• 제목/요약/키워드: Assembly structure

검색결과 813건 처리시간 0.025초

Flip Chip Assembly Using Anisotropic Conductive Adhesives with Enhanced Thermal Conductivity

  • Yim, Myung-Jin;Kim, Hyoung-Joon;Paik, Kyung-Wook
    • 마이크로전자및패키징학회지
    • /
    • 제12권1호
    • /
    • pp.9-16
    • /
    • 2005
  • This paper presents the development of new anisotropic conductive adhesives with enhanced thermal conductivity for the wide use of adhesive flip chip technology with improved reliability under high current density condition. The continuing downscaling of structural profiles and increase in inter-connection density in flip chip packaging using ACAs has given rise to reliability problem under high current density. In detail, as the bump size is reduced, the current density through bump is also increased. This increased current density also causes new failure mechanism such as interface degradation due to inter-metallic compound formation and adhesive swelling due to high current stressing, especially in high current density interconnection, in which high junction temperature enhances such failure mechanism. Therefore, it is necessary for the ACA to become thermal transfer medium to improve the lifetime of ACA flip chip joint under high current stressing condition. We developed thermally conductive ACA of 0.63 W/m$\cdot$K thermal conductivity using the formulation incorporating $5 {\mu}m$ Ni and $0.2{\mu}m$ SiC-filled epoxy-bated binder system to achieve acceptable viscosity, curing property, and other thermo-mechanical properties such as low CTE and high modulus. The current carrying capability of ACA flip chip joints was improved up to 6.7 A by use of thermally conductive ACA compared to conventional ACA. Electrical reliability of thermally conductive ACA flip chip joint under current stressing condition was also improved showing stable electrical conductivity of flip chip joints. The high current carrying capability and improved electrical reliability of thermally conductive ACA flip chip joint under current stressing test is mainly due to the effective heat dissipation by thermally conductive adhesive around Au stud bumps/ACA/PCB pads structure.

  • PDF

공동주택 시공표준화를 위한 조립기준면 및 표준마무리재에 관한 연구 (A Study on the Standard Joint Material and Reference Plane for the Standard of Construction in the Apartment)

  • 임석호;박근수;이가경
    • 한국주거학회:학술대회논문집
    • /
    • 한국주거학회 2009년 춘계학술발표대회 논문집
    • /
    • pp.230-235
    • /
    • 2009
  • In our country, the application of the design method of face to face dimension in wall-slab apartment has passed 10 years. So MC design method has fixed in the design step to some degree. In Design and Work Execution of House the exclusive area of the apartment was calculated by face to face dimension. And the term of face to face dimension was known broadly to clients, construction company, etc. But design method of face to face dimension is not to simply extend the room size so far as wall depth in design process but to ensure the actual space should be considered with efficient use and assembly of building components. That is to say, Design method of face to face dimension is not to be defined by design step but to be related with construction and maintenance. However in construction process the point of face to face design method was not understood even now. So the purpose of this study was to extract the effect and question of face to face design method in construction process by survey of actual condition of structure and construction quality, and compare this result with existing construction method. The following project of this study is to survey of actual condition of interior components such as gypsum board, windows & doors etc. Therefore this study is to induce architectural long-life through architectural standardization construction and component's exchange, and, by the subject of the study on Apartment to have design guideline and basis for joining part between Gypsumboard and windows.

  • PDF

A Review on Membranes and Catalysts for Anion Exchange Membrane Water Electrolysis Single Cells

  • Cho, Min Kyung;Lim, Ahyoun;Lee, So Young;Kim, Hyoung-Juhn;Yoo, Sung Jong;Sung, Yung-Eun;Park, Hyun S.;Jang, Jong Hyun
    • Journal of Electrochemical Science and Technology
    • /
    • 제8권3호
    • /
    • pp.183-196
    • /
    • 2017
  • The research efforts directed at advancing water electrolysis technology continue to intensify together with the increasing interest in hydrogen as an alternative source of energy to fossil fuels. Among the various water electrolysis systems reported to date, systems employing a solid polymer electrolyte membrane are known to display both improved safety and efficiency as a result of enhanced separation of products: hydrogen and oxygen. Conducting water electrolysis in an alkaline medium lowers the system cost by allowing non-platinum group metals to be used as catalysts for the complex multi-electron transfer reactions involved in water electrolysis, namely the hydrogen and oxygen evolution reactions (HER and OER, respectively). We briefly review the anion exchange membranes (AEMs) and electrocatalysts developed and applied thus far in alkaline AEM water electrolysis (AEMWE) devices. Testing the developed components in AEMWE cells is a key step in maximizing the device performance since cell performance depends strongly on the structure of the electrodes containing the HER and OER catalysts and the polymer membrane under specific cell operating conditions. In this review, we discuss the properties of reported AEMs that have been used to fabricate membrane-electrode assemblies for AEMWE cells, including membranes based on polysulfone, poly(2,6-dimethyl-p-phylene) oxide, polybenzimidazole, and inorganic composite materials. The activities and stabilities of tertiary metal oxides, metal carbon composites, and ultra-low Pt-loading electrodes toward OER and HER in AEMWE cells are also described.

A Hyper Suprime-Cam View of the Interacting Galaxies of the M81 Group - Structures and Stellar Populations

  • Arimoto, Nobuo;Okamoto, Sakurako
    • 천문학회보
    • /
    • 제42권2호
    • /
    • pp.39.2-39.2
    • /
    • 2017
  • Over the last decade, deep studies of nearby galaxies have led to the discovery of vast stellar envelopes that are often rich in substructure. These components are naturally predicted in models of hierarchical galaxy assembly, and their observed properties place important constraints on the amount, nature, and history of satellite accretion. One of the most effective ways of mapping the peripheral regions of galaxies is through resolved star studies. Using wide-field cameras equipped to 8 m class telescopes, it has recently become possible to extend these studies to systems beyond the Local Group. Located at a distance of 3.6 Mpc, M81 is a prime target for wide-field mapping of its resolved stellar content. In this talk, we present the detailed results from our deep wide-field imaging survey of the M81 group with the Hyper Suprime-Cam (HSC), on the Subaru Telescope. We report on the analysis of the structures, stellar populations, and metallicities of old dwarf galaxies such as NGC3077, IKN, KDG061, as well as young stellar systems such as Arp's Loop and Holmberg IX. Several candidates for yet-undiscovered faint dwarf galaxies and young stellar clumps in the M81 group will also be introduced. The peculiar galaxy NGC3077 has been classified as the irregular galaxy. Okamoto et al. (2015, ApJ 809, L1) discovered an extended halo structure with S-shape elongated tails, obvious feature of tidal interaction. With a help of numerical simulation by Penarrubia et al. (2009, ApJ 698, 222), we will demonstrate that this tidal feature was formed during the latest close encounters between M81, M82, and NGC 3077, which induced star formation in tidally stripped gas far from the main bodies of galaxies. It is not clear whether the latest tidal interaction was the first close encounters of three galaxies. If NGC3077 is still surrounded by the dark matter halo, it implies that NGC3077 has undergone the first tidal stripping by larger companions. Kinematic studies of inter galactic globular clusters and planetary nebulae would tell us the past history of tidal interaction in this group of galaxies.

  • PDF

사출금형의 열접촉 저항을 고려한 성형과정의 열-유동 연계해석 (Thermal-Fluid Coupled Analysis for Injection Molding Process by Considering Thermal Contact Resistance)

  • 손동휘;김경민;박근
    • 대한기계학회논문집A
    • /
    • 제35권12호
    • /
    • pp.1627-1633
    • /
    • 2011
  • 사출금형은 일반적으로 다수개의 부품을 조립하여 제작되며, 특히 성형부(Core/Cavity)가 금형 형판 내부에 조립되는 구조를 갖는다. 이러한 구조로 인해 금형 조립부 경계면에서는 열접촉 저항이 발생하여 금형 내부의 열전달 특성에 영향을 미치게 된다. 최근 금형의 열접촉 저항이 성형부의 온도분포에 미치는 영향을 수치적으로 예측하기 위한 선행연구가 수행되었으며, 본 연구에서는 이에 기반하여 열-유동 연계해석을 적용함으로써 금형 내부의 열접촉 저항이 사출성형시 유동특성에 미치는 영향을 분석 하였다. 상기 해석결과와 실험결과와의 비교분석을 통해 금형의 열접촉 저항을 고려한 열-유동 연계해석이 기존의 해석방법과 비교할 때 사출성형 유동특성을 보다 향상된 신뢰성으로 예측할 수 있음을 확인하였다.

부동 소수점 DSP를 이용한 4kbps EHSX 음성 부호화기의 실시간 구현 (Real-Time Implementation of the EHSX Speech Coder Using a Floating Point DSP)

  • 이인성;박동원;김정호
    • 한국음향학회지
    • /
    • 제23권5호
    • /
    • pp.420-427
    • /
    • 2004
  • 본 논문에서는 선형예측 잔여신호에 대한 하모닉 벡터 여기 코딩과 시간 대역 분리 혼합 코딩을 결합한 4kbps EHSX (Enhanced Harmonic Stochastic Excitation) 음성부호화기 실시간 구현한 내용을 기술한다. 유성음 구간에서는 하모닉 여기 코딩에 무성음 구간에 대해서는 분석-합성 구조의 벡터 여기 코딩을 사용하였으며, 유/무성음이 혼재하는 전이구간에서는 시간 분리 전이 코딩을 사용하였다. 이 음성부호화기 구현을 위해 부동소수점과 고정소수점을 모두 지원하는 DSP인 TMS320C6701을 사용하였고, 연산량을 줄이기 위해 IFFT를 사용한 저 복잡도 정현파 합성법을 사용하여 알고리즘의 최적화를 이루었으며, 복잡도의 문제가 되는 부분을 고정소수점으로 변환한 후 파이프라인을 적용한 핸드 어셈블리 코딩을 하여 구현에서의 최적화를 이루었다. 또한, 메모리의 효율성을 극대화하기 위해 캐쉬 메모리 할당과 데이터를 내부 메모리에 할당하였고 수학 연산의 최적화를 위해 FastRTS67x 라이브러리를 사용하였다. 개발 환경은 DSP EVM 보드를 사용하였으며 음성 신호의 입·출력 확인으로 동작 및 기능을 검증하여 실시간 구현하였다.

보행하중을 받는 건축물 바닥판의 진동해석을 위한 등가 보행하중의 적용 (Application of Equivalent Walking Loads for Vibration Analysis of Building Floor Subjected to Footstep Loadings)

  • 김기철;이동근
    • 한국지진공학회논문집
    • /
    • 제5권5호
    • /
    • pp.35-45
    • /
    • 2001
  • 최근에 넓은 공간이 요구되는 건축물에서는 칸막이 벽과 같은 비구조재의 사용이 감소됨으로써 감쇠효과가 크게 줄어들고 있으며 고강도재료의 사용으로 바닥판 구조물이 유연화, 장경간화 되어가고 있다. 대형집회공간, 쇼핑몰, 사무실 등과 같이 장경간 건축물에서는 사람의 움직임에 의하여 과도한 진동이 발생할 수 있으며 이러한 진동은 건축물의 사용성을 크게 저하시키는 원인이 되고 있다. 바닥판 진동의 주요 진동원 중의 하나가 보행하중이다. 보행하중을 받는 구조물의 진동해석에 있어서 보행하중을 적용하는 일반적인 방법은 한 절점에 보행하중을 연속적으로 가하거나 주기하중으로 이상화된 동적하중을 가하는 것이다. 그러나 이러한 방법은 보행의 이동효과를 고려할 수 없다. 본 논문에서는 실제 바닥판 구조물의 고유진동수와 감쇠비를 평가하였으며 예제 구조물의 효율적인 진동해석을 위하여 보행하중을 적용하였다.

  • PDF

교육공학에 대한 초등교사의 인식 : 메타포 분석을 활용하여 (Awareness of Elementary School Teacher about Educational Technology through metaphor)

  • 홍광표;안영식
    • 수산해양교육연구
    • /
    • 제28권1호
    • /
    • pp.91-105
    • /
    • 2016
  • The purpose of this study was to examine the awareness of elementary teachers about educational technology. Educational technology that is embodied at school was the form of "systemic structure" whose components are complex and exert close mutual influence on one another, rather than of "systemic assembly" that relationship of components were well controlled. A qualitative epistemological method was used to look into educational technology instead of existing empirical ones. Metaphor analysis was utilized among various qualitative research methods to find out what elementary teachers thought of educational technology. Six elementary teachers were asked to draw a picture to describe what came into their mind when they heard term of "educational technology," and they were interviewed in depth to check what their pictures meant. As a result, elementary teachers expressed their point of views about educational technology as "a scientific, technical and systemized instrument to stir up the learning interest and joy of students," "an action to mechanically fit together every part of education(curriculum)," "educational technology as a teaching and learning method," and "an integrated and overall system." This finding seemed to have something to do with media theory, teaching and learning theory and system theory that have been used in educational technology. This study was expected to be significance in that it investigated the way of looking at educational technology in the field, and confirmed the close relationship between theory and practice, and finally provided an opportunity to reflect on the ontological nature and epistemological method of educational technology.

레이저 용접재의 피로수명 향상을 위한 쇼트피닝 영향에 관한 연구 (A Study on the Shot-Peening Effect for Fatigue Life Improvement of Laser Welding Material)

  • ;이현준;정해용;허선철;박원조
    • 한국해양공학회지
    • /
    • 제24권2호
    • /
    • pp.57-61
    • /
    • 2010
  • At present, welding technology is not only emphasized in the development of manufacturing technology but its application is also expanding. In these systems, attempts have been made to use SUS as a high-temperature material for special applications, and in improvements in manufacturing technologies bear watching, together with an increase in the use rate. Specifically, three-dimensional wings are often used for fasteners with the purpose of decreasing the weight (정해용, 2007). However, due to developments in welding technology, there has been a recent tendency to replace existing assembly methods with welding. Specifically, if laser welding techniques are applied, the heat-affected zone can be minimized compared toother welding techniques. However, in the case of these special welding techniques, there is an increase in residual stress, which fatally affects the fatigue life. In order to remove the residual stress and its effect on fatigue life, shot-peening is executed. The intention of this study was to obtain the optimal conditions for shot-peening.

공동주택 시공표준화를 위한 조립기준면 및 표준마무리재에 관한 연구 - 석고보드 마감재와 창호재의 접합부위를 중심으로 - (A Study on the Standard Joint Material and Reference Plane for the Standard of Construction in the Apartment - Joining Part between Gypsumboard and Windows -)

  • 임석호;박근수;이가경
    • 한국주거학회논문집
    • /
    • 제20권4호
    • /
    • pp.31-38
    • /
    • 2009
  • In our country, the application of the design method of face to face dimension in wall-slab apartment has passed 10 years. So MC(Modular Coordination) design method has fixed in the design step to some degree. In Design and Work Execution of House the exclusive area of the apartment was calculated by face to face dimension. And the term of face to face dimension was known broadly to clients, construction company, etc. But design method of face to face dimension is not to simply extend the room size so far as wall depth in design process but to ensure the actual space should be considered with efficient use and assembly of building components. That is to say, Design method of face to face dimension is not to be defined by design step but to be related with construction and maintenance. However in construction process the point of face to face design method was not understood even now. So the purpose of this study was to extract the effect and question of face to face design method in construction process by survey of actual condition of structure and construction quality, and compare this result with existing construction method. The following project of this study is to survey of actual condition of interior components such as gypsum board, windows & doors etc. Therefore this study is to induce architectural long-life through architectural standardization construction and component's exchange, and, by the subject of the study on Apartment to have design guideline and basis for joining part between Gypsumboard and windows.