• 제목/요약/키워드: Assembly load

검색결과 336건 처리시간 0.044초

자동차 조립공정에 대한 작업자세 평가도구의 비교 (Comparison of Evaluation Tools of Work Posture in Automobiles Assembly Process)

  • 서승록
    • 대한인간공학회지
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    • 제25권3호
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    • pp.61-66
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    • 2006
  • Awkward work postures in workshop highly affect on work-related musculoskeletal disorders(WMSDs). Especially, in automobiles assembly process, these awkward work postures of workers may cause serious injury and illness. This study is to compare the performance among the evaluation tools which can measure the work-loads caused by the awkward work postures in automobiles assemble process. RULA, REBA and TVAL(Toyota Verification of Assembly Line) are used as the evaluation tools. The 85 jobs selected in the automobiles assembly process are applied to the three tools and their performances are analyzed after the evaluation of the work-load in each job. Through various measures of performance such as statistical test, DUNCAN test, regression test etc., the tendencies and characteristics among them are analyzed in detail.

타이어 종류 (Wide Base Tire and Dual Tire Assembly)에 따른 아스팔트 포장 반응 평가 (Evaluation of Pavement Responses under Wide Base Tire and Dual Tire Assembly)

  • 조성환;임정혁
    • 한국도로학회논문집
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    • 제16권2호
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    • pp.61-71
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    • 2014
  • PURPOSES : The first generation of wide base tires introduced in the early 1980s was found to cause a significant increase in pavement damage compared to dual-tire assemblies. However, wide base tires have evolved considerably, and a new generation of wide base tire is thought to be comparable to conventional dual tires for pavement damage. A challenge associated with using wide base tires is the accurate quantification of pavement damage induced by these tires. The objective of this study was to investigate the responses of flexible pavement to continuously moving vehicular loading under various tire configurations. METHODS : The comparison of the strain/stress responses of full-depth pavement caused by conventional dual tire assembly and new generation of wide-base tires was performed. The FE model incorporates linear viscoelasticity of asphalt material and continuous moving load using implicit dynamic analysis. RESULTS AND CONCLUSIONS : The result demonstrates that the new wide-base tires caused slightly more fatigue damage and less primary rutting damage in HMA layer than a dual-tire assembly, but caused more secondary rutting damage in subgrade than a dual tire assembly.

유압 호스의 경로 생성 및 피팅 배열각 설계 (Design for Hydraulic Hose Routing Pathes and Fitting Angles)

  • 김연수;김재정
    • 한국CDE학회논문집
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    • 제10권1호
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    • pp.40-48
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    • 2005
  • A hydraulic hose is an important part of the hydraulic system which transmits power using pressurized fluids. It allows relative motion between components at each end of the hose assembly, and it is much easier to route a hose assembly than it is to bend and install a rigid tubing assembly. Unnecessary loads, which drop the hose's pressure capability and shorten service life, depend on a hose-routing. Therefore, the Hydraulic system designers must be aware to consider unnecessary load does not affect the here. For this consideration in an early stage of the design process, CAD system must support the hose assembly routing design function which is to generate routing path and design fitting angle properly. This paper proposes 2 methods. One is to generate curves that are similar to routing paths of the real hose assembly using the energy minimization method and the optimization method. The other is to design fitting angles that are important design elements of a hose assembly using the Parallel Transport Frame. To implement the proposed methods above, commercial CAD software, CATIA has been integrated with our program.

Dynamic Response Measurement of the Head Arm Assembly of a Hard Disk Drive by Numerical Analysis and Experiments

  • Parlapalli, Madhusudhana R;Bin, Gu;Dongwei, Shu;Fujii, Yusaku
    • International Journal of Precision Engineering and Manufacturing
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    • 제9권4호
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    • pp.22-25
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    • 2008
  • The dynamic response of the head arm assembly (HAA) of a hard disk drive to an impact load was obtained from a 3D non-linear finite element model using ANSYS/LS-DYNA and from experiments using a modified levitation mass method (LMM). In the finite element model, the impact load was created by modeling the mass as a rigid body and making it collide with the HAA. The velocity, displacement, acceleration, and inertial force of the mass were then obtained from the time history data of the finite element analysis. In the LMM, a mass that was levitated with an aerostatic linear bearing, and hence encountered negligible friction, was made to collide with the actuator arm, resulting in a dynamic bending test for the arm. During the collision, the Doppler frequency shift of the laser beam reflected from the mass was accurately measured with an optical interferometer. The velocity, displacement, acceleration, and inertial force of the mass were accurately calculated from the measured time-varying Doppler frequency shift. A good correlation between the experimental data and FEA results was observed. The FEA was also used to investigate the dynamic response of the HAA to impact by different masses.

코인된 솔더 범프를 형성시킨 PCB 기판을 이용한 플립 칩 접속 (Flip Chip Assembly on PCB Substrates with Coined Solder Bumps)

  • 나재웅;백경욱
    • 한국마이크로전자및패키징학회:학술대회논문집
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    • 한국마이크로전자및패키징학회 2002년도 추계기술심포지움논문집
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    • pp.21-26
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    • 2002
  • Solder flip chip bumping and subsequent coining processes on PCB were investigated to solve the warpage problem of organic substrates for high pin count flip chip assembly by providing good co-planarity. Coining of solder bumps on PCB has been successfully demonstrated using a modified tension/compression tester with height, coining rate and coining temperature variables. It was observed that applied loads as a function of coined height showed three stages as coining deformation : (1) elastic deformation at early stage, (2) linear increase of applied load, and (3) rapid increase of applied load. In order to reduce applied loads for coining solder bumps on PCB, effects of coining process parameters were investigated. Coining loads for solder bump deformation strongly depended on coining rates and coining temperatures. As coining rates decreased and process temperature increased, coining loads decreased. Among the effect of two factors on coining loads, it was found that process temperature had more significant effect to reduce applied coining loads during the coining process. Lower coining loads were needed to prevent substrate damages such as micro-via failure and build-up dielectric layer thickness change during applying loads. For flip chip assembly, 97Pb/Sn flip chip bumped devices were successfully assembled on organic substrates with 37Pb/Sn coined flip chip bumps.

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고주파 충격에 의한 전자부품 고장 방지 설계 (Designing Electronics for High Frequency Shock)

  • 이종학;강동석;최지호;강영식;이창민
    • 한국소음진동공학회논문집
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    • 제25권10호
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    • pp.700-706
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    • 2015
  • In this study, stability designing electronics mounted on launch vehicle for shock load(low/high frequency band) could be derived. For the low-frequency shock loads, CCA(circuit card assembly) has secured the structural integrity over the best natural frequency techniques. For the high-frequency shock load, the structural integrity could be ensured with applying device such as the insulation pad. When the EAR is applied, insulation effect of part application is good more than whole application.

스냅링 체결 공정 해석 (Finite Element Analysis for Fastening Process of Snap Ring)

  • 류일훈;임영훈
    • 한국자동차공학회논문집
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    • 제17권2호
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    • pp.187-192
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    • 2009
  • A snap ring is a kind of metal spring with open ends which can be installed into a groove to prevent lateral movement. In this study a nonlinear finite element analysis model is developed to simulate the fastening process of a snap ring connecting the constant velocity joint and the transmission. Insert load, disengage load and breakage are three important issues. They are analyzed using the developed model. The load histories of simulations are similar to those of tests and the differences of maximum load are around 10%. Bending of the entire ring and unfolding of the end section are major contributors of the fastening load. The load variations caused by the angular position of spline tooth are about 50%. Breakage is highly sensitive to the position of a snap ring.