• Applied Microscopy
• /
• 제45권4호
• /
• pp.189-194
• /
• 2015

Backside Ar ion milling technique for the preparation of cross-sectional transmission electron microscopy (TEM) specimens, and backside-ion milling combined with focused ion beam (FIB) operation for electron holography were introduced in this paper. The backside Ar ion milling technique offers advantages in preparing cross-sectional specimens having thin, smooth and uniform surfaces with low surface damages. The back-side ion milling combined with the FIB technique could be used to observe the two-dimensional p-n junction profiles in semiconductors with the sample quality sufficient for an electron holography study. These techniques have useful applications for accurate TEM analysis of the microstructure of materials or electronic devices such as arrayed hole patterns, three-dimensional integrated circuits, and also relatively thick layers (> $1{\mu}m$).

• Applied Microscopy
• /
• 제50권
• /
• pp.22.1-22.6
• /
• 2020

In-situ transmission electron microscopy (TEM) holders that employ a chip-type specimen stage have been widely utilized in recent years. The specimen on the microelectromechanical system (MEMS)-based chip is commonly prepared by focused ion beam (FIB) milling and ex-situ lift-out (EXLO). However, the FIB-milled thin-foil specimens are inevitably contaminated with Ga⁺ ions. When these specimens are heated for real time observation, the Ga⁺ ions influence the reaction or aggregate in the protection layer. An effective method of removing the Ga residue by Ar⁺ ion milling within FIB system was explored in this study. However, the Ga residue remained in the thin-foil specimen that was extracted by EXLO from the trench after the conduct of Ar⁺ ion milling. To address this drawback, the thin-foil specimen was attached to an FIB lift-out grid, subjected to Ar⁺ ion milling, and subsequently transferred to an MEMS-based chip by EXLO. The removal of the Ga residue was confirmed by energy dispersive spectroscopy.

• 한국초전도학회:학술대회논문집
• /
• 한국초전도학회 1999년도 High Temperature Superconductivity Vol.IX
• /
• pp.87-90
• /
• 1999

We have studied the annealing effects of 570 (SrTiO$_3$) single crystal substrate and the I-V properties of step-edge junctions after Ar ion milling. YBa$_2Cu_3O_7$ (YBCO) thin films are fabricated on the substrates by using pulsed laser deposition (PLD) and photolithography. The surface of Ar ion milled substrate was characterized with atomic force microscope (AFM) and scanning electron microscope (SEM) images. After the substrate was damaged by milling, the critical current density of YBCO thin films deposited on the substrate was lowered. The annealing of the damaged substrate at about 1000 $^{\circ}C$ recovered the critical current density to that before the milling. Futhermore the annealing helped junction formation due to high quality film and increased the yield rate for the fabrication of high quality step-edge junction.

• 한국표면공학회:학술대회논문집
• /
• 한국표면공학회 2015년도 춘계학술대회 논문집
• /
• pp.143-144
• /
• 2015

Here we report the Ar-ion milling rates of ultrathin Si and GaAs single crystals. The thickness change is measured using convergent beam electron diffraction (CBED) technique with the help of Bloch wave simulation method. This study suggests the experimental procedures to determine the references for an etching rate to reduce a sample thickness or to remove the damaged sample surface using Ar-ion source.

• 대한기계학회논문집
• /
• 제18권8호
• /
• pp.1939-1951
• /
• 1994

This study introduces a new tool breakage detecting technology comprised of an unsupervised neural network combined with adaptive time series autoregressive(AR) model where parameters are estimated recursively at each sampling instant using a parameter adaptation algorithm based on an RLS(Recursive Least Square). Experiment indicates that AR parameters are good features for tool breakage, therefore it can be detected by tracking the evolution of the AR parameters during milling process. an ART 2(Adaptive Resonance Theory 2) neural network is used for clustering of tool states using these parameters and the network is capable of self organizing without supervised learning. This system operates successfully under the wide range of cutting conditions without a priori knowledge of the process, with fast monitoring time.

• 한국초전도학회:학술대회논문집
• /
• 한국초전도학회 2000년도 High Temperature Superconductivity Vol.X
• /
• pp.146-150
• /
• 2000

Two methods have been investigated to fabricate good quality step-edge Josephson junctions on STO, MgO, and LAO single crystal substrates. One is the annealing of substrates at 1050$^{\circ}$C in 1 atmospheric oxygen after Ar-ion milling. The other is the cleaning of step-edge by using Ar ion milling. The step-edge is characterized with atomic force microscope (AFM) images. And YBCO thin films are deposited by using pulsed laser. The I-V properties of step-edge junctions are characterized. The yield rate of step-edge junction is increased by new fabrication methods.

• 한국자기학회:학술대회 개요집
• /
• 한국자기학회 2001년도 춘계연구발표회 논문개요집
• /
• pp.24-25
• /
• 2001

• 한국자기학회지
• /
• 제25권5호
• /
• pp.149-155
• /
• 2015

자성박막의 미세패턴 소자 제작을 위해 전자 사이크로트론 공명(electron cyclotron resonance; ECR) Ar 이온밀링 시스템을 제작하였다. 소자 식각에 적용한 ECR 이온밀링 시스템에서 주파수 2.45 GHz 파장 12.24 cm의 마이크로파 소스인 마그네트론은 전력 600 W에 의해 가동되어 파장의 정수배에 맞추어 만든 도파관을 통하여 전달되도록 설계하였다. 마이크로파 주파수와 공명시키기 위해 전자석으로 908 G의 자기장을 인가하였고, 알곤 개스를 cavity에 유입시켜서 방전된 이온들은 그리드 사이에 인가한 약 1000 V의 가속전압에 의한 에너지를 갖고 표면을 밀링한다. 이것을 이용하여 다층구조 GMR-SV(giant magnetoresistance-spin valve) 자성박막에 광 리소그래피, 이온밀링 및 전극제작 공정과정을 마치고 폭이 $1{\mu}m$에서 $9{\mu}m$까지의 소자들을 제작하여 광학현미경으로 소자 크기를 관찰하였다.

• 한국초전도학회:학술대회논문집
• /
• 한국초전도학회 1999년도 High Temperature Superconductivity Vol.IX
• /
• pp.91-94
• /
• 1999

A new type of high-T$_c$ superconducting Josephson junctions has been prepared by Ar ion beam etching and electron beam lithography. YBa$_2Cu_3O_{7-x}$ (YBCO) films deposited on (001) SrTiO$_3$ single crystal substrate by pulsed laser deposition were patterned by Ar ion milling with photolithography. The narrow slit with a electroresist mask, about 1000 ${\AA}$ wide, was constructed over a 3 ${\sim}$ 5 ${\mu}$m bridge of a 1200-${\AA}$-thick YBCO film by electron beam lithography. The slit was then etched by the Ar ion beam to form a damaged 600-${\AA}$-thick YBCO. Thus prepared structure forms an S-N-S (YBCO - damaged YBCO - YBCO) type Josephson junctions. Those junctions exhibit RSI-like I-V characteristics at 77 K. The properties of the Josephson junctions such as I$_c$ R$_N$, and J$_c$ were characterized.

• 한국정밀공학회지
• /
• 제14권1호
• /
• pp.185-193
• /
• 1997

This paper presents the on-line monitoring of the surface roughness in a face milling operation. The cut- ting force was used to monitor the surface roughness, since the insert run-outs not only deteriorate surface roughness but also change cutting force. AR model and band energy method were taken to extract the fea- tures from the cutting force. The features extracted from AR modelling are more accurate about the moni- toring than those from band energy method, whereas, the computing speed of the former is slow. An artifi- cal neural network discriminated the level of the surface roughness by using the features extracted via signal processing.