• 제목/요약/키워드: Array test

검색결과 813건 처리시간 0.032초

다구치 직교배열을 이용한 평면변형률 장출실험용 금형의 최적설계 (Optimization of the tool geometry of PSST using taguchi's orthogonal matrix)

  • 김영석
    • 대한기계학회논문집A
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    • 제21권12호
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    • pp.2073-2080
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    • 1997
  • Recently, the plane strain puch stretching test(called PSST) has been developed and used successfully in the evaluation of the press formability of automotive steel sheets. In this paper, the optimum punch geometry of the original PSST tool was investigated by the FEM analysis. The puch length, crown and corner radius are chosen to be optimized according to the Taguchi's experiment technique with the $L_4$ orthogonal array.

신드롬 테스트가 용이한 대규모 MOSPLA의 설계 (Syndrome Testable Design for Large MOSPLA's)

  • ;임인칠
    • 대한전자공학회논문지
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    • 제24권3호
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    • pp.527-534
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    • 1987
  • This paper proposes a new syndrome-testable design method for large MOSPLA's. In the conventional syndrome test method, the testing array circuit for testability is added but it has the defect that the circuit gives effect on the normal operation of the basic PLA circuit. Therefore, by adding the shift registers to the product lines of the basic MOSPLA's this defect is eliminated and the number of test patterns is decreased. In order to reduce the number of fault free syndromes to be predetermined, also, one output line, which is connected to all product lines is added. Therefore the number of output lines be observed is decreased. And the analytical method to compute fault free syndromes is presented. By unsing this method, the time and the effort to compute the syndromes are decreased.

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효율적 패턴 인식을 위한 순차적 GHT (The Sequential GHT for the Efficient Pattern Recognition)

  • 김수환;임승민;이규태;이태원
    • 전자공학회논문지B
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    • 제28B권5호
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    • pp.327-334
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    • 1991
  • This paper proposes an efficient method of implementing the generalized Hough transform (GHT), which has been hindered by an excessive computing load and a large memory requirement. The conventional algorithm requires a parameter space of 4 dimensions in detection a rotated, scaled, and translated object in an input image. Prior to the application of GHT to the input image, the proposed method determines the angle of rotation and the scaling factor of the test image using the proportion of the edge components between the reference image and test image. With the rotation angle and the scaling factor already determined, the parameter spaceis to be reduced to a simple array of 2 dimensions by applying the unit GHT only one time. The experiments with the image of airplanes reveal that both of the computing time and the requires memory size are reduced by 95 percent, without any degradatationof accuracy, compared with the conventional GHT algorithm.

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CBGA를 통한 초소형/박형 박막하이브리드 패키지 구현 (Generation of Mini-compacted Thin Film Hybrid Package by Ceramic Ball Grid Array)

  • 김상희
    • 마이크로전자및패키징학회지
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    • 제2권1호
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    • pp.59-68
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    • 1995
  • 박막제조 기술 및 BGA패캐지를 이용하여 Wellcom 2000 system 소요 OCU Board 의 집적화를 구현하였다. 기존 PCB에 실장되는 소자 일부를 2 Channel BGA 패캐지로 모 듈화한 결과 약 1/6로 소형화시킬수 있었으며 8 Channel의 모율화는 현재 진행중인 다층 구조의 제조 기술 개발과 아울러 BGA 패캐지로 실현이 가능하며 1/10로집접화할수 있음을 알수 있었다. 또한 PCB위에 Bare Chip을 실장하여 Wire Bonding 한 COB를 구현하여 CBGGA의 PCB실장과 함께한 모듈을 형성해 보았다. CBGA패캐지에 Ball Shear Test, In Circuit Test 온도 환경주기시험(TCT) 진동시험을 통하여 신뢰성을 입증하였다. 이때 CBGA의 Coplanarity(3.2%) 증진을 위하여 Ceramic Pad에 선택적인 도금 방식을 개발적용 하였다.

6-시그마 기법을 이용한 고속자동피치가변장치 메커니즘 설계 (Mechanism Design of High Speed Automated Pitch Variation Unit by using 6-Sigma Method)

  • 이진환;원윤재;이혁
    • 반도체디스플레이기술학회지
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    • 제7권4호
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    • pp.23-28
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    • 2008
  • A high speed automated pitch variation unit (HAPU) related to semiconductor category sorting movement of the test handler system was developed. In the design process, 'DMADOV' step of 6-Sigma method has been applied. The design result for the desirable pitch variation was a 3:1 reduction rack-pinion and a linkage which are operated by servomotors. The realization and reliability of the mechanism was obtained at the design stage by FEM analysis, and by robust design using Taguchi orthogonal array against weight and deformation. Finally, the validity of the high speed variation mechanism was confirmed via inspection using a high speed camera while performing pitch variation.

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BGA 및 Flip Chip 패키지의 볼전단 특성에 미치는 시험변수의 영향 (Effect of Test Parameter on Ball Shear Properties for BGA and Flip Chip Packages)

  • 구자명;정승부
    • 대한용접접합학회:학술대회논문집
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    • 대한용접접합학회 2005년도 춘계학술발표대회 개요집
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    • pp.19-21
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    • 2005
  • The ball shea. tests for ball grid array (BGA) and flip chip packages were carried out with different displacement rates to find out the optimum condition of the displacement rate for this test. The BGA packages consisted of two different kinds of solder balls (eutectic Sn-37wt.%Pb and Sn-3.5wt.%Ag) and electroplated Au/Ni/Cu substrate, whereas the flip chip package consisted of electroplated Sn-37Pb solder and Cu UBM. The packages were reflowed up to 10 times, or aged at 443 K up to 21 days. The variation of the displacement rate resulted in the variations of the shear properties such as shear force, displacement rate at break, fracture mode and strain rate sensitivity. The increase in the displacement rate led to the increase of the shear force and brittleness of solder joints.

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Development of the Copper Core Balls Electroplated with the Solder of Sn-Ag-Cu

  • Imae, Shinya;Sugitani, Yuji;Nishida, Motonori;kajita, Osamu;Takeuchi, Takao
    • 한국분말야금학회:학술대회논문집
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    • 한국분말야금학회 2006년도 Extended Abstracts of 2006 POWDER METALLURGY World Congress Part2
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    • pp.1207-1208
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    • 2006
  • We developed the copper core ball electroplated with Sn-Ag-Cu of the eutectic composition which used mostly as Pb free solder ball with high reliability. In order to search for the practicality of this developed copper core ball, the evaluation was executed by measuring the initial joint strength of the sample mounted on the substrate and reflowed and by measuring the joint strength of the sample after the high temperature leaving test and the constant temperature and the humidity leaving test. This evaluation was compered with those of the usual other copper core balls electroplated with (Sn,Sn-Ag,Sn-Cu,Sn-Bi) and the Sn-Ag-Cu solder ball.

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플라이휠 에너지 저장 장치용 초고속 전동발전기의 설계 및 특성시험 (Design and Performance Test of High-Speed Motor/Generator for the Flywheel Energy Storage System)

  • 장석명;서진호;최상규
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 1998년도 하계학술대회 논문집 A
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    • pp.272-274
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    • 1998
  • This paper treated the design and performance test of high speed motor/generator used in the flywheel energy storage system. The unique characteristics of the motor in this paper is the it doesn't contain any magnetic material. The field system was constructed by using Halbach array that generates the magnetic field with the permanent magnet only. The armature was also composed of plastic bobbin and winding. This paper shows the design results have a good agreement with the experimental results.

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저온 태양열을 이용한 생물학적 오수 처리 장치 실증 실험 (Field Test for a Biological Nitrogen Treatment System with Low Temperature Solar Thermal Energy)

  • 정모;이동원
    • 한국태양에너지학회 논문집
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    • 제28권2호
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    • pp.34-41
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    • 2008
  • A low-temperature solar thermal system assisting a biological nitrogen treatment reservoir was designed and field-tested. A large tank whose temperature was maintained at about $25-30^{\circ}C$ to enhance the performance of a biological nitrogen treatment process was heated by an array of flat plate solar collectors. Test results revealed that the overall collector efficiency was above 50% for the most cases tested. This high efficiency was possible owing to the relatively low collector temperature that can be traced back to the reservoir temperature. A substantial enhancement in nitrogen treatment was observed as a result of maintaining the reservoir temperature higher.

A Simple Random Signal Generator Employing Current Mode Switched Capacitor Circuit

  • Yamakawa, Takeshi;Suetake, Noriaki;Miki, Tsutomu;Uchino, Eiji;Eguchi, Akihiro
    • 한국지능시스템학회:학술대회논문집
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    • 한국퍼지및지능시스템학회 1993년도 Fifth International Fuzzy Systems Association World Congress 93
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    • pp.865-868
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    • 1993
  • This paper describes a simple random signal generator employing by CMOS analog technology in current mode. The system is a nonlinear dynamical system described by a difference equation, such as x(t+1) = f(x(t)) , t = 0,1,2, ... , where f($.$) is a nonlinear function of x(f). The tent map is used as a nonlinear function to produce the random signals with the uniform distribution. The prototype is implemented by using transistor array devices fabricated in a mass product line. It can be easily realized on a chip. Uniform randomness of the signal is examined by the serial correlation test and the $\chi$2 test.

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