• Proceedings of the KWS Conference
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• 2009.11a
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• pp.75-75
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• 2009

연성회로기판은 일반적으로 절연체를 이루는 폴리이미드와 전도체를 이루는 구리로 구성되어 있다. 폴리이미드는 뛰어난 열적 화학적 안정성, 기계적 특성, 공정성 등의 장점으로 인해 연성회로기판의 절연체로서 제안되었지만 전도체를 이루는 구리와의 접합 특성이 우수하지 않기 때문에 많은 연구가 현재까지 진행되고 있고, 그 결과 연성회로기판의 접합 특성에 많은 개선이 이루어짐과 동시에 다양한 공정 방법이 제안되고 있다. 하지만 고온다습한 환경에서 사용될 경우 폴리이미드의 높은 흡습성과, 구리와 seed layer의 산화 문제로 인해 접합 특성이 저하된다는 단점 또한 가지고 있다. 따라서 본 연구를 통해 고온다습한 조건하에서 seed layer가 80Ni/20Cr 합금으로 구성된 연성회로기판의 seed layer의 두께와 시효시간으로 인해 발생하는 접합 신뢰성의 차이를 관찰하였다. 본 연구에서는 두께 $25{\mu}m$의 폴리이미드 위에 각각 100, 200, $300{\AA}$ 두께의 80Ni/20Cr의 합금 조성을 가지는 seed layer를 스퍼터링 공정을 통해 형성한 후 전해도금법을 이용하여 $8{\mu}m$ 두께의 구리 전도층을 형성하였다. 접합 특성 평가를 위해 ICP 규격에 따라 전도층 패턴을 폭 3.2mm, 길이 230mm로 시편을 제작하여 50.8mm/min의 이송 속도로 각 시편당 8회의 $90^{\circ}$ peel test를 실시하였다. 또한 $85^{\circ}C$/85% 항온항습 조건하에서 각각 24, 72, 120, 168시간 동안 시효 처리 후 같은 방법으로 연성회로기판의 접합 특성을 평가하였다. 파면의 형상과 조성을 분석하기 위해 SEM (Scanning electron microscope)과 EDS (Energy-dispersive X-ray spectroscopy)를 사용하였으며, 파면의 조도 측정을 위해 AFM (Atomic force microscope)을 사용하였다. 또한 파면의 잔여물 분석을 위해 EPMA (Energy probe microanalysis)를 사용하였고 계면의 화학적 결합상태를 분석하기 위해 XPS (X-ray photoelectron spectroscopy)를 통해 파면을 분석하였다.

• Applied Chemistry for Engineering
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• v.18 no.4
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• pp.356-360
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• 2007

Recently, dye sensitized solar cells (DSSCs) composed of nanoporous $TiO_2$, light-sensitive dyes, electrolytes, and counter electrode have been received much attention. Nanostructured particles with higher surface area for the higher adsorption of Ru (II) dye are required to increase the quantity of light absorption. Also, it has been reported that the key factor to achieve high energy conversion efficiency in the photoelectrode of DSSC is the heat treatment of $TiO_2$ paste with acid addition. In this work, we investigated the influence of acid treatment of $TiO_2$ solar cell on the photovoltaic performance of DSSC. The working electrodes fabricated in this work were characterized by X-ray photoelectron spectroscopy (XPS), extended X-ray absorption fine structure (EXAFS), field emission scanning electron microscope (FE-SEM), and atomic force microscope (AFM). In addition, the influence of nanostructured photoelectrode fabricated with the acid-treated paste on the energy conversion efficiency was investigated on the basis of photocurrent-potential curves. It was found that the influence of acid-treated paste on the photovoltaic efficiency was significant.

• Journal of the Korean Magnetics Society
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• v.16 no.4
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• pp.221-227
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• 2006

We have synthesized uniform nanometer sized magnetite particles using chemical coprecipitation technique through a sonochemical method with surfactant such as oleic acid. Magnetite phase nanoparticles could be observed from X-ray diffraction. Magnetite nanoparticles is surface phase morphology and biopolymer-microspheres for Application Medical. Magnetite nanoparticles coated biopolymer. Atomic Force Microscope (AFM) was used to image the coated nanoparticles. Magnetic colloid suspensions containing particles with sodium oleate, chitosan and $\beta$-glucan have been prepared. The morphology of the magnetic biopolymer microsphere particles were characterized using optical microscope. Magnetic hysteresis measurement were performed using a superconducting quantum interference device (SQUID) magnetometer at room temperature to investigate the magnetic properties of the biopolymer microspheres and magnetite coated biopolymer including magnetite nanoparticles. Magnetic Resonance (MR) imaging was used to investigate biopolymer coated nanoparticles and biopolymer microspheres.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.20 no.5
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• pp.227-231
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• 2010

Super hydrophilic $TiO_2$ thin films with photocatalytic property were successfully fabricated on a glass substrate by liquid phase deposition (LPD). The $TiO_2$ thin film formed nano particles on a surface at $70^{\circ}C$. As an immersion time in $TiF_4$ solution increased, the thickness of thin films gradually increased. $TiO_2$ thin film showed a water contact angel of below ca. $5^{\circ}$ and the transmittance of ca. 75~90 % in visible range. In addition, $TiO_2$ thin film showed the photocatalytic property to decompose methyl orange solution by the illumination of UV light. The surface morphologies, optical properties and contact angel of prepared thin films with a different immersion time were measured by field emission scanning electron microscope (FE-SEM), atomic force microscope (AFM), UV-Vis spectrophotometer and contact angle meter.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.406-406
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• 2010

일반적으로, 나노스케일의 MOS 소자에서는 게이트 절연체 두께가 감소함에 따라 tunneling effect의 증가로 인해 PID (plasma induced damage)로 인한 소자 특성 저하 현상을 감소하는 추세로 알려져 있다. 하지만 요즘 많이 사용되고 있는 high-k 게이트 절연체의 경우에는 오히려 더 많은 charge들이 trapping 되면서 PID가 오히려 더 심각해지는 현상이 나타나고 있다. 이러한 high-k 게이트 식각 시 현재는 주로 Hf-based wet etch나 dry etch가 사용되고 있지만 gate edge 영역에서 high-k 게이트 절연체의 undercut 현상이나 PID에 의한 소자특성 저하가 보고되고 있다. 본 연구에서는 이에 차세대 MOS 소자의 gate stack 구조중 issue화 되고 있는 metal gate 층과 gate dielectric 층의 식각공정에 각각 중성빔 식각과 중성빔 원자층 식각을 적용하여 전기적 손상 없이 원자레벨의 정확한 식각 조절을 해줄 수 있는 새로운 two step 식각 공정에 대한 연구를 진행하였다. 먼저 TiN metal gate 층의 식각을 위해 HBr과 $Cl_2$ 혼합가스를 사용한 중성빔 식각기술을 적용하여 100 eV 이하의 에너지 조건에서 하부층인 $HfO_2$와 거의 무한대의 식각 선택비를 얻었다. 하지만 100 eV 조건에서는 낮은 에너지에 의한 빔 스케터링으로 실제 패턴 식각시 etch foot이 발생되는 현상이 관찰되었으며, 이를 해결하기 위하여 먼저 높은 에너지로 식각을 진행하고 $HfO_2$와의 계면 근처에서 100 eV로 식각을 해주는 two step 방법을 사용하였다. 그 결과 anistropic 하고 하부층에 etch stop된 식각 형상을 관찰할 수 있었다. 다음으로 3.5nm의 매우 얇은 $HfO_2$ gate dielectric 층의 정확한 식각 깊이 조절을 위해 $BCl_3$와 Ar 가스를 이용한 중성빔 원자층 식각기술을 적용하여 $1.2\;{\AA}$/cycle의 단일막 식각 조건을 확립하고 약 30 cycle 공정시 3.5nm 두께의 $HfO_2$ 층이 완벽히 제거됨을 관찰할 수 있었다. 뿐만 아니라, vertical 한 식각 형상 및 향상된 표면 roughness를 transmission electron microscope(TEM)과 atomic force microscope (AFM)으로 관찰할 수 있었다. 이러한 중성빔 식각과 중성빔 원자층 식각기술이 결합된 새로운 gate recess 공정을 실제 MOSFET 소자에 적용하여 기존 식각 방법으로 제작된 소자 결과를 비교해 본 결과 gate leakage current가 약 one order 정도 개선되었음을 확인할 수 있었다.

• Journal of the korean academy of Pediatric Dentistry
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• v.49 no.2
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• pp.140-148
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• 2022

This study aimed to evaluate the effect of silver diamine fluoride (SDF) and potassium iodide (KI) on the formation of cariogenic biofilm and surface roughness in vitro. A total of 48 bovine dentin specimens with artificially induced caries were prepared and divided into 3 groups of 16: untreated control, SDF-treated, and SDF-treated followed by KI (SDFKI). Ten specimens from each group were used to observe microbial adhesion. Multispecies cariogenic biofilms including Streptococcus mutans, Lactobacillus casei, and Candida albicans were cultured on the specimens. Microbes were cultured for 24 hours, and the colony-forming unit was calculated. The remaining specimens were observed by atomic force microscope and scanning electron microscope (SEM). The number of bacteria was significantly lower in the SDF and SDFKI groups. KI did not inhibit the antibacterial activity of SDF significantly. SEM images showed particles generated after SDF and SDFKI application were deposited on the dentin, but there was no significant difference in surface roughness between the 3 groups. This study confirmed that SDF and SDFKI application did not have a significant effect on the surface roughness of dentin, but effectively inhibited the formation of the early cariogenic bacterial film after 24 hours compared to the control.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.477-477
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• 2008

For more than three decades, the gate dielectrics in CMOS devices are $SiO_2$ because of its blocking properties of current in insulated gate FET channels. As the dimensions of feature size have been scaled down (width and the thickness is reduced down to 50 urn and 2 urn or less), gate leakage current is increased and reliability of $SiO_2$ is reduced. Many metal oxides such as $TiO_2$, $Ta_2O_4$, $SrTiO_3$, $Al_2O_3$, $HfO_2$ and $ZrO_2$ have been challenged for memory devices. These materials posses relatively high dielectric constant, but $HfO_2$ and $Al_2O_3$ did not provide sufficient advantages over $SiO_2$ or $Si_3N_4$ because of reaction with Si substrate. Recently, $HfO_2$ have been attracted attention because Hf forms the most stable oxide with the highest heat of formation. In addition, Hf can reduce the native oxide layer by creating $HfO_2$. However, new gate oxide candidates must satisfy a standard CMOS process. In order to fabricate high density memories with small feature size, the plasma etch process should be developed by well understanding and optimizing plasma behaviors. Therefore, it is necessary that the etch behavior of $HfO_2$ and plasma parameters are systematically investigated as functions of process parameters including gas mixing ratio, rf power, pressure and temperature to determine the mechanism of plasma induced damage. However, there is few studies on the the etch mechanism and the surface reactions in $BCl_3$ based plasma to etch $HfO_2$ thin films. In this work, the samples of $HfO_2$ were prepared on Si wafer with using atomic layer deposition. In our previous work, the maximum etch rate of $BCl_3$/Ar were obtained 20% $BCl_3$/ 80% Ar. Over 20% $BCl_3$ addition, the etch rate of $HfO_2$ decreased. The etching rate of $HfO_2$ and selectivity of $HfO_2$ to Si were investigated with using in inductively coupled plasma etching system (ICP) and $BCl_3/Cl_2$/Ar plasma. The change of volume densities of radical and atoms were monitored with using optical emission spectroscopy analysis (OES). The variations of components of etched surfaces for $HfO_2$ was investigated with using x-ray photo electron spectroscopy (XPS). In order to investigate the accumulation of etch by products during etch process, the exposed surface of $HfO_2$ in $BCl_3/Cl_2$/Ar plasma was compared with surface of as-doped $HfO_2$ and all the surfaces of samples were examined with field emission scanning electron microscopy and atomic force microscope (AFM).

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2000.11a
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• pp.3-4
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• 2000

Many researchers are interested in the synthesis and characterization of carbon nitride and diamond-like carbon (DLq because they show excellent mechanical properties such as low friction and high wear resistance and excellent electrical properties such as controllable electical resistivity and good field electron emission. We have deposited amorphous carbon nitride (a-C:N) thin films and DLC thin films by shielded arc ion plating (SAIP) and evaluated the structural and tribological properties. The application of appropriate negative bias on substrates is effective to increase the film hardness and wear resistance. This paper reports on the deposition and tribological OLC films in relation to the substrate bias voltage (Vs). films are compared with those of the OLC films. A high purity sintered graphite target was mounted on a cathode as a carbon source. Nitrogen or argon was introduced into a deposition chamber through each mass flow controller. After the initiation of an arc plasma at 60 A and 1 Pa, the target surface was heated and evaporated by the plasma. Carbon atoms and clusters evaporated from the target were ionized partially and reacted with activated nitrogen species, and a carbon nitride film was deposited onto a Si (100) substrate when we used nitrogen as a reactant gas. The surface of the growing film also reacted with activated nitrogen species. Carbon macropartic1es (0.1 -100 maicro-m) evaporated from the target at the same time were not ionized and did not react fully with nitrogen species. These macroparticles interfered with the formation of the carbon nitride film. Therefore we set a shielding plate made of stainless steel between the target and the substrate to trap the macropartic1es. This shielding method is very effective to prepare smooth a-CN films. We, therefore, call this method "shielded arc ion plating (SAIP)". For the deposition of DLC films we used argon instead of nitrogen. Films of about 150 nm in thickness were deposited onto Si substrates. Their structures, chemical compositions and chemical bonding states were analyzed by using X-ray diffraction, Raman spectroscopy, X-ray photoelectron spectroscopy and infrared spectroscopy. Hardness of the films was measured with a nanointender interfaced with an atomic force microscope (AFM). A Berkovich-type diamond tip whose radius was less than 100 nm was used for the measurement. A force-displacement curve of each film was measured at a peak load force of 250 maicro-N. Load, hold and unload times for each indentation were 2.5, 0 and 2.5 s, respectively. Hardness of each film was determined from five force-displacement curves. Wear resistance of the films was analyzed as follows. First, each film surface was scanned with the diamond tip at a constant load force of 20 maicro-N. The tip scanning was repeated 30 times in a 1 urn-square region with 512 lines at a scanning rate of 2 um/ s. After this tip-scanning, the film surface was observed in the AFM mode at a constant force of 5 maicro-N with the same Berkovich-type tip. The hardness of a-CN films was less dependent on Vs. The hardness of the film deposited at Vs=O V in a nitrogen plasma was about 10 GPa and almost similar to that of Si. It slightly increased to 12 - 15 GPa when a bias voltage of -100 - -500 V was applied to the substrate with showing its maximum at Vs=-300 V. The film deposited at Vs=O V was least wear resistant which was consistent with its lowest hardness. The biased films became more wear resistant. Particularly the film deposited at Vs=-300 V showed remarkable wear resistance. Its wear depth was too shallow to be measured with AFM. On the other hand, the DLC film, deposited at Vs=-l00 V in an argon plasma, whose hardness was 35 GPa was obviously worn under the same wear test conditions. The a-C:N films show higher wear resistance than DLC films and are useful for wear resistant coatings on various mechanical and electronic parts.nic parts.

• Journal of the Korean Vacuum Society
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• v.22 no.6
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• pp.313-320
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• 2013

The $AlAs_xSb_{1-x}$ step-graded buffer (SGB) layer was grown on the Silicon (Si) substrate to overcome lattice mismatch between Si substrate and $Al_{0.3}Ga_{0.7}As$/GaAs multiple quantum wells (MQWs). The value of root-mean-square (RMS) surface roughness for 5 nm-thick GaAs grown on $AlAs_xSb_{1-x}$ step-graded buffer layer was ~1.7 nm. $Al_{0.3}Ga_{0.7}As$/GaAs MQWs with AlAs/GaAs short period superlattice (SPS) were formed on the $AlAs_xSb_{1-x}$/Si substrate. Photoluminescence (PL) peak at 10 K for the $Al_{0.3}Ga_{0.7}As$/GaAs MQW structure showed relatively low intensity at ~813 nm. The RMS surface roughness of the $Al_{0.3}Ga_{0.7}As$/GaAs MQW structure was ~42.9 nm. The crystal defects were observed on the cross-sectional transmission electron microscope (TEM) images of the $Al_{0.3}Ga_{0.7}As$/GaAs MQW structure. The decrease of PL intensity and increase of RMS surface roughness would be due to the formation of the crystal defects.

• The korean journal of orthodontics
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• v.40 no.5
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• pp.294-303
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• 2010

Objective: This study was designed to measure the surface roughness at the slot floor of various ceramic brackets. Methods: One kind of stainless steel bracket ($Succes^{(R)}$), two kinds of monocrystalline brackets (Inspire $Ice^{(R)}$, $Perfect^{(R)}$) and two kinds of polycrystalline brackets (Crystalline $V^{(R)}$, $Invu^{(R)}$) were examined. Atomic force microscopy (AFM) was used to measure the surface roughness of each bracket. Data acquisition and processing were performed using $SPIP^{TM}$. Results: The differences in values of Sa, Sq, and Sz in $Invu^{(R)}$ and Inspire $Ice^{(R)}$ were not statistically different from the control group $Succes^{(R)}$. The values of Sa, Sq, and Sz of $Perfect^{(R)}$ and Crystalline $V^{(R)}$ were greater than those of $Succes^{(R)}$. Differences of all the Sa, Sq, and Sz values between $Perfect^{(R)}$ and Crystalline $V^{(R)}$ were not statistically significant. Conclusions: It is concluded that the slot surfaces of $Succes^{(R)}$, Inspire $Ice^{(R)}$, and $Invu^{(R)}$ were smooth compared to those of Crystalline $V^{(R)}$ and $Perfect^{(R)}$.