• Proceedings of the IEEK Conference
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• 2000.06d
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• pp.171-173
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• 2000

In this paper, we present a new interpolation method for the color filter away(CFA). In order to capture color images. typical input devices use a single chip CCD imaging sensor with color filter array. As a result, the single chip CCD does not provide sufficient color resolutions since it arranges different color filters sequentially on a single CCD, resulting in aliasing noise and loss of resolution. In order to reconstruct high quality color images, we propose to use the interpolation algorithm using high order B-splines. Experiments show promising results.

• Journal of the Korean Institute of Telematics and Electronics
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• v.14 no.4
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• pp.1-8
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• 1977

Microprocessor which is opened to the user, not fixed in CPU chip, has been appeared. In this Paper, Microprogram and Mapping Array designed to make functions of NOVA-01 emulate to $\mu$COM-16.

• The Journal of Korean Institute of Communications and Information Sciences
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• v.15 no.10
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• pp.819-828
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• 1990

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.45 no.12
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• pp.8-14
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• 2008

A fully CMOS-integrated carbon nanotube (CNT) sensor array is proposed. After the sensor chip is fabricated in commercial CMOS process, the CNTs network is formed on the top of the fabricated sensor chip through the room-temperature post-CMOS processes. When the resistance of the CNT is changed by the chemical reaction, the read-out circuit in the chip measures the charging time of the $R_{CNT}$-Capacitor. finally the information of measured frequency is converted to a digital code. The CMOS sensor chip was fabricated by standard 0.18um technology and the size of the $8{\times}8$ sensor array is $2mm{\times}2mn$. We have carried out an experiment detecting the biochemical material, glutamate, using this sensor chip. From the experiment the CMOS sensor chip shows the feasibility of sensor for the simultaneous detection of the various target materials.

• 제어로봇시스템학회:학술대회논문집
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• 1987.10b
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• pp.87-90
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• 1987

This paper gives the Sonic Range Finder(SRF) Array which detects the unknown obstacles on the mobile robot's path. This SRF Array gives mobile robot's circumstance information wider, processes and transfers them to the locomotion module to construct the modify path. In this system, 8 pairs of the 40 KHz ultrasonic sensors constitute the SRF Array, including a pair of reference sensors to correct the errors, 4051 analog multiplexer and demultiplexer swtch the sensor with time and 8031-on chip micro computer controls processes the data and communication the others.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.33A no.10
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• pp.186-194
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• 1996

The SliM (sliding memory plane) array processor has been proposed to alleviate disadvantages of existing mesh-connected SIMD(single instruction stream- multiple data streams) array processors, such as the inter-PE(processing element) communication overhead, the data I/O overhead and complicated interconnections. This paper presents the deisgn and implementation of SliM image processor ASIC (application specific integrated circuit) chip consisting of mesh connected 5 X 5 PE. The PE architecture implemented here is quite different from the originally proposed PE. We have performed the front-end design, such as VHDL (VHSIC hardware description language)modeling, logic synthesis and simulation, and have doen the back-end design procedure. The SliM ASIC chip used the VTI 0.8$\mu$m standard cell library (v8r4.4) has 55,255 gates and twenty-five 128 X 9 bit SRAM modules. The chip has the 326.71 X 313.24mil$^{2}$ die size and is packed using the 144 pin MQFP. The chip operates perfectly at 25 MHz and gives 625 MIPS. For performance evaluation, we developed parallel algorithms and the performance results showed improvement compared with existing image processors.

• Journal of Mechanical Science and Technology
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• v.14 no.9
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• pp.997-1004
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• 2000

The experiments were conducted by using water and paraffin slurry to investigate the effect of a chip spacing in the multichip module on the cooling characteristics from an in-line $4{\times}3$ array of discrete heat sources which were flush mounted on the top wall of a channel. The experimental parameters were chip spacing in a multichip module, heat flux of simulated VLSI chip, mass fraction of paraffin slurry, and channel Reynolds number. The removable heat flux at the same chip surface temperature decreased as the chip spacing decreased at the first and fourth rows. The local heat transfer coefficients for the paraffin slurry were larger than those for water, and the chip spacing on the local heat transfer coefficients for paraffin slurry influenced less than that for water. The enhancement factor for paraffin slurry showed the largest value at a mass fraction of 5% regardless of the chip spacing, and the enhancement factors increased as the chip spacing decreased. This means that the paraffin slurry is more effective than water for cooling of the highly integrated multichip module.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.30 no.6
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• pp.518-521
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• 2019

In this paper, an active antenna module operating in the 60 GHz band is designed and fabricated by combining a commercial transmitter chip and patch array antenna. The designed module is composed of an antenna PCB and a PCB with a transmitter chip. The frequency-control and bias-control signals are applied to the transmitter chip, using an Arduino kit. A baseband I/Q signal is also applied to the chip. A ring hybrid balun converts the output of the transmitter module to a single output, which is the output of the transmitter chip that outputs a differential output. The output is delivered to the $2{\times}4$ microstrip patch array antenna PCB as a micro-computer connector. The radiation pattern of the millimeter-wave signal of the final output is compared with the simulation results. The measured radiation patterns of the fabricated active antenna module confirm that the positions of the 3 dB beam width and null point agree well with the simulation results.

• KIEE International Transactions on Electrophysics and Applications
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• v.4C no.4
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• pp.145-148
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• 2004

In this study, a DNA chip with a microelectrode array was fabricated using microfabrication technology. Several probe DNAs consisting of mercaptohexyl moiety at their 5' end were immobilized on the gold electrodes by a DNA arrayer. Then target DNAs were hybridized and reacted with Hoechst 33258, which is a DNA minor groove binder and electrochemically active dye. Linear sweep voltammetry or cyclic voltammetry showed a difference between target DNA and control DNA in the anodic peak current values. It was derived from Hoechst 33258 and concentrated at the electrode surface through association with the formed hybrid. This suggested that this DNA chip could recognize the sequence specific genes.

• Proceedings of the KIEE Conference
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• 2004.07c
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• pp.2125-2127
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• 2004

In this paper, a DNA chip with a microelectrode array was fabricated using microfabrication technology. Several probe DNAs consisting of mercaptohexyl moiety at their 5 end were immobilized on the gold electrodes by DNA arrayer. Then target DNAs were hybridized and reacted with Hoechst 33258, which is a DNA minor groove binder and electrochemically active dye. Linear sweep voltammetry or cyclic voltammetry showed a difference between target DNA and control DNA in the anodic peak current values. It was derived from Hoechst 33258 concentrated at the electrode surface through association with formed hybrid. It suggested that this DNA chip could recognize the sequence specific genes.