• Nuclear Engineering and Technology
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• v.41 no.6
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• pp.821-830
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• 2009

In this paper, modal testing and finite element modeling results to identify the modal parameters of a nuclear fuel rod as well as its cladding tube are discussed. A vertically standing full-size cladding tube and a fuel rod with lead pellets were used in the modal testing. As excessive flow-induced vibration causes a failure in fuel rods, such as fretting wear, the vibration level of fuel rods should be low enough to prevent failure of these components. Because vibration amplitude can be estimated based on the modal parameters, the dynamic characteristics must be determined during the design process. Therefore, finite element models are developed based on the test results. The effect of a lumped mass attached to a cladding tube model was identified during the finite element model optimization process. Unlike a cladding tube model, the density of a fuel rod with pellets cannot be determined in a straightforward manner because pellets do not move in the same phase with the cladding tube motion. The density of a fuel rod with lead pellets was determined by comparing natural frequency ratio between the cladding tube and the rod. Thus, an improved fuel rod finite element model was developed based on the updated cladding tube model and an estimated fuel rod density considering the lead pellets. It is shown that the entire pellet mass does not contribute to the fuel rod dynamics; rather, they are only partially responsible for the fuel rod dynamic behavior.

• Proceedings of the Korean Society of Propulsion Engineers Conference
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• 2011.11a
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• pp.898-903
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• 2011

Units assembled in the liquid-propellant propulsion system of launch vehicles should guarantee their on- and off-design performances under the various environments as well as at the various operation modes for the launch preparation and flight of launch vehicles. Units of liquid-propellant propulsion system can be installed in launch vehicle to insert satellite(s) into target orbit(s) only under the condition that all units must pass a series of tests to confirm whether those units perform normally as designed under the environment, which may be occurred in such stages of all development and operations as development, qualification, acceptance, assembly, pre-launch preparation, launch, and flight, and whether those units have been developed according to design requirements. Requirements for such tests have been already prepared in the advanced countries in launch vehicle systems based on experiences for decades. In Korea, where is now pursuing the development of KSLV-II, the research and development of launch vehicles using liquid-propellant propulsion system have been undergone during over 10 years. Hence test requirements for the development of units consisting of liquid-propellant propulsion system should be defined and Koreanized according to the domestic environment and circumstances and based on the experiences accumulated. In this paper requirements for the tests of units in liquid-propellant propulsion system, which can be feasible domestically, have been reviewed and defined.

• Korean Journal of Materials Research
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• v.22 no.9
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• pp.454-458
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• 2012

Various adhesive materials are used in flip chip packaging for electrical interconnection and structural reinforcement. In cases of COF(chip on film) packages, low temperature bonding adhesive is currently needed for the utilization of low thermal resistance substrate films, such as PEN(polyethylene naphthalate) and PET(polyethylene terephthalate). In this study, the effects of anhydride and dihydrazide hardeners on the low-temperature snap cure behavior of epoxy based non-conductive pastes(NCPs) were investigated to reduce flip chip bonding temperature. Dynamic DSC(differential scanning calorimetry) and isothermal DEA(dielectric analysis) results showed that the curing rate of MHHPA(hexahydro-4-methylphthalic anhydride) at $160^{\circ}C$ was faster than that of ADH(adipic dihydrazide) when considering the onset and peak curing temperatures. In a die shear test performed after flip chip bonding, however, ADH-containing formulations indicated faster trends in reaching saturated bond strength values due to the post curing effect. More enhanced HAST(highly accelerated stress test) reliability could be achieved in an assembly having a higher initial bond strength and, thus, MHHPA is considered to be a more effective hardener than ADH for low temperature snap cure NCPs.

• Journal of the Korean Society for Precision Engineering
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• v.27 no.5
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• pp.56-62
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• 2010

This paper presents the development process of roof carrier assembly using a one side release system for a vehicle. An RV(Recreational Vehicle) or SUV(Sports Utility Vehicle) has a roof carrier system on an upper surface of a roof panel for loading large or long size baggage. Such a roof carrier system is comprised of a roof rack longitudinally mounted on a roof panel and cross bar perpendicularly installed in the horizontal direction. Several locking mechanisms used in most vehicle roof carrier systems are composed with both side releasable locking ones. The obvious drawback to this arrangement is that when the user desires to reposition the cross bar, first one of the locking members must be unlocked and then the user must walk around to the opposite side of the vehicle to unlock the other member. In this paper, we proposed a newly locking mechanism, which allows a user simultaneously place both locking members of the roof carrier in locked and unlocked positions. In order to estimate design compatibility, structural and modal analysis is performed. Furthermore, a prototype based on the proposed design has been made, and then durability test carried out. From the simulation and experimental results, the proposed roof carrier system is proved effective and safe.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.35 no.4
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• pp.363-368
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• 2007

Lithium-ion batteries providing high gravimetric energy density are rapidly replacing Ni-Cd and Ni-H2 in aerospace applications. The main advantage is the weight reduction of the battery system. Weight is a major concern in aerospace applications. Also, lithium-ion offer low thermal dissipation, high energy efficiency, and low cell cost. The Onboard battery module for KSLV-I(Korea Space Launch Vehicle) contains 80 Sony US18650 cells configured as 10 strings in parallel, with each string containing 8 series connected cells. This allows to meet voltage and capacity requirements specified for the mission. In this paper design description and specifications of lithium-ion battery developed are presented. Qualification test flow is also shown to make sure the performance in the predicted space environment. Electrical performance was simulated by dedicated program, and verified with electronic load. Lastly, the capacity was proven on real equipment load assembly.

• Journal of Korean Society of Industrial and Systems Engineering
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• v.38 no.4
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• pp.159-167
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• 2015

We consider a wafer lot transfer/release planning problem from semiconductor wafer fabrication facilities to probing facilities with the objective of minimizing the deviation of workload and total tardiness of customers' orders. Due to the complexity of the considered problem, we propose a two-level hierarchical production planning method for the lot transfer problem between two parallel facilities to obtain an executable production plan and schedule. In the higher level, the solution for the reduced mathematical model with Lagrangian relaxation method can be regarded as a coarse good lot transfer/release plan with daily time bucket, and discrete-event simulation is performed to obtain detailed lot processing schedules at the machines with a priority-rule-based scheduling method and the lot transfer/release plan is evaluated in the lower level. To evaluate the performance of the suggested planning method, we provide computational tests on the problems obtained from a set of real data and additional test scenarios in which the several levels of variations are added in the customers' demands. Results of computational tests showed that the proposed lot transfer/planning architecture generates executable plans within acceptable computational time in the real factories and the total tardiness of orders can be reduced more effectively by using more sophisticated lot transfer methods, such as considering the due date and ready times of lots associated the same order with the mathematical formulation. The proposed method may be implemented for the problem of job assignment in back-end process such as the assignment of chips to be tested from assembly facilities to final test facilities. Also, the proposed method can be improved by considering the sequence dependent setup in the probing facilities.

• Journal of Biosystems Engineering
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• v.43 no.4
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• pp.379-385
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• 2018

Purpose: Postharvest handling of onions (harvesting, cleaning, grading, cooling, storing, and transport) should be performed continually to reduce costs and improve quality. The purpose of this study is to a) determine the design parameters and operating conditions of anion auto-dumping that constitutes a key component of the postharvest bulk handling machinery system, and b) to perform a performance test with the auto-dump prototype system. Methods: Kinematic analyses and computer simulations of the auto-dump mechanism were applied to analyze the operating conditions and design parameters. Results: The optimum working condition for the auto-dump was determined from kinetic analyses. In addition, the interaction between the velocity of the hydraulic cylinder and the angular velocity of the auto-dump were analyzed in order to control the bulk handling machinery system. The acting forces and optimum operating conditions of the hydraulic cylinder were determined by analyzing the forces related to the mass of inertia of the auto-dump assembly during rotation. The method of controlling the feeding rate of onions in terms of the uniformity of the stacking pattern and the control of the entire system was better than the two-stage method of controlling the rotational speed of the auto-dump. Based on the performance test with the prototype for the auto-dump, the stacking pattern and rigidity of the system were analyzed. Conclusions: These results would be of great importance in the postharvest bulk handling machinery system for onions.

• Journal of the Korean Society for Aeronautical & Space Sciences
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• v.39 no.6
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• pp.553-558
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• 2011

This paper describes the development and test result of S-band Transmitter flight model(FM) of STSAT-3 by satellite research center(SaTReC), KAIST. The communication sub-system of STSAT-3 is consist of two different frequency band channels, S-band for Telemetry & Command and X-band for mission data. S-band Transmitter(STX) functionally made of modulator, frequency synthesizer, power amp and DC/DC converter. The transmission data is modulated by FSK(Frequency Shift Keying) and the interface between spacecraft sub-module and STX is RS-422 standard method. The FM STX is based on modular design. The RF output power of STX is 1.5W(31.7dBm) and BER of STX is under $1{\times}10^{-5}$ which meets the specification respectively. The FM STX is delivered Spacecraft Assembly, Integration and Test(AIT) level through the completion of functional Test and environmental(vibration, thermal vacuum) Test successfully.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.233-241
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces strictly related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2004.09a
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• pp.211-219
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• 2004

A new alloy definition will be presented concerning increasing demands for the board level reliability of miniaturized interconnections. The damage mechanism for LFBGA components on different board finishes is not quite understood. Further demands from mobile phones are the drop test, characterizing interface performance of different package constructions in relation to decreased pad constructions and therefore interfaces. The paper discusses the characterization of interfaces based on SnPb, SnPbXYZ, SnAgCu and SnAgCuInNd ball materials and SnAgCuInNd as solder paste, the stability after accelerated tests and the description of modified interfaces stric시y related to the assembly conditions, dissolution behavior of finishes on board side and the influence of intermetallic formation. The type of intermetallic as well as the quantity of intermetallics are observed, primaliry the hardness, E modules describing the ability of strain/stress compensation. First results of board level reliability are presented after TCT-40/+150. Improvement steps from the ball formulation will be discussed in conjunction to the implementation of lead free materials. In order to optimize ball materials for area array devices accelareted aging conditions like TCTs were used to analyze the board level reliability of different ball materials for BGA, LFBGA, CSP, Flip Chip. The paper outlines lead-free ball analysis in comparison to conventional solder balls for BGA and chip size packages. The important points of interest are the description of processability related to existing ball attach procedures, requirements of interconnection properties and the knowledge gained the board level reliability. Both are the primary acceptance criteria for implementation. Knowledge about melting characteristic, surface tension depend on temperature and organic vehicles, wetting behavior, electrical conductivity, thermal conductivity, specific heat, mechanical strength, creep and relaxation properties, interactions to preferred finishes (minor impurities), intermetallic growth, content of IMC, brittleness depend on solved elements/IMC, fatigue resistance, damage mechanism, affinity against oxygen, reduction potential, decontamination efforts, endo-/exothermic reactions, diffusion properties related to finishes or bare materials, isothermal fatigue, thermo-cyclic fatigue, corrosion properties, lifetime prediction based on board level results, compatibility with rework/repair solders, rework temperatures of modified solders (Impurities, change in the melting point or range), compatibility to components and laminates.