• Title/Summary/Keyword: Array test

Search Result 812, Processing Time 0.025 seconds

Development of Power Conditioning System for Photovoltaic Power Generation Systems (태양광발전용 3kW급 PCS개발)

  • Min, Byoung-Gwon;Ryu, Seung-Pyo;Jeon, Se-Bong;Lee, Bong-Woo;Kim, Nam-Hae
    • 한국신재생에너지학회:학술대회논문집
    • /
    • 2005.06a
    • /
    • pp.123-126
    • /
    • 2005
  • Recently, because of the depletion of fossil fuels and the environmental pollution by using fossil fuels and harmfulness of atomic power plants. the interests concerning new and renewable energy resources are rising increasingly. And of all new and renewable energy sources the PV generation systems are recognized as the most useful and desirable renewable energy source in allowance for installation conditions. In this development, the 3kWp photovoltaic power generation system is realized to verify the performance of the 3kWp PCS developed by Hyundai Heavy Industries Co. (HHI). The photovoltaic array used in this system is composed of 60 modules of 50Wp capacity. The developed system is tested as procedures and items of test regulation recognized by governmen and the experimental results show the excellent electrical characteristics. Now, the 3kWp PCS developed is installed in the PV model house built in HHI plant and is being tested for practical use commercialization.

  • PDF

The Development of Evaluation Process for Dynamic Characteristics of Door Module (자동차용 모듈화 도어의 동특성 평가 시험법 개발)

  • Bae, Chul-Yong;Kim, Chan-Jung;Kwon, Seong-Jin;Lee, Bong-Hyun;Jang, Woon-Sung;Lee, Joon-Woo
    • Proceedings of the Korean Society for Noise and Vibration Engineering Conference
    • /
    • 2007.11a
    • /
    • pp.291-296
    • /
    • 2007
  • This study presents the evaluation process for door module. Its objective evades the resonance generated at module plate due to the operation of window regulator motor. For this study, the design improvement process is composed of experimental methods having three steps. First step is modal analysis at door assembly status for acquisition of dynamic characteristics which are modal frequency and damping. Second step is a vibration experiment to get the test mode considered an efficiency of window regulator motor. Last step is a vibration measurement by the form of $6{\times}6$ array on module plate. A vibration measurement of 6x6 array form can be got to three analysis results which are a transfer path of vibration using cross correlation function, a vibration map using OA level and a contribution by frequency band using coherent output power spectrum on module plate. These results are applied to SDM(structural dynamic modification) for design improvement to get around the resonance on module plate by the excitation of window regulator motor.

  • PDF

Conceptual design and preliminary characterization of serial array system of high-resolution MEMS accelerometers with embedded optical detection

  • Perez, Maximilian;Shkel, Andrei
    • Smart Structures and Systems
    • /
    • v.1 no.1
    • /
    • pp.63-82
    • /
    • 2005
  • This paper introduces a technology for robust and low maintenance cost sensor network capable to detect accelerations below a micro-g in a wide frequency bandwidth (above 1,000 Hz). Sensor networks with such performance are critical for navigation, seismology, acoustic sensing, and for the health monitoring of civil structures. The approach is based on the fabrication of an array of high sensitivity accelerometers, each utilizing Fabry-Perot cavity with wavelength-dependent reflectivity to allow embedded optical detection and serialization. The unique feature of the approach is that no local power source is required for each individual sensor. Instead one global light source is used, providing an input optical signal which propagates through an optical fiber network from sensor-to-sensor. The information from each sensor is embedded onto the transmitted light as an intrinsic wavelength division multiplexed signal. This optical "rainbow" of data is then assessed providing real-time sensing information from each sensor node in the network. This paper introduces the Fabry-Perot based accelerometer and examines its critical features, including the effects of imperfections and resolution estimates. It then presents serialization techniques for the creation of systems of arrayed sensors and examines the effects of serialization on sensor response. Finally, a fabrication process is proposed to create test structures for the critical components of the device, which are dynamically characterized.

An Experimental Study about Tractive Performance of Tracked Vehicle on Deep-sea Soft Sediment Based on Design of Experiment Using Orthogonal Array (직교배열표 실험계획법에 의한 심해 연약지반용 무한궤도차량의 견인성능에 대한 실험적 연구)

  • Choi, Jong-Su;Hong, Sup;Kim, Hyung-Woo;Lee, Tae-Hee
    • Ocean and Polar Research
    • /
    • v.26 no.2
    • /
    • pp.333-339
    • /
    • 2004
  • This paper is concerned with an experimental investigation about tractive performance of a tracked vehicle on extremely soft soil. A tracked vehicle model with principal dimensions of $0.9\;m(L)\;{\times}\;0.75\;m(B)\;{\times}\;0.4\;m(H)$ and the weight of 167 kg was constructed with a pair of driving chain links driven by two AC-servo motors. The tracks are configured with detachable grousers with variable span. Deep seabed was simulated by means of bentonite-water mixture in a soil bin of $6.0\;m(L)\;{\times}\;3.7\;m(B)\;{\times}\;0.7\;m(H)$. Slip of vehicle and driving torque of motor were measured with respect to experimental variables; grouser span, grouser chevron angle, driving speed, drawbar-pull weight, position of center-of-gravity and weight. $L_8$ orthogonal array is adopted for DOE (Design Of Experiment). The effects of experiment variables on traction performance are evaluated.

A Study of Cross Alignment for Increasing the Performance of Small Antenna (소형 안테나의 성능 향상을 위한 직교 배치에 관한 연구)

  • Kim, Jong-Sung;Choi, Kyung;Kim, Jae-Heung
    • Journal of Industrial Technology
    • /
    • v.22 no.B
    • /
    • pp.155-161
    • /
    • 2002
  • As the wireless communications are gradually developed, the higher frequency is demanded and the smaller the size of antenna shall be reduced by the wavelength of the operating frequency. However, the smaller the size of antenna becomes, the less the gain is obtained according to the frequency, so that a new attempt such as an array antenna has been examined to improve the characteristics. Also, for the convenience of communication, the omni-directional property is required. In this paper, two antennas system which is aligned in cross direction in tested and analyzed. The main scope is focused to get an appropriated distance between the two small antennas to get better properties. There are various ways of array arrangement, but in this study, it should be placed on the same PCB for easy implementation and the direction of each antenna are aligned to be a cross($90^{\circ}$) position. The study is carried out by comparing the radiation patterns mainly, and the theoretical expectation and the computer simulation are also executed. The final model is the folded IF-antennas system printed on PCB and the ideal dipole-antenna arrangement in also test to verify the possibility of our implementation. And it is finally proved by measuring experiments.

  • PDF

BGA to CSP to Flip Chip-Manufacturing Issues

  • Caswell, Greg;Partridge, Julian
    • Journal of the Microelectronics and Packaging Society
    • /
    • v.8 no.2
    • /
    • pp.37-42
    • /
    • 2001
  • The BGA package has been the area array package of choice for several years. Recently, the transition has been to finer pitch configurations called Chip Scale Packages (CSP). Several of these package types are available at 0.5 mm pitch. requiring surface mount assemblers to evaluate and optimize various elements of the assembly process. This presentation describes the issues associated with making the transition from BGA to CSP assembly. Areas addressed will include the accuracy of pick and place equipment, printed wiring board lines and spaces, PWB vias, in-circuit test issues, solder paste printing, moisture related factors, rework and reliability. The transition to 0.5 mm pitch requires careful evaluation of the board design, solder paste selection, stencil design and component placement accuracy. At this pitch, ball and board pad diameters can be as small as 0.25 mm and 0.20 mm respectively. Drilled interstitial vias are no longer possible and higher ball count packages require micro-via board technology. The transition to CSP requires careful evaluation of these issues. Normal paste registration and BGA component tolerances can no longer achieve the required process levels and higher accuracy pick and place machines need to be implemented. This presentation will examine the optimization of these critical assembly operations, contrast the challenges at 0.5 mm and also look at the continuation of the process to incorporate smaller pitch flip chip devices.

  • PDF

Bayesian estimation of kinematic parameters of disk galaxies in large HI galaxy surveys

  • Oh, Se-Heon;Staveley-Smith, Lister
    • The Bulletin of The Korean Astronomical Society
    • /
    • v.41 no.2
    • /
    • pp.62.2-62.2
    • /
    • 2016
  • We present a newly developed algorithm based on a Bayesian method for 2D tilted-ring analysis of disk galaxies which operates on velocity fields. Compared to the conventional ones based on a chi-squared minimisation procedure, this new Bayesian-based algorithm less suffers from local minima of the model parameters even with high multi-modality of their posterior distributions. Moreover, the Bayesian analysis implemented via Markov Chain Monte Carlo (MCMC) sampling only requires broad ranges of posterior distributions of the parameters, which makes the fitting procedure fully automated. This feature is essential for performing kinematic analysis of an unprecedented number of resolved galaxies from the upcoming Square Kilometre Array (SKA) pathfinders' galaxy surveys. A standalone code, the so-called '2D Bayesian Automated Tilted-ring fitter' (2DBAT) that implements the Bayesian fits of 2D tilted-ring models is developed for deriving rotation curves of galaxies that are at least marginally resolved (> 3 beams across the semi-major axis) and moderately inclined (20 < i < 70 degree). The main layout of 2DBAT and its performance test are discussed using sample galaxies from Australia Telescope Compact Array (ATCA) observations as well as artificial data cubes built based on representative rotation curves of intermediate-mass and massive spiral galaxies.

  • PDF

SPATIO-SPECTRAL MAXIMUM ENTROPY METHOD: II. SOLAR MICROWAVE IMAGING SPECTROSCOPY

  • Bong, Su-Chan;Lee, Jeong-Woo;Gary Dale E.;Yun Hong-Sik;Chae Jong-Chul
    • Journal of The Korean Astronomical Society
    • /
    • v.38 no.4
    • /
    • pp.445-462
    • /
    • 2005
  • In a companion paper, we have presented so-called Spatio-Spectral Maximum Entropy Method (SSMEM) particularly designed for Fourier-Transform imaging over a wide spectral range. The SSMEM allows simultaneous acquisition of both spectral and spatial information and we consider it most suitable for imaging spectroscopy of solar microwave emission. In this paper, we run the SSMEM for a realistic model of solar microwave radiation and a model array resembling the Owens Valley Solar Array in order to identify and resolve possible issues in the application of the SSMEM to solar microwave imaging spectroscopy. We mainly concern ourselves with issues as to how the frequency dependent noise in the data and frequency-dependent variations of source size and background flux will affect the result of imaging spectroscopy under the SSMEM. We also test the capability of the SSMEM against other conventional techniques, CLEAN and MEM.

Evaluation of a Wafer Transportation Speed for Propulsion Nozzle Array on Air Levitation System (공기 부상방식 이송시스템의 추진 노즐 배치방법에 따른 웨이퍼 이송 속도 평가)

  • Hwang Young-Kyu;Moon In-Ho
    • Transactions of the Korean Society of Mechanical Engineers B
    • /
    • v.30 no.4 s.247
    • /
    • pp.306-313
    • /
    • 2006
  • Automated material handling system is being used as a method to reduce manufacturing cost in the semiconductor and flat panel displays (FPDs) manufacturing process. Those are considering switch-over from the traditional cassette system to single-substrate transfer system to reduce raw materials of stocks in the processing line. In the present study, the wafer transportation speed has been evaluated by numerical and experimental method for three propulsion nozzle array (face, front, rear) in an air levitation system. Test facility for 300 mm wafer was equipped with two control tracks and a transfer track of 1,500mm length. The diameter of propulsion nozzle is 0.8mm and air velocity of wafer propulsion is $50\sim150m/s$. We found that the experimental results of the wafer transportation speed were well agreed with the numerical ones. Namely, the predicted values of the maximum wafer transportation speed are higher than those values of experimental data by 16% and the numerical result of the mean wafer transportation speed is higher than the experimental result within 20%.

Heat Transfer Enhancement by Trapezoid Rod Array in Impinging Jet System (충돌제트계에서 사다리형 로드 배열에 의한 열전달촉진에 관한 연구)

  • Lim, Tae-Su;Kum, Sung-Min
    • Proceedings of the KSME Conference
    • /
    • 2001.11b
    • /
    • pp.260-267
    • /
    • 2001
  • The objective of this study was to investigate the characteristics of jet flow and heat transfer caused by trapezoid rods array in impinging jet system. In this study, trapezoid rods have been set up in front of flat plate to serve as a turbulence promoter. The bottom width of trapezoid rod was W=4, 8mm and oblique angle were $80^{\circ}$. The space from rods to the heating surface was C=1, 2, 4mm, the pitch between each rods was P=30, 40, 50mm, and the distance from nozzle exit to flat plate was H=100, 500mm. This results were compared with the case without trapezoid rods. As a result, when rods are installed in front of the impinging plate, the acceleration of the jet flow and the eddies due to the rods seem to contribute to the heat transfer enhancement. Among test conditions, the heat transfer performance was best for the condition of W=8mm, C=1mm, P=30mm and H/B=10. The maximum heat transfer rate is about 1.9 times larger than that without trapezoid rods.

  • PDF