigations reveal out that a buffer layer with some different compositions is formed at the early deposition stage of less than 10 units cell and then c-axis oriented Bi(2201) is grown.

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The Influence of Deposition Temperature of ALD n-type Buffer ZnO Layer on Device Characteristics of Electrodeposited Cu2O Thin Film Solar Cells (ALD ZnO 버퍼층 증착 온도가 전착 Cu2O 박막 태양전지 소자 특성에 미치는 영향)

  • Cho, Jae Yu;Tran, Man Hieu;Heo, Jaeyeong
    • Current Photovoltaic Research
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    • v.6 no.1
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    • pp.21-26
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    • 2018
  • Beside several advantages, the PV power generation as a clean energy source, is still below the supply level due to high power generation cost. Therefore, the interest in fabricating low-cost thin film solar cells is increasing continuously. $Cu_2O$, a low cost photovoltaic material, has a wide direct band gap of ~2.1 eV has along with the high theoretical energy conversion efficiency of about 20%. On the other hand, it has other benefits such as earth-abundance, low cost, non-toxic, high carrier mobility ($100cm^2/Vs$). In spite of these various advantages, the efficiency of $Cu_2O$ based solar cells is still significantly lower than the theoretical limit as reported in several literatures. One of the reasons behind the low efficiency of $Cu_2O$ solar cells can be the formation of CuO layer due to atmospheric surface oxidation of $Cu_2O$ absorber layer. In this work, atomic layer deposition method was used to remove the CuO layer that formed on $Cu_2O$ surface. First, $Cu_2O$ absorber layer was deposited by electrodeposition. On top of it buffer (ZnO) and TCO (AZO) layers were deposited by atomic layer deposition and rf-magnetron sputtering respectively. We fabricated the cells with a change in the deposition temperature of buffer layer ranging between $80^{\circ}C$ to $140^{\circ}C$. Finally, we compared the performance of fabricated solar cells, and studied the influence of buffer layer deposition temperature on $Cu_2O$ based solar cells by J-V and XPS measurements.

Characteristics of Hafnium Silicate Films Deposited on Si by Atomic Layer Deposition Process

  • Lee, Jung-Chan;Kim, Kwang-Sook;Jeong, Seok-Won;Roh, Yong-Han
    • Transactions on Electrical and Electronic Materials
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    • v.12 no.3
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    • pp.127-130
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    • 2011
  • We investigated the effects of $O_2$ annealing (i.e., temperature and time) on the characteristics of hafnium silicate ($HfSi_xO_y$) films deposited on a Si substrate by atomic layer deposition process (ALD). We found that the post deposition annealing under oxidizing ambient causes the oxidation of residual Hf metal components, resulting in the improvement of electrical characteristics (e.g., hysteresis window and leakage current are decreased). In addition, we observed the annealing temperature is more important than the annealing time for post deposition annealing. Based on these observations, we suggest that post deposition annealing under oxidizing ambient is necessary to improve the electrical characteristics of $HfSi_xO_y$ films deposited by ALD. However, the annealing temperature has to be carefully controlled to minimize the regrowth of interfacial oxide, which degrades the value of equivalent oxide thickness.

Electrochemical Performance of High-Voltage Lithium-Ion Batteries with NCM Cathode Varying the Thickness of Coating Layer by Atomic Layer Deposition (Atomic Layer Deposition의 두께 변화에 따른 NCM 양극에서의 고전압 리튬 이온 전지의 전기화학적 특성 평가)

  • Im, Jinsol;Ahn, Jinhyeok;Kim, Jungmin;Sung, Shi-Joon;Cho, Kuk Young
    • Journal of the Korean Electrochemical Society
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    • v.22 no.2
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    • pp.60-68
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    • 2019
  • High-voltage operation of the lithium ion battery is one of the advantageous approaches to obtain high energy capacity without changing the conventional cell components and structure. However, operating at harsh condition inevitably results in severe side reactions at the electrode surface and structural disintegration of active material particles. Herein we coated layers composed of $Al_2O_3$ and ZnO on the electrode based on NCM using atomic layer deposition (ALD). Thicker layers of novel Al-doped ZnO (AZO) coating compared to conventional ALD coated layers are prepared. Cathode based on NCM with the varying AZO coating thickness are fabricated and used for coin cell assembly. Effect of ALD coating thickness on the charge-discharge cycle behavior obtained at high-voltage operation was investigated.